JPH0646014Y2 - Light emitting display - Google Patents
Light emitting displayInfo
- Publication number
- JPH0646014Y2 JPH0646014Y2 JP1988103719U JP10371988U JPH0646014Y2 JP H0646014 Y2 JPH0646014 Y2 JP H0646014Y2 JP 1988103719 U JP1988103719 U JP 1988103719U JP 10371988 U JP10371988 U JP 10371988U JP H0646014 Y2 JPH0646014 Y2 JP H0646014Y2
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting display
- light
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Description
【考案の詳細な説明】 ［産業上の利用分野］ 本考案は、発光ダイオード（LED）を用いたドットマト
リックスタイプの発光表示装置の改良に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to an improvement of a dot matrix type light emitting display device using a light emitting diode (LED).
［従来の技術］ 発光表示装置としては、第４図に示すように、例えば、
発光ドット100…を８×８のマトリックス状に配列形成
した発光表示板101…を縦横に複数枚つなぎ合わせて表
示面102を形成し、該表示面102の背後に発光駆動回路を
実装したプリント基板103が取り付けられ、外部コント
ローラ（CPUで構成される）のプログラムに従って、発
光ドット100…内のLEDチップ（図示せず）等の発光素子
をＸ−Ｙのダイナミック点灯制御することにより、所望
の文字、図形、記号等の表示パターンの流れ表示などが
できるものがある。[Prior Art] As a light emitting display device, as shown in FIG.
A printed circuit board in which a plurality of light emitting display plates 101 ... In each of which the light emitting dots 100 are arranged in a matrix of 8 × 8 are connected vertically and horizontally to form a display surface 102, and a light emitting drive circuit is mounted behind the display surface 102. 103 is attached, and according to a program of an external controller (composed of a CPU), a light emitting element such as an LED chip (not shown) in the light emitting dot 100 ... There are some that can display the flow of display patterns such as figures, symbols, and the like.
［考案が解決しようとする課題］ しかしながら上記の発光表示装置では、所望の文字、図
形、記号等の表示時にはLEDチップの発熱を伴うため、
特に上層付近の発光表示板101…の背面では暖められた
空気の上昇によって高温になり易く、該発光表示板101
内の発光ドット100内のLEDチップ自体の温度が上昇して
特性に悪影響を受け、輝度低下など、寿命が短くなって
交換回数も増えるといった問題や、プリント基板103上
に取着された電子部品（図示せず）の温度も上昇し、該
電子部品の電気的特性に影響を与えるといった問題があ
る。そのため、上記発光表示装置では、適所にファン
（図示せず）を設け、LEDチップの発熱によって暖めら
れた空気を強制的に循環、排気させて冷却させている。
しかし、上記ファンの取り付けも一箇所程度であり、空
気の循環も第５図に矢印で示すように、プリント基板の
表面に沿って行なわれるだけで、それほど活発に行なわ
れず。どうしても発光表示板100の上層付近での温度上
昇は免れず、LEDチップやプリント基板103上の電子部品
の寿命低下が避けられないといった問題があった。[Problems to be Solved by the Invention] However, in the above-described light emitting display device, the LED chips generate heat when displaying desired characters, figures, symbols, etc.,
Especially on the back surface of the light emitting display panel 101 near the upper layer, the temperature of the light emitting display panel 101 easily rises due to the rise of warmed air.
The temperature of the LED chip itself inside the light emitting dot 100 inside is adversely affected to the characteristics, the brightness is reduced, the life is shortened and the number of times of replacement is increased, and the electronic components mounted on the printed circuit board 103. There is a problem that the temperature of (not shown) also rises and affects the electrical characteristics of the electronic component. Therefore, in the above-described light emitting display device, a fan (not shown) is provided at an appropriate place to forcibly circulate and exhaust the air warmed by the heat generation of the LED chip to cool it.
However, the above-mentioned fan is attached only in one place, and the air circulation is performed only along the surface of the printed circuit board, as shown by the arrow in FIG. 5, and not so actively. There is a problem inevitably that the temperature rise near the upper layer of the light emitting display board 100 is unavoidable, and the life of the electronic components on the LED chip and the printed circuit board 103 is shortened.
