JPS57159246U - - Google Patents

Info

Publication number
JPS57159246U
JPS57159246U JP4510681U JP4510681U JPS57159246U JP S57159246 U JPS57159246 U JP S57159246U JP 4510681 U JP4510681 U JP 4510681U JP 4510681 U JP4510681 U JP 4510681U JP S57159246 U JPS57159246 U JP S57159246U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4510681U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP4510681U priority Critical patent/JPS57159246U/ja
Publication of JPS57159246U publication Critical patent/JPS57159246U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Wire Bonding (AREA)
JP4510681U 1981-03-30 1981-03-30 Pending JPS57159246U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4510681U JPS57159246U (en) 1981-03-30 1981-03-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4510681U JPS57159246U (en) 1981-03-30 1981-03-30

Publications (1)

Publication Number Publication Date
JPS57159246U true JPS57159246U (en) 1982-10-06

Family

ID=29842007

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4510681U Pending JPS57159246U (en) 1981-03-30 1981-03-30

Country Status (1)

Country Link
JP (1) JPS57159246U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161630A (en) * 1984-02-02 1985-08-23 Toshiba Corp Positioning device for semiconductor pellet
JPH0650343U (en) * 1992-12-14 1994-07-08 株式会社カイジョー Bonding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60161630A (en) * 1984-02-02 1985-08-23 Toshiba Corp Positioning device for semiconductor pellet
JPH0650343U (en) * 1992-12-14 1994-07-08 株式会社カイジョー Bonding device

Similar Documents

Publication Publication Date Title
DE3151800C2 (en)
FR2500161B1 (en)
DE8210213U1 (en)
DE8233876U1 (en)
DE3108089C2 (en)
FR2498340B1 (en)
DE3229452C2 (en)
FR2500446B1 (en)
DE3148957C2 (en)
DE3140351C2 (en)
FR2500266B1 (en)
DE3226637C2 (en)
DE3205477C2 (en)
DE3151280C2 (en)
FR2500521B1 (en)
DE3221545C2 (en)
FR2499110B3 (en)
DE3208378C2 (en)
DE3375410D1 (en)
FR2499967B1 (en)
FR2500679B3 (en)
FR2499073B1 (en)
DE3202882C2 (en)
FR2498266B3 (en)
FR2500071B1 (en)