JPH0650171Y2 - スラッシュ成形用金型冷却装置 - Google Patents
スラッシュ成形用金型冷却装置Info
- Publication number
- JPH0650171Y2 JPH0650171Y2 JP1989105742U JP10574289U JPH0650171Y2 JP H0650171 Y2 JPH0650171 Y2 JP H0650171Y2 JP 1989105742 U JP1989105742 U JP 1989105742U JP 10574289 U JP10574289 U JP 10574289U JP H0650171 Y2 JPH0650171 Y2 JP H0650171Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cooling
- cover
- posture
- demolding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims description 76
- 238000000465 moulding Methods 0.000 title claims description 39
- 239000000463 material Substances 0.000 claims description 50
- 239000000498 cooling water Substances 0.000 claims description 18
- 238000010438 heat treatment Methods 0.000 claims description 18
- 230000003028 elevating effect Effects 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 6
- 230000002265 prevention Effects 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims 1
- 230000036544 posture Effects 0.000 description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- 238000002347 injection Methods 0.000 description 4
- 239000007924 injection Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003566 sealing material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005323 electroforming Methods 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Moulding By Coating Moulds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989105742U JPH0650171Y2 (ja) | 1989-09-08 | 1989-09-08 | スラッシュ成形用金型冷却装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989105742U JPH0650171Y2 (ja) | 1989-09-08 | 1989-09-08 | スラッシュ成形用金型冷却装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0345113U JPH0345113U (cs) | 1991-04-25 |
| JPH0650171Y2 true JPH0650171Y2 (ja) | 1994-12-21 |
Family
ID=31654501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989105742U Expired - Lifetime JPH0650171Y2 (ja) | 1989-09-08 | 1989-09-08 | スラッシュ成形用金型冷却装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0650171Y2 (cs) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0446898Y2 (cs) * | 1987-08-11 | 1992-11-05 |
-
1989
- 1989-09-08 JP JP1989105742U patent/JPH0650171Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0345113U (cs) | 1991-04-25 |
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