JPH01296634A - Wire bonding device - Google Patents

Abstract

PURPOSE:To enable the wire bonding process to be performed with high precision and at high speed by providing both of a bonding head and a turntable loaded with a specimen with X-Y tables. CONSTITUTION:The title wire bonding device is provided with X-Y tables 2 and 4 respectively for a bonding head 1 and a turntable 3 loaded with a specimen. Thus, the bonding head 1 and the specimen 5 can be shifted to the step positions of the X-Y tables 2, 4 represented by black points and white circles. Furthermore, the bonding head 1 and the specimen 5 can be aligned with each other with the precision of the step by half of the shifting distance of the minimum step of respective X-Y tables 2, 4. Through these procedures, the wire bonding process of minute semiconductor elements can be performed with high precision and at high speed.

Description

[Detailed Description of the Invention] [Summary] Regarding improving the alignment accuracy of a wire bonding device, the present invention is equipped with an X-Y table that can be installed simply and easily, and enables high-precision and high-speed wire bonding. A wire bonding device that has a bonding head and a sample mounted on either an X-Y table or a rotary table, and has a control device that controls the operation of the X-Y table and the rotary table. In this case, an X-Y table is provided under the rotary table.

[Industrial application field]

The present invention relates to a wire bonding device, and particularly to improving the alignment accuracy of a wire bonding device.

In recent years, with the miniaturization of the element forming parts of semiconductor devices, there is a trend toward increasing the number of pins in packages, and there is a demand for improved alignment accuracy and faster wire bonding in the wire bonding process. There is.

Under the above circumstances, there is a demand for a wire bonding device that can perform wire bonding with high accuracy and high speed.

[Conventional technology]

A conventional wire bonding apparatus in which a bonding head is mounted on an X-Y table and a sample is mounted on a rotary table will be described with reference to FIGS. 3 and 4.

As shown in FIG. 3, the bonding pad 11 is
It is mounted on a table 12, and the sample 15 is mounted on a rotating table 13.

The control device 16 controls this X-Y table 12 and rotating table 13.
The bonding rod 11 and the sample 15 are placed in a desired positional relationship.

The minimum step of the moving distance of the X-Y table 12 is 5 μm
The minimum step of the rotation angle of the rotary table 13 is 0.1
It is 125° (360°/3.200 pulses), which is almost the limit as a step for wire bonding work.

On the other hand, semiconductor elements tend to become smaller and semiconductor packages have more pins, so they tend to become larger, and even higher precision is required for positioning during wire bonding.

FIG. 4 is a plan view diagrammatically showing the alignment accuracy between the bonding head of a conventional wire bonding and bonding device and a sample.

As shown in the figure, as the distance from the center of the rotation axis increases, the movement distance on the circumference for the same rotation angle increases, and this movement distance is the distance between the XY table 12 on which the bonding rod 11 is mounted It is absorbed by the movement of

However, the minimum amount of movement of this X-Y table 12 per step is 5μ, as shown by the black circle in the figure.
m, so it is not possible to correct the dimensions in between.

[Problem to be solved by the invention]

In the conventional wire bonding equipment described above,
The minimum step of the moving distance of the X-Y table is 5 μm, and the minimum step of the rotation angle of the rotary table 13 is 0.112.
The angle is 5°, and movement of dimensions smaller than this is not possible, and accurate positioning is required when performing wire bonding between the electrode of a miniaturized semiconductor element and the inner lead of a semiconductor package. The problem is that the movement in the X-Y direction is carried out using the only X-Y table, so the time required for movement is large.
There is a problem in that it takes a long time to assemble a miniaturized semiconductor element into a multi-pin semiconductor package.

SUMMARY OF THE INVENTION The present invention aims to provide a wire bonding apparatus that is equipped with an X-Y table that can be simply and easily installed under the above circumstances, and that can perform wire bonding with high precision and high speed.

[Means to solve the problem]

The above problem is that the bonding head and sample are mounted on either an X-Y table or a rotary table, and
The problem is solved by the wire bonding apparatus according to the present invention, which has a control device for controlling the operations of a table and a rotary table, and includes an X-Y table under the rotary table.

[Effect]

That is, in the present invention, since the bonding head and the rotary table on which the sample is mounted are each equipped with an X-Y table, as shown in FIG. Step movement is now possible, including the step position of the X-Y table, and each
It becomes possible to align the bonding head and the sample with an accuracy of -2/2 the moving distance of the minimum step of the Y table.

〔Example〕

An embodiment of the present invention in which a bonding head is mounted on an X-Y table and a rotary table on which a sample is mounted is also mounted on the X-Y table will be described below with reference to FIG.

As shown in FIG. 1, the main body of the wire bonding apparatus includes a rotary table 3 on which a bonding head 1 and a sample 5 are mounted.
are mounted on the X-Y table 2 and the X-Y table 4, respectively.

The control device 6 controls this X-Y table 2. X-Y table 4
The operation of the rotating table 3 is controlled so that the bonding head 1 and the sample 5 are in a desired positional relationship.

The mutual X between this X-Y table 2 and X-Y table 4
If the steps of the movement distance in the direction and Y direction are shifted by -2/2 of one step, the position of the bonding head and the sample can be adjusted with an accuracy of -2/2 of the movement distance of the minimum step of each X-Y table. Since alignment can be performed and movement is performed using the two X-Y tables 2 and 4, the time required to move the same distance can be halved.

〔Effect of the invention〕

As is clear from the above description, according to the present invention, by providing an X-Y table with an extremely simple structure on both the bonding head and the rotary table on which the sample is mounted, the movement path k of each X-Y table can be adjusted. - half of the minimum step of
It is possible to align the bonding head and the sample with step precision, and it has the advantage of being able to perform wire bonding of miniaturized semiconductor devices with high precision and high speed, making it extremely economical. It is expected to have the effect of improving safety and reliability, and is extremely useful industrially.

[Brief explanation of the drawing]

FIG. 1 is a side view showing the structure of an embodiment according to the present invention, FIG. 2 is a plan view showing the operation of an embodiment according to the present invention, and FIG. 3 is a side view showing the structure of a conventional wire bonding apparatus. FIG. 4 is a plan view showing the operation of a conventional wire bonding device. In the figure, (2) is a bonding head, 2 is an X-Y table, 3 is a rotary table, 4 is an X-Y table, 5 is a sample, and 6 is a control device. FIG. 1 is a side view showing the structure of an embodiment of the present invention. FIG. 2 is a plan view showing the operation of an embodiment of the present invention.

Claims (1)

[Claims] In a wire bonding apparatus that has a bonding head and a sample mounted on either an X-Y table or a rotary table, and has a control device that controls the operation of the X-Y table and the rotary table, the bonding head and the sample are mounted under the rotary table (3). A wire bonding apparatus characterized in that it is equipped with an X-Y table (4).