［課題を解決するための手段］ 上記課題を解決するために、本考案の発光表示装置は、
表面に発光ダイオードを用いた発光ドットがマトリック
ス状に配列形成された発光表示板を縦横につなぎ合わせ
て表示面を形成し、該発光面背後に発光駆動回路を実装
したプリント基板を取り付けた発光表示装置において、
上記プリント基板に複数の放熱用貫通孔を穿孔したこと
を特徴とする。[Means for Solving the Problems] In order to solve the above problems, the light emitting display device of the present invention is
A light-emitting display in which a light-emitting display plate on the surface of which light-emitting dots using light-emitting diodes are arranged in a matrix is connected vertically and horizontally to form a display surface, and a printed circuit board mounted with a light-emitting drive circuit is attached behind the light-emitting surface. In the device,
It is characterized in that a plurality of through holes for heat dissipation are formed in the printed circuit board.
［作用］ 上記構成の発光表示装置では、発光ドットのLEDチップ
の発熱によって温度が高くなった空気は、発光駆動回路
用プリント基板の表面に沿って上昇しながら循環すると
共に、このプリント基板に穿孔された放熱用貫通孔を通
ってプリント基板の裏面に向かって空気の対流が起こ
る。そのため、空気が活発に循環されるので、特に発光
表示装置上層部分での空気の温度上昇が緩和できる。[Operation] In the light emitting display device having the above configuration, the air whose temperature has risen due to the heat generated by the LED chip of the light emitting dot circulates while rising along the surface of the printed circuit board for the light emission drive circuit and perforating the printed circuit board. Convection of air occurs toward the back surface of the printed circuit board through the radiated through holes. Therefore, since the air is actively circulated, the temperature rise of the air can be moderated especially in the upper layer portion of the light emitting display device.
［実施例］ 以下、図面を参照して本考案の一実施例を説明する。[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.
第１図は本考案の一実施例にかかる発光表示装置の一部
破断斜視図であり、第２図は同実施例のＩ−Ｉ断面図で
ある。FIG. 1 is a partially cutaway perspective view of a light emitting display device according to an embodiment of the present invention, and FIG. 2 is a sectional view taken along line I-I of the same embodiment.
この実施例の発光表示装置は、表面に発光ドット１…
を、例えば、８×８のマトリックス状に配列形成した発
光表示板２…を縦横に複数枚つなぎ合わせて表示面３を
形成している。上記各発光表示体２…はその裏面の電極
ピン４…を、表示面３背後に配設されて電子部品（図示
せず）等が搭載された駆動回路用プリント基板５のピン
挿通孔（図示せず）に挿入して半田付け固定等して接続
してある。該プリント基板５の背後にはさらに別の電子
部品（図示せず）等が搭載されて駆動回路等が形勢され
たプリント基板６が配設されており、上記プリント基板
5,6の配線パターンが形成されていない部分に放熱用の
貫通孔７…が穿孔されている。この貫通孔７は、後述す
る空気の循環とプリント基板5,6に形成されている配線
パターン等を考慮して、直径は約2mm以上とし、一枚の
発光表示板２に対応するプリント基板5,6に少なくとも
１〜２箇所、好ましくは４箇所以上穿孔し、開口率とし
て１％以上となるように穿孔することが望ましい。この
場合、プリント基板５、６の部品実装、回路パターンを
損なわないよう余分なスペースに穿孔すればよい。そし
て上記プリント基板5,6の駆動回路等は外部のコントロ
ーラ（図示せず）に接続され、所望の文字、図形、記号
等の表示パターンの流れ表示などが表示面３に形成でき
るようになっている。In the light emitting display device of this embodiment, the light emitting dots 1 ...
, A plurality of light-emitting display plates 2 ... Are arranged in a matrix of 8 × 8, and are vertically and horizontally joined together to form a display surface 3. Each of the above-mentioned light-emitting display bodies 2 ... Has a pin insertion hole (shown in the figure) on the back surface of the drive circuit printed circuit board 5 on which the electronic pins (not shown) are mounted behind the display surface 3. It is inserted into (not shown) and fixed by soldering and connected. Behind the printed circuit board 5, a printed circuit board 6 on which other electronic components (not shown) and the like are mounted and a drive circuit and the like are arranged is disposed.
Through holes 7 for heat dissipation are formed in the portions where the wiring patterns 5 and 6 are not formed. This through hole 7 has a diameter of about 2 mm or more in consideration of the circulation of air, which will be described later, and the wiring patterns formed on the printed circuit boards 5, 6, and the printed circuit board 5 corresponding to one light emitting display board 2 is provided. It is desirable that at least 1 to 2 places, preferably 4 or more places are perforated in 6 and 6, so that the aperture ratio is 1% or more. In this case, it suffices to punch holes in an extra space so as not to impair the component mounting of the printed boards 5 and 6 and the circuit pattern. The drive circuits of the printed circuit boards 5 and 6 are connected to an external controller (not shown) so that a desired display pattern such as characters, figures, symbols can be displayed on the display surface 3. There is.
