JPH064634Y2 - 電子回路装置 - Google Patents

電子回路装置

Info

Publication number
JPH064634Y2
JPH064634Y2 JP1988026616U JP2661688U JPH064634Y2 JP H064634 Y2 JPH064634 Y2 JP H064634Y2 JP 1988026616 U JP1988026616 U JP 1988026616U JP 2661688 U JP2661688 U JP 2661688U JP H064634 Y2 JPH064634 Y2 JP H064634Y2
Authority
JP
Japan
Prior art keywords
metal
ceramic substrate
metal plate
circuit device
electronic circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988026616U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01130592U (enExample
Inventor
盛由 嶋田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP1988026616U priority Critical patent/JPH064634Y2/ja
Publication of JPH01130592U publication Critical patent/JPH01130592U/ja
Application granted granted Critical
Publication of JPH064634Y2 publication Critical patent/JPH064634Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
JP1988026616U 1988-02-29 1988-02-29 電子回路装置 Expired - Lifetime JPH064634Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988026616U JPH064634Y2 (ja) 1988-02-29 1988-02-29 電子回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988026616U JPH064634Y2 (ja) 1988-02-29 1988-02-29 電子回路装置

Publications (2)

Publication Number Publication Date
JPH01130592U JPH01130592U (enExample) 1989-09-05
JPH064634Y2 true JPH064634Y2 (ja) 1994-02-02

Family

ID=31248405

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988026616U Expired - Lifetime JPH064634Y2 (ja) 1988-02-29 1988-02-29 電子回路装置

Country Status (1)

Country Link
JP (1) JPH064634Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022244065A1 (ja) * 2021-05-17 2022-11-24 三菱電機株式会社 半導体装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55127044A (en) * 1979-03-26 1980-10-01 Hitachi Ltd Electric circuit substrate and its manufacture

Also Published As

Publication number Publication date
JPH01130592U (enExample) 1989-09-05

Similar Documents

Publication Publication Date Title
JP3376971B2 (ja) セラミック電子部品
KR950024311A (ko) 얇은 회로기판과 반도체 장치가 접합되어 있는 열전도성 지지부재를 갖춘 전자 패키지
US11749589B2 (en) Module
JPH05304247A (ja) 樹脂封止型半導体装置
JPWO2007110985A1 (ja) 複合基板及び複合基板の製造方法
JP2698278B2 (ja) 混成集積回路装置
JPH07111380A (ja) 表面実装用電子部品
JP2566341B2 (ja) 半導体装置
JPS62113452A (ja) パワ−半導体装置
JPWO2023127725A5 (enExample)
JPH11126795A (ja) 実装基板およびその製造方法ならびに電子部品の実装方法
CN1371126A (zh) 半导体模块及其制造方法
JPH01168045A (ja) 気密封止回路装置
JPH01106451A (ja) 半導体装置
JP5708489B2 (ja) 互いに絶縁された金属性の電源側およびグランド側補強部材を有する半導体装置
JP2000124578A (ja) ハイブリッドモジュール及びその製造方法
JPH04287952A (ja) 複合絶縁基板およびそれを用いた半導体装置
JP2651853B2 (ja) 電子装置
JP3085031B2 (ja) チップ型セラミック電子部品
JPH10154857A (ja) フレキシブルプリント回路基板装置
JP3170004B2 (ja) セラミック回路基板
JP3847219B2 (ja) 配線基板
JPH06333773A (ja) チップ型電子部品
JP2003007899A (ja) 半導体装置及びその製造方法
JP2532400Y2 (ja) ハイブリットｉｃ