JPS57159246U - - Google Patents
Info
- Publication number
- JPS57159246U JPS57159246U JP4510681U JP4510681U JPS57159246U JP S57159246 U JPS57159246 U JP S57159246U JP 4510681 U JP4510681 U JP 4510681U JP 4510681 U JP4510681 U JP 4510681U JP S57159246 U JPS57159246 U JP S57159246U
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4510681U JPS57159246U (en) | 1981-03-30 | 1981-03-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4510681U JPS57159246U (en) | 1981-03-30 | 1981-03-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57159246U true JPS57159246U (en) | 1982-10-06 |
Family
ID=29842007
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4510681U Pending JPS57159246U (en) | 1981-03-30 | 1981-03-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57159246U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60161630A (en) * | 1984-02-02 | 1985-08-23 | Toshiba Corp | Positioning device for semiconductor pellet |
JPH0650343U (en) * | 1992-12-14 | 1994-07-08 | 株式会社カイジョー | Bonding device |
-
1981
- 1981-03-30 JP JP4510681U patent/JPS57159246U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60161630A (en) * | 1984-02-02 | 1985-08-23 | Toshiba Corp | Positioning device for semiconductor pellet |
JPH0650343U (en) * | 1992-12-14 | 1994-07-08 | 株式会社カイジョー | Bonding device |