JPH0651001Y2 - 光結合素子 - Google Patents

光結合素子

Info

Publication number
JPH0651001Y2
JPH0651001Y2 JP1987088786U JP8878687U JPH0651001Y2 JP H0651001 Y2 JPH0651001 Y2 JP H0651001Y2 JP 1987088786 U JP1987088786 U JP 1987088786U JP 8878687 U JP8878687 U JP 8878687U JP H0651001 Y2 JPH0651001 Y2 JP H0651001Y2
Authority
JP
Japan
Prior art keywords
lead frame
light emitting
light receiving
bonding
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987088786U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63197362U (uk
Inventor
嘉博 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1987088786U priority Critical patent/JPH0651001Y2/ja
Publication of JPS63197362U publication Critical patent/JPS63197362U/ja
Application granted granted Critical
Publication of JPH0651001Y2 publication Critical patent/JPH0651001Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch

Landscapes

  • Die Bonding (AREA)
JP1987088786U 1987-06-08 1987-06-08 光結合素子 Expired - Lifetime JPH0651001Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987088786U JPH0651001Y2 (ja) 1987-06-08 1987-06-08 光結合素子

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987088786U JPH0651001Y2 (ja) 1987-06-08 1987-06-08 光結合素子

Publications (2)

Publication Number Publication Date
JPS63197362U JPS63197362U (uk) 1988-12-19
JPH0651001Y2 true JPH0651001Y2 (ja) 1994-12-21

Family

ID=30947194

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987088786U Expired - Lifetime JPH0651001Y2 (ja) 1987-06-08 1987-06-08 光結合素子

Country Status (1)

Country Link
JP (1) JPH0651001Y2 (uk)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049384A (ja) * 1998-07-29 2000-02-18 Matsushita Electron Corp チップ型発光装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159746A (ja) * 1985-01-08 1986-07-19 Kyodo Printing Co Ltd Ｉｃモジユ−ルのワイヤボンデイング方法
JPS62123727A (ja) * 1985-11-25 1987-06-05 Hitachi Ltd 半導体装置
JPS63219131A (ja) * 1987-03-06 1988-09-12 Nec Yamagata Ltd 半導体装置の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61159746A (ja) * 1985-01-08 1986-07-19 Kyodo Printing Co Ltd Ｉｃモジユ−ルのワイヤボンデイング方法
JPS62123727A (ja) * 1985-11-25 1987-06-05 Hitachi Ltd 半導体装置
JPS63219131A (ja) * 1987-03-06 1988-09-12 Nec Yamagata Ltd 半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000049384A (ja) * 1998-07-29 2000-02-18 Matsushita Electron Corp チップ型発光装置

Also Published As

Publication number Publication date
JPS63197362U (uk) 1988-12-19

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