上記発光表示板２…は、例えば第２図に示すような構造
を備えている。即ち、表示体基板８をガラスエポキシ樹
脂や紙フェノール等を基材とした銅張積層板をエッチン
グ加工する等の手段により、その表面側に縦に８本の導
電パターン9a（例えばＸパターン群）を形成すると共
に、裏面側に横の８本の導電パターン9b（例えばＹパタ
ーン群）を形成してある。そして、裏面の導電パターン
9a（例えばアノード側）をスルーホール10を介して各発
光ドット１…ごとに基板８表面に導出し、その上に発光
素子として高輝度LEDチップ11を銀ペースト等で固定す
ると共に、ボンディングワイヤ12で基板表面の他方の導
電パターン9a（例えばカソード側）と接続し、かくして
８×８のＸ−Ｙマトリックス点灯表示回路を構成してあ
る。更に、この表示体基板８の上には、各LEDチップ11
に対応して擂鉢状の透孔13を縦横に８×８個形成したマ
スク板14を接合し、透孔性樹脂15で各透孔13内のLEDチ
ップ11を封止して、発光ドット１を形成している。上記
マスク板14は、見掛け上の発光ドットの拡大や隣接する
発光ドットへの光の漏れ防止等、視認性を改善するため
のもので、その表面を黒色ないし灰色系の光無反射面と
する一方、透孔13の内周面を白色系の光反射面としてあ
る。The light emitting display plates 2 ... Have a structure as shown in FIG. 2, for example. That is, the display substrate 8 is provided with eight conductive patterns 9a (for example, X pattern group) vertically on the surface side by means of etching a copper clad laminate using glass epoxy resin or paper phenol as a base material. And 8 horizontal conductive patterns 9b (for example, a Y pattern group) are formed on the back surface side. And the conductive pattern on the back side
9a (for example, the anode side) is led out to the surface of the substrate 8 for each light emitting dot 1 through the through hole 10, and a high brightness LED chip 11 as a light emitting element is fixed thereon with silver paste or the like, and a bonding wire 12 is also provided. Is connected to the other conductive pattern 9a on the surface of the substrate (for example, on the cathode side), thus forming an 8 × 8 XY matrix lighting display circuit. Furthermore, on the display substrate 8, each LED chip 11 is
Corresponding to the above, a mask plate 14 in which 8 × 8 mortar-shaped through holes 13 are formed vertically and horizontally is joined, and the LED chips 11 in each through hole 13 are sealed with a permeable resin 15 so that the light emitting dot 1 Is formed. The mask plate 14 is for improving visibility such as expansion of apparent light emitting dots and prevention of light leakage to adjacent light emitting dots, and its surface is a black or gray light non-reflective surface. On the other hand, the inner peripheral surface of the through hole 13 is a white light reflecting surface.
上記構成の発光表示装置では、コントローラ（CPU等で
構成される）のプログラムに従って、各発光表示板２…
の発光ドット１…内のLEDチップ11をダイナミック点灯
制御し、多段に形成された発光表示板２…の表示面３に
所望の文字、図形、記号等の表示パターンを流れ表示等
するものである。表示に伴って各発光ドット２…内のLE
Dチップ11の発熱によって周囲の空気が暖められ、該発
光表示板１…の背後のプリント基板５の表面を上方に向
かって上昇するようになる。このとき、空気は第３図に
示すように、プリント基板５に穿孔された貫通孔７…を
通って該プリント基板５の背面にも流動し、プリント基
板5,6間に流れ込むようになる。さらに、プリント基板
5,6間の空気はプリント基板６の貫通孔７…を通って該
プリント基板６の背面にも流れ込むようになって空気の
循環が活発となる。従って、暖められた空気の循環が頗
る良好となり、発光表示板１…の上層付近の温度が特に
上昇するといった問題も回避でき、LEDチップ11自体の
温度も高くならずほぼ一定したものとなって信頼性に影
響を与えることがなく、該LEDチップ11の寿命で交換し
なければならないといった問題が大幅に減少する。さら
に、プリント基板5,6上に搭載された電子部品等の温度
上昇も緩和され、電気的特性に影響を与えるといった問
題も削減される。また、発光表示板１…と各プリント基
板5,6の空気の循環が確実に行なわれるので、それぞれ
の取り付け間隔を近接させても特に問題はない。また、
発光表示板１としては８×８のドットマトリックス表示
板を使用しているが、これに限るものでなく、例えば、
16×16ドット、32×32ドットなど所望のドット数の発光
表示板１を使用できることは勿論であり、更に、LEDチ
ップ11に代わりにLEDランプその他の点発光する発光素
子を使用してもよいことはいうまでもない。In the light emitting display device having the above configuration, each light emitting display board 2 ... According to the program of the controller (which is configured by a CPU or the like).
