JPH0650343U - Bonding device - Google Patents

Abstract

(57) [Abstract] [Purpose] To increase the bonding speed by making the tape side of a slide carrier supply type ultrasonic bonding device rotatable so that the bonding direction coincides with the ultrasonic vibration transmission direction. [Structure] A rotatable carrier 5 is provided on a carrier carrier unit 3 for carrying a slide carrier, and a slide carrier 4 is placed on the carrier 5, and X, Y,
An IC chip holder 15 that can move Z and θ and a bonding head 9 that can move XY are provided, and during ultrasonic bonding, the rotation receiving table 5 is rotated to match the bonding direction with the ultrasonic vibration transmission direction.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a carrier tape slide carrier supply type ultrasonic bonding apparatus.

[0002]

[Prior art]

 When the IC chip is ultrasonically bonded to the lead frame, there is a strong causal relationship between the connecting direction and the ultrasonic vibration transmission direction, and the line connecting the two bonding points to be connected and the ultrasonic vibration It is necessary to match the transmission direction. Therefore, conventionally, when ultrasonically bonding an IC chip to a carrier tape mounted on a slide carrier and conveyed, the ultrasonic wave transmission direction is made to coincide with the bonding direction by rotating the bonding head, that is, the ultrasonic horn. Was being done. For example, as shown in FIGS. 3 and 4, as a bonding head mounted on an XY table (not shown), the tip of a frame portion 33 that moves up and down along a slide guide 32 by a vertical movement drive portion 31 rotates by θ. A drive unit 34 is installed, and an ultrasonic horn 37 having a bonding tool 36 at the tip is connected to the θ rotation drive unit 34 via a pressure unit 35, and the ultrasonic horn 37 is rotated during bonding. Was there. However, when the θ rotation mechanism is installed in the bonding head in this way, there is a problem that the bonding speed becomes slow.

[0003]

[Problems to be solved by the device]

 The present invention makes it possible to rotate the tape side in order to make the ultrasonic vibration transmitting direction and the bonding direction coincident with each other when the IC chip is ultrasonically bonded to the carrier tape mounted and transported on the slide carrier. It is an object of the present invention to provide a bonding apparatus capable of increasing the cost.

[0004]

[Means for Solving the Problems]

 The present invention provides a slide carrier supply type ultrasonic bonding apparatus, in which a rotatable pedestal is provided on a carrier transfer unit, and the slide carrier is placed on the rotative pedestal. , Θ is a movable IC chip holder and an XY movable bonding head.

[0005]

[Action]

 An IC chip holder that holds the IC chip when the slide carrier that mounts the carrier tape that has slid the carrier transport path and reached the bonding position is placed on the rotary pedestal and is movable in X, Y, Z, and θ directions. Rises, the IC chip is positioned with respect to the slide carrier on the rotary pedestal, and ultrasonic bonding is performed while rotating the rotary pedestal so that the point to be bonded faces a predetermined direction.

[0006]

【Example】

 An embodiment of the present invention will be described with reference to FIGS. 1 and 2. 1 is a slide carrier supply unit on which a carrier tape is mounted, 2 is a discharge unit, and a carrier carrier for sliding and carrying a slide carrier 4 between them. Unit 3 is deployed. A rotatable pedestal 5 is provided at the bonding position on the carrier transport unit 3 so that the slide carrier 4 to be transported is placed on the rotative pedestal 5. An XY table 6 is provided near the bonding position, and a bonding head 9 equipped with an ultrasonic horn 8 having a bonding tool 7 connected to the tip thereof is mounted. Further, near the bonding position, an IC chip holding table 15 including a holding portion 11 of the IC chip 10, a Z table 12, a θ table 13, and an XY table 14 is provided. In addition, a reel-to-magazine supply unit 23 including a tape reel loader 21 and a tape mount unit 22 for cutting a carrier tape fed from the tape reel and mounting it on a slide carrier is installed in the supply unit 1 in the illustrated example, and a discharge unit. 2 is provided with a magazine 24 for accommodating the bonded tape and an unloader elevator 25 for the same. In the supply section 1, a reel-magazine supply unit 23 and a cassette accommodating the slide carrier on which the tape is mounted are accommodated. A magazine consisting of the gazin 26 and its loader elevator 27 is replaced with a magazine supply unit 28.

Then, the slide carrier 4 on which the carrier tape is mounted is transported by the transport unit 3 and is placed on the rotary pedestal 5 when reaching the bonding position. Next, after the IC chip holding table 15 is raised and the IC chip 10 is positioned, ultrasonic bonding is performed while rotating the rotation receiving table 5 so that the bonding direction becomes a predetermined direction. After the bonding is completed, the IC holding table 15 descends, the slide carrier 4 is conveyed by the conveying unit 3, reaches the discharging section 2, and is accommodated in the magazine 24.

[0008]

[Effect of device]

 As described above, according to the present invention, when ultrasonically bonding a carrier tape mounted on a slide carrier, the tape side is rotated without rotating the bonding head side unlike the conventional case. It is advantageous in terms of bonding speed because there is no need to install a mechanism, and it can handle both reel supply and slide carrier supply simply by exchanging the supply unit in the supply section.

[Brief description of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram of a side surface of FIG.

FIG. 3 is a side view of a conventional bonding head.

FIG. 4 is a plan view of FIG.

[Explanation of symbols]

 1 Supply Part 2 Ejection Part 3 Carrier Transfer Unit 4 Slide Carrier 5 Rotation Receptor 6 XY Table 7 Bonding Tool 8 Ultrasonic Horn 9 Bonding Head 10 IC Chip 11 Holding Part 12 Z Table 13 θ Table 14 XY Table 15 IC Chip Holding Table 21 Tape Reel Loader 22 Tape Mount Unit 23 Reel → Magazine Supply Unit 24 Magazine 25 Unloader Elevator 26 Magazine 27 Loader Elevator 18 Magazine → Magazine Supply Unit 31 Vertical Movement Drive 32 Slide Guide 33 Frame 34 34 θ Rotation Drive 35 Pressure part 36 Bonding tool 37 Ultrasonic horn

Claims (2)

[Scope of utility model registration request] 1. An ultrasonic bonding apparatus of a slide carrier supply system, wherein a rotatable pedestal is provided on a carrier transfer unit, and the slide carrier is placed on the rotative pedestal, and X, Y, Z, A bonding apparatus having an IC chip holder that can move θ and a bonding head that can move XY. 2. The supply section of the carrier transfer unit,
A supply unit including a tape reel loader and a tape mount unit for cutting the carrier tape fed from the tape reel and mounting it on a slide carrier, or a magazine containing the carrier tape mounted on the slide carrier and a supply unit including the loader elevator. The bonding apparatus according to claim 1, wherein the bonding device is arranged so as to be exchangeable.