JPH0650127Y2 - 化合物半導体ウエハ用研磨機 - Google Patents

化合物半導体ウエハ用研磨機

Info

Publication number
JPH0650127Y2
JPH0650127Y2 JP1987148278U JP14827887U JPH0650127Y2 JP H0650127 Y2 JPH0650127 Y2 JP H0650127Y2 JP 1987148278 U JP1987148278 U JP 1987148278U JP 14827887 U JP14827887 U JP 14827887U JP H0650127 Y2 JPH0650127 Y2 JP H0650127Y2
Authority
JP
Japan
Prior art keywords
polisher
compound semiconductor
polishing machine
semiconductor wafers
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987148278U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6452647U (enrdf_load_stackoverflow
Inventor
敏雄 河西
幸男 曽山
Original Assignee
株式会社小坂研究所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社小坂研究所 filed Critical 株式会社小坂研究所
Priority to JP1987148278U priority Critical patent/JPH0650127Y2/ja
Publication of JPS6452647U publication Critical patent/JPS6452647U/ja
Application granted granted Critical
Publication of JPH0650127Y2 publication Critical patent/JPH0650127Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP1987148278U 1987-09-30 1987-09-30 化合物半導体ウエハ用研磨機 Expired - Lifetime JPH0650127Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987148278U JPH0650127Y2 (ja) 1987-09-30 1987-09-30 化合物半導体ウエハ用研磨機

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987148278U JPH0650127Y2 (ja) 1987-09-30 1987-09-30 化合物半導体ウエハ用研磨機

Publications (2)

Publication Number Publication Date
JPS6452647U JPS6452647U (enrdf_load_stackoverflow) 1989-03-31
JPH0650127Y2 true JPH0650127Y2 (ja) 1994-12-21

Family

ID=31419451

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987148278U Expired - Lifetime JPH0650127Y2 (ja) 1987-09-30 1987-09-30 化合物半導体ウエハ用研磨機

Country Status (1)

Country Link
JP (1) JPH0650127Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6452647U (enrdf_load_stackoverflow) 1989-03-31

Similar Documents

Publication Publication Date Title
TW429462B (en) Manufacturing method and processing device for semiconductor device
JPH044743B2 (enrdf_load_stackoverflow)
JPH09267257A (ja) ウェハ研磨装置
JP2001353656A (ja) 積重ね研磨パッド
JPH0650127Y2 (ja) 化合物半導体ウエハ用研磨機
TWI285575B (en) Polishing method
JP2000334655A (ja) Ｃｍｐ加工装置
US6086464A (en) CMP platen plug
JP2001009710A (ja) ウエーハ研磨装置
JPS6233319Y2 (enrdf_load_stackoverflow)
JP2002036079A (ja) 被研磨物の研磨方法及び研磨装置
JPH08192353A (ja) 半導体ウェーハの研磨装置およびその製造方法
JP2002307308A (ja) ケミカルマシンポリッシャの研磨盤用研磨ドレッサ
CN110722456A (zh) 一种抛光垫修整设备和方法
JPS6397454U (enrdf_load_stackoverflow)
JP2000015559A (ja) ウェーハ研磨装置
KR100494145B1 (ko) 화학기계적 연마장치 및 그를 이용한 웨이퍼 연마방법
JPH09277157A (ja) 研磨布の目立て装置
JP3006915U (ja) 卓上ドリル研磨機のシンニング装置
JPS6150631U (enrdf_load_stackoverflow)
JP2000198066A (ja) Ｃｍｐ研磨装置
KR980005761A (ko) 반도체 소자의 제조방법
JPH0230211Y2 (enrdf_load_stackoverflow)
JPH075800Y2 (ja) 床面ポリッシャー
JPH09199454A (ja) シリコンウエハ加工方法および加工装置