JPH0648840Y2 - 半導体製造装置 - Google Patents

半導体製造装置

Info

Publication number
JPH0648840Y2
JPH0648840Y2 JP1987075697U JP7569787U JPH0648840Y2 JP H0648840 Y2 JPH0648840 Y2 JP H0648840Y2 JP 1987075697 U JP1987075697 U JP 1987075697U JP 7569787 U JP7569787 U JP 7569787U JP H0648840 Y2 JPH0648840 Y2 JP H0648840Y2
Authority
JP
Japan
Prior art keywords
nozzle
lead frame
edge
molten solder
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987075697U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63185230U (enExample
Inventor
五郎 池上
Original Assignee
関西日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 関西日本電気株式会社 filed Critical 関西日本電気株式会社
Priority to JP1987075697U priority Critical patent/JPH0648840Y2/ja
Publication of JPS63185230U publication Critical patent/JPS63185230U/ja
Application granted granted Critical
Publication of JPH0648840Y2 publication Critical patent/JPH0648840Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1987075697U 1987-05-19 1987-05-19 半導体製造装置 Expired - Lifetime JPH0648840Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987075697U JPH0648840Y2 (ja) 1987-05-19 1987-05-19 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987075697U JPH0648840Y2 (ja) 1987-05-19 1987-05-19 半導体製造装置

Publications (2)

Publication Number Publication Date
JPS63185230U JPS63185230U (enExample) 1988-11-29
JPH0648840Y2 true JPH0648840Y2 (ja) 1994-12-12

Family

ID=30922084

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987075697U Expired - Lifetime JPH0648840Y2 (ja) 1987-05-19 1987-05-19 半導体製造装置

Country Status (1)

Country Link
JP (1) JPH0648840Y2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2770361B2 (ja) * 1989-01-06 1998-07-02 松下電器産業株式会社 ダイボンディング装置
WO2010018674A1 (ja) * 2008-08-14 2010-02-18 日立金属株式会社 溶融金属の供給筒、その供給筒が組み込まれた溶融金属の供給装置及び溶融金属の供給方法

Also Published As

Publication number Publication date
JPS63185230U (enExample) 1988-11-29

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