JPH01296634A - Wire bonding device - Google Patents
Wire bonding deviceInfo
- Publication number
- JPH01296634A JPH01296634A JP63127517A JP12751788A JPH01296634A JP H01296634 A JPH01296634 A JP H01296634A JP 63127517 A JP63127517 A JP 63127517A JP 12751788 A JP12751788 A JP 12751788A JP H01296634 A JPH01296634 A JP H01296634A
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- bonding head
- bonding
- sample
- tables
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 4
- 230000000694 effects Effects 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
ワイヤボンディング装置の位置合わせ精度の向上に関し
、
簡単且つ容易に設けることが可能なX−Yテーブルを具
備した、高精度でかつ高速度のワイヤボンディングが行
えるワイヤボンディング装置の提供を目的とし、
ボンディングヘッドと試料とを、それぞれX −Yテー
ブル及び回転台の何れかに搭載し、X−Yテーブルと回
転台の動作を制御する制御装置を有するワイヤボンディ
ング装置において、回転台の下にX−Yテーブルを具備
するよう構成する。[Detailed Description of the Invention] [Summary] Regarding improving the alignment accuracy of a wire bonding device, the present invention is equipped with an X-Y table that can be installed simply and easily, and enables high-precision and high-speed wire bonding. A wire bonding device that has a bonding head and a sample mounted on either an X-Y table or a rotary table, and has a control device that controls the operation of the X-Y table and the rotary table. In this case, an X-Y table is provided under the rotary table.
本発明は、ワイヤボンディング装置に係り、特にワイヤ
ボンディング装置の位置合わせ精度の向上に関するもの
である。The present invention relates to a wire bonding device, and particularly to improving the alignment accuracy of a wire bonding device.
近年の半導体装置の素子形成部の微細化に伴い、パッケ
ージのピン数が増加する多ピン化の傾向にあり、ワイヤ
ボンディング工程における位置合わせの精度の向上及び
ワイヤポンディングの高速化が要求されている。In recent years, with the miniaturization of the element forming parts of semiconductor devices, there is a trend toward increasing the number of pins in packages, and there is a demand for improved alignment accuracy and faster wire bonding in the wire bonding process. There is.
以上のような状況から高精度でかつ高速度のワイヤポン
ディングが可能なワイヤボンディング装置が要望されて
いる。Under the above circumstances, there is a demand for a wire bonding device that can perform wire bonding with high accuracy and high speed.
ボンディングヘッドがX−Yテーブルに、試料が回転台
に搭載されている、従来のワイヤボンディング装置につ
いて第3図〜第4図により説明する。A conventional wire bonding apparatus in which a bonding head is mounted on an X-Y table and a sample is mounted on a rotary table will be described with reference to FIGS. 3 and 4.
第3図に示すように、ボンディングへラド11はX−Y
テーブル12に搭載され、試料15は回転台13に搭載
されている。As shown in FIG. 3, the bonding pad 11 is
It is mounted on a table 12, and the sample 15 is mounted on a rotating table 13.
制御装置16はこのX−Yテーブル12及び回転台13
の動作を制御し、ボンディングへラド11と試料15と
が所望の位置関係になるようにしている。The control device 16 controls this X-Y table 12 and rotating table 13.
The bonding rod 11 and the sample 15 are placed in a desired positional relationship.
X−Yテーブル12の移動距離の最小ステップは5μm
であり、回転台13の回転角度の最小ステップは0.1
125°(360°/3.200パルス)となっており
、ワイヤボンディング作業を行うためのステップとして
はほぼ限界に達している。The minimum step of the moving distance of the X-Y table 12 is 5 μm
The minimum step of the rotation angle of the rotary table 13 is 0.1
It is 125° (360°/3.200 pulses), which is almost the limit as a step for wire bonding work.
一方、半導体素子は微細化し、半導体パッケージは多ピ
ン化するので大型化する傾向にあり、ワイヤボンディン
グの際の位置合わせには更に高い精度が要求されている
。On the other hand, semiconductor elements tend to become smaller and semiconductor packages have more pins, so they tend to become larger, and even higher precision is required for positioning during wire bonding.
第4図は従来用いられているワイヤボンデ、イング装置
のボンディングヘッドと試料との位置合わせ精度を図式
化した平面図である。FIG. 4 is a plan view diagrammatically showing the alignment accuracy between the bonding head of a conventional wire bonding and bonding device and a sample.
