JPH0648674Y2 - ジヤンパーチツプ - Google Patents
ジヤンパーチツプInfo
- Publication number
- JPH0648674Y2 JPH0648674Y2 JP10537689U JP10537689U JPH0648674Y2 JP H0648674 Y2 JPH0648674 Y2 JP H0648674Y2 JP 10537689 U JP10537689 U JP 10537689U JP 10537689 U JP10537689 U JP 10537689U JP H0648674 Y2 JPH0648674 Y2 JP H0648674Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- jumper chip
- insulating base
- conductive layer
- overcoat layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 18
- 229910000679 solder Inorganic materials 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10537689U JPH0648674Y2 (ja) | 1989-09-11 | 1989-09-11 | ジヤンパーチツプ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10537689U JPH0648674Y2 (ja) | 1989-09-11 | 1989-09-11 | ジヤンパーチツプ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0344818U JPH0344818U (en:Method) | 1991-04-25 |
| JPH0648674Y2 true JPH0648674Y2 (ja) | 1994-12-12 |
Family
ID=31654138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10537689U Expired - Lifetime JPH0648674Y2 (ja) | 1989-09-11 | 1989-09-11 | ジヤンパーチツプ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648674Y2 (en:Method) |
-
1989
- 1989-09-11 JP JP10537689U patent/JPH0648674Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0344818U (en:Method) | 1991-04-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0648674Y2 (ja) | ジヤンパーチツプ | |
| JP2528326B2 (ja) | 回路基板に対するコンデンサの取付方法 | |
| JPH05102621A (ja) | 導電パターン | |
| JPH01135663U (en:Method) | ||
| JP3003062U (ja) | プリント基板 | |
| JPH05121261A (ja) | チツプ部品およびチツプ部品取付構造 | |
| JPH02120866U (en:Method) | ||
| JPH0547442Y2 (en:Method) | ||
| JPS5910768Y2 (ja) | プリント基板 | |
| JPS61183566U (en:Method) | ||
| JPH06112623A (ja) | プリント配線板 | |
| JPH073661Y2 (ja) | プリント基板 | |
| JPH0642364Y2 (ja) | 回路ブロツクの構造 | |
| JPH0749823Y2 (ja) | 回路基板 | |
| JPS61107791A (ja) | 印刷配線板 | |
| JPH062721U (ja) | チップled | |
| JPH0445274Y2 (en:Method) | ||
| JPS59101460U (ja) | 電子部品の接地構造 | |
| JPS61183994A (ja) | カメラ用プリント回路基板 | |
| JPH0510391Y2 (en:Method) | ||
| JPS59123365U (ja) | 回路装置 | |
| JPH0323968U (en:Method) | ||
| JPS59195767U (ja) | 印刷配線板のパタ−ン形状 | |
| JPS62162873U (en:Method) | ||
| JP2001068811A (ja) | 階層式プリント基板の接続構造 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |