JPH0648831Y2 - 基板冷却装置用パッド - Google Patents
基板冷却装置用パッドInfo
- Publication number
- JPH0648831Y2 JPH0648831Y2 JP2626985U JP2626985U JPH0648831Y2 JP H0648831 Y2 JPH0648831 Y2 JP H0648831Y2 JP 2626985 U JP2626985 U JP 2626985U JP 2626985 U JP2626985 U JP 2626985U JP H0648831 Y2 JPH0648831 Y2 JP H0648831Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- pad
- laminate
- front surface
- cooling plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 34
- 238000001816 cooling Methods 0.000 title claims description 25
- 239000002184 metal Substances 0.000 claims description 19
- 229910052751 metal Inorganic materials 0.000 claims description 19
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 12
- 239000010408 film Substances 0.000 description 12
- 229920001971 elastomer Polymers 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229920000049 Carbon (fiber) Polymers 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920002379 silicone rubber Polymers 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2626985U JPH0648831Y2 (ja) | 1985-02-27 | 1985-02-27 | 基板冷却装置用パッド |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2626985U JPH0648831Y2 (ja) | 1985-02-27 | 1985-02-27 | 基板冷却装置用パッド |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS61145276U JPS61145276U (enrdf_load_stackoverflow) | 1986-09-08 |
JPH0648831Y2 true JPH0648831Y2 (ja) | 1994-12-12 |
Family
ID=30522118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2626985U Expired - Lifetime JPH0648831Y2 (ja) | 1985-02-27 | 1985-02-27 | 基板冷却装置用パッド |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0648831Y2 (enrdf_load_stackoverflow) |
-
1985
- 1985-02-27 JP JP2626985U patent/JPH0648831Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS61145276U (enrdf_load_stackoverflow) | 1986-09-08 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5885469A (en) | Topographical structure of an electrostatic chuck and method of fabricating same | |
KR101559947B1 (ko) | 정전 척 및 그 제조방법 | |
JP3297771B2 (ja) | 半導体製造装置 | |
JP3208029B2 (ja) | 静電チャック装置およびその作製方法 | |
TW201118977A (en) | Plasma processing apparatus and plasma processing method | |
JPH06326181A (ja) | 半導体ウエハの冷却装置及びその冷却方法 | |
JP3271352B2 (ja) | 静電チャック及びその作製方法並びに基板処理装置及び基板搬送装置 | |
JPH04226056A (ja) | 電子コンポーネント用ヒート・シンク | |
JP2521471B2 (ja) | 静電吸着装置 | |
JPH0648831Y2 (ja) | 基板冷却装置用パッド | |
JPS62193141A (ja) | ウエハ−保持機構 | |
JPH0521585A (ja) | 静電吸着装置 | |
US4297190A (en) | Method for removing heat from a workpiece during processing in a vacuum chamber | |
JPH0418197Y2 (enrdf_load_stackoverflow) | ||
JPH0790582A (ja) | 基板保持装置 | |
US5441599A (en) | Lightly doped drain etch method for semiconductor manufacture | |
JPS61104648A (ja) | 基板の冷却装置 | |
JPS61197500A (ja) | 基板の冷却装置 | |
JP2001068427A (ja) | 基板冷却装置 | |
JPS63131519A (ja) | ドライエツチング装置 | |
JPS622632A (ja) | 静電吸着装置 | |
JP7670316B2 (ja) | 静電チャック、基板固定装置 | |
JPH089162Y2 (ja) | 基板保持装置 | |
JPS626138Y2 (enrdf_load_stackoverflow) | ||
JPH0228247B2 (enrdf_load_stackoverflow) |