図に示すように、回転軸の中心よりの距離が大きくなる
に従い、同一回転角に対する円周上の移動距離が大きく
なり、この移動距離はボンディングへラド11が搭載さ
れているX−Yテーブル12の移動によって吸収してい
る。As shown in the figure, as the distance from the center of the rotation axis increases, the movement distance on the circumference for the same rotation angle increases, and this movement distance is the distance between the XY table 12 on which the bonding rod 11 is mounted It is absorbed by the movement of
しかしながら、このX−Yテーブル12の最小1ステツ
プ当たりの移動量は図において黒丸で示すように、5μ
mと大きいためにその間の寸法を補正することができな
い。However, the minimum amount of movement of this X-Y table 12 per step is 5μ, as shown by the black circle in the figure.
m, so it is not possible to correct the dimensions in between.
以上説明の従来のワイヤボンディング装置においては、
X−Yテーブルの移動距離の最小ステップは5μmであ
り、回転台13の回転角度の最小ステップは0.112
5°となっており、これ以下の寸法の移動を行うことが
できず、微細化した半導体素子の電極と半導体パッケー
ジのインナーリードとの間のワイヤボンディングを行う
際に、正確な位置決めを行うことができないという問題
点があり、唯一のX−YテーブルによってX−Y方向の
移動を行っているので、移動に要する時間が大となり、
微細化した半導体素子を多ピン化した半導体パッケージ
に組込むのに必要な作業時間が長くなるという問題点が
あった。In the conventional wire bonding equipment described above,
The minimum step of the moving distance of the X-Y table is 5 μm, and the minimum step of the rotation angle of the rotary table 13 is 0.112.
The angle is 5°, and movement of dimensions smaller than this is not possible, and accurate positioning is required when performing wire bonding between the electrode of a miniaturized semiconductor element and the inner lead of a semiconductor package. The problem is that the movement in the X-Y direction is carried out using the only X-Y table, so the time required for movement is large.
There is a problem in that it takes a long time to assemble a miniaturized semiconductor element into a multi-pin semiconductor package.
本発明は以上のような状況から簡単且つ容易に設けるこ
とが可能なX−Yテーブルを具備した、高精度でかつ高
速度のワイヤボンディングが行えるワイヤボンディング
装置の提供を目的としたものである。SUMMARY OF THE INVENTION The present invention aims to provide a wire bonding apparatus that is equipped with an X-Y table that can be simply and easily installed under the above circumstances, and that can perform wire bonding with high precision and high speed.
上記問題点は、ボンディングヘッドと試料とを、それぞ
れX−Yテーブル及び回転台の何れかに搭載し、X−Y
テーブルと回転台の動作を制御する制御装置を有するワ
イヤボンディング装置において、回転台の下にX−Yテ
ーブルを具備する本発明によるワイヤボンディング装置
によって解決される。The above problem is that the bonding head and sample are mounted on either an X-Y table or a rotary table, and
The problem is solved by the wire bonding apparatus according to the present invention, which has a control device for controlling the operations of a table and a rotary table, and includes an X-Y table under the rotary table.
即ち本発明においては、ボンディングヘッド及び試料を
搭載する回転台のそれぞれにX−Yテーブルを具備する
ので、第2図に示すように、黒点で示すX−Yテーブル
のステップ位置と、白丸で示すX−Yテーブルのステッ
プ位置とを含む、ステップの移動が可能になり、各X−
Yテーブルの最小ステップの移動距離の二分の−のステ
ップの精度でボンディングヘッドと試料との位置合わせ
を行うことが可能となる。That is, in the present invention, since the bonding head and the rotary table on which the sample is mounted are each equipped with an X-Y table, as shown in FIG. Step movement is now possible, including the step position of the X-Y table, and each
It becomes possible to align the bonding head and the sample with an accuracy of -2/2 the moving distance of the minimum step of the Y table.
以下第1図によりボンディングヘッドをX−Yテーブル
に搭載し、試料を搭載する回転台をもX−Yテーブルに
搭載した本発明の一実施例について説明する。An embodiment of the present invention in which a bonding head is mounted on an X-Y table and a rotary table on which a sample is mounted is also mounted on the X-Y table will be described below with reference to FIG.
第1図に示すように、ワイヤボンディング装置の本体に
はボンディングヘッド1及び試料5を搭載する回転台3
を、それぞれX−Yテーブル2及びX−Yテーブル4に
搭載している。As shown in FIG. 1, the main body of the wire bonding apparatus includes a rotary table 3 on which a bonding head 1 and a sample 5 are mounted.
are mounted on the X-Y table 2 and the X-Y table 4, respectively.
制御装置6はこのX−Yテーブル2.X−Yテーブル4
及び回転台3の動作を制御し、ボンディングヘッドlと
試料5とが所望の位置関係になるようにしている。The control device 6 controls this X-Y table 2. X-Y table 4
The operation of the rotating table 3 is controlled so that the bonding head 1 and the sample 5 are in a desired positional relationship.
このX−Yテーブル2とX−Yテーブル4との相互のX
方向及びY方向の移動距離のステップを1ステツプの二
分の−だけずらせておくと、各々のX−Yテーブルの最
小ステップの移動距離の二分の−のステップの精度でボ
ンディングヘッドと試料との位置合ねせを行うことが可
能となり、二台のX−Yテーブル2及び4により移動を
行うので、同じ距離の移動時間を二分の−にすることが
可能となる。The mutual X between this X-Y table 2 and X-Y table 4
If the steps of the movement distance in the direction and Y direction are shifted by -2/2 of one step, the position of the bonding head and the sample can be adjusted with an accuracy of -2/2 of the movement distance of the minimum step of each X-Y table. Since alignment can be performed and movement is performed using the two X-Y tables 2 and 4, the time required to move the same distance can be halved.
以上の説明から明らかなように本発明によれば極めて簡
単な構造のX−Yテーブルをボンディングヘッドと試料
を搭載する回転台の両方に具備することにより、各々の
X−Yテーブルの移動路k【の最小ステップの二分の−
のステップの精度で、ボンディングヘッドと試料との位
置合わせを行うことが可能となり、微細化した半導体素
子のワイヤボンディングを高精度かつ高速度で行うこと
が可能となる等の利点があり、著しい経済的及び、信頼
性向上の効果が期待でき工業的には極めて有用なもので
ある。As is clear from the above description, according to the present invention, by providing an X-Y table with an extremely simple structure on both the bonding head and the rotary table on which the sample is mounted, the movement path k of each X-Y table can be adjusted. - half of the minimum step of
It is possible to align the bonding head and the sample with step precision, and it has the advantage of being able to perform wire bonding of miniaturized semiconductor devices with high precision and high speed, making it extremely economical. It is expected to have the effect of improving safety and reliability, and is extremely useful industrially.
第1図は本発明による一実施例の構成を示す側面図、
第2図は本発明による一実施例の作用を示す平面図、
第3図は従来のワイヤボンディング装置の構成を示す側
面図、
第4図は従来のワイヤボンディング装置の作用を示す平
面図、
である。
図において、
■はボンディングヘッド、
2はX−Yテーブル、
3は回転台、
4はX−Yテーブル、
5は試料、
6は制御装置、
を示す。
本発明による一実施例の構成を示す側面図第1図
本発明による一実施例の作用を示す平面図第2図FIG. 1 is a side view showing the structure of an embodiment according to the present invention, FIG. 2 is a plan view showing the operation of an embodiment according to the present invention, and FIG. 3 is a side view showing the structure of a conventional wire bonding apparatus. FIG. 4 is a plan view showing the operation of a conventional wire bonding device. In the figure, (2) is a bonding head, 2 is an X-Y table, 3 is a rotary table, 4 is an X-Y table, 5 is a sample, and 6 is a control device. FIG. 1 is a side view showing the structure of an embodiment of the present invention. FIG. 2 is a plan view showing the operation of an embodiment of the present invention.
Claims (1)
ブル及び回転台の何れかに搭載し、X−Yテーブルと回
転台の動作を制御する制御装置を有するワイヤボンディ
ング装置において、回転台(3)の下にX−Yテーブル
(4)を具備することを特徴とするワイヤボンディング
装置。In a wire bonding apparatus that has a bonding head and a sample mounted on either an X-Y table or a rotary table, and has a control device that controls the operation of the X-Y table and the rotary table, the bonding head and the sample are mounted under the rotary table (3). A wire bonding apparatus characterized in that it is equipped with an X-Y table (4).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63127517A JPH01296634A (en) | 1988-05-25 | 1988-05-25 | Wire bonding device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP63127517A JPH01296634A (en) | 1988-05-25 | 1988-05-25 | Wire bonding device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01296634A true JPH01296634A (en) | 1989-11-30 |
Family
ID=14961970
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP63127517A Pending JPH01296634A (en) | 1988-05-25 | 1988-05-25 | Wire bonding device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01296634A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0650343U (en) * | 1992-12-14 | 1994-07-08 | 株式会社カイジョー | Bonding device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5296868A (en) * | 1976-02-09 | 1977-08-15 | Shinkawa Seisakusho Kk | Method of bonding wires |
-
1988
- 1988-05-25 JP JP63127517A patent/JPH01296634A/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5296868A (en) * | 1976-02-09 | 1977-08-15 | Shinkawa Seisakusho Kk | Method of bonding wires |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0650343U (en) * | 1992-12-14 | 1994-07-08 | 株式会社カイジョー | Bonding device |
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