The LED chips 11 in the light emitting dots 1 are controlled to be dynamically lighted, and a desired display pattern such as characters, figures, symbols is flow-displayed on the display surface 3 of the light emitting display plate 2 formed in multiple stages. . LE in each luminous dot 2 ...
The surrounding air is warmed by the heat generated by the D chip 11, and the surface of the printed circuit board 5 behind the light emitting display boards 1 ... Is raised upward. At this time, as shown in FIG. 3, the air also flows through the through holes 7 formed in the printed circuit board 5 to the back surface of the printed circuit board 5 and flows between the printed circuit boards 5 and 6. In addition, the printed circuit board
The air between 5 and 6 also flows into the back surface of the printed circuit board 6 through the through holes 7 of the printed circuit board 6 so that the air circulation becomes active. Therefore, the circulation of warmed air becomes very good, and the problem that the temperature near the upper layer of the light emitting display panel 1 rises can be avoided, and the temperature of the LED chip 11 itself does not rise and becomes almost constant. It does not affect the reliability, and the problem of having to replace the LED chip 11 at the end of its life is greatly reduced. Further, the temperature rise of the electronic components mounted on the printed circuit boards 5 and 6 is mitigated, and the problem of affecting the electrical characteristics is reduced. Further, since the air circulation between the light emitting display boards 1 ... And the printed circuit boards 5 and 6 is surely performed, there is no particular problem even if the respective mounting intervals are close to each other. Also,
Although an 8 × 8 dot matrix display plate is used as the light emitting display plate 1, the light emitting display plate 1 is not limited to this.
Of course, it is possible to use the light-emitting display board 1 having a desired number of dots such as 16 × 16 dots and 32 × 32 dots, and further, instead of the LED chip 11, an LED lamp or other point-emitting light-emitting element may be used. Needless to say.
［考案の効果］ 以上の説明から明かなように、本考案の発光表示装置で
は、発光ドットの発熱によって暖められた空気がプリン
ト基板に形成された貫通孔を通って該プリント基板の背
面にまで流動するようになるため、空気の循環が活発と
なって、特に上層部付近の温度上昇が抑えられ、この発
光表示装置全体がほぼ一定温度に保たれるようになり、
発光ドットの信頼性低下の防止及び発光駆動回路用プリ
ント基板に搭載された電子部品等の電気的特性に及ぼす
影響を減少できるといった効果を奏する。[Effects of the Invention] As is apparent from the above description, in the light emitting display device of the present invention, the air warmed by the heat generation of the light emitting dots passes through the through hole formed in the printed circuit board and reaches the back surface of the printed circuit board. Since it becomes fluid, the circulation of air becomes active, and the temperature rise especially near the upper layer is suppressed, and the entire light emitting display device can be maintained at a substantially constant temperature.
It is possible to prevent the reliability of the light emitting dots from being deteriorated and to reduce the influence on the electrical characteristics of the electronic components mounted on the light emitting drive circuit printed circuit board.
第１図は本考案の一実施例にかかる発光表示装置の一部
破断斜視図、第２図は第１図のＩ−Ｉ断面図、第３図は
空気の循環を模式的に示した要部断面図、第４図は従来
の発光表示装置の斜視図、第５図は従来の空気の循環を
模式的に示した要部断面図である。 １…発光表示板、 ２……発光ドット、 ３…表示面、 5,6…発光駆動回路を実装したプリント基板、 ７…放熱用貫通孔。1 is a partially cutaway perspective view of a light emitting display device according to an embodiment of the present invention, FIG. 2 is a sectional view taken along the line I--I of FIG. 1, and FIG. 3 is a schematic view showing the circulation of air. Partial cross-sectional view, FIG. 4 is a perspective view of a conventional light emitting display device, and FIG. 5 is a main-part cross-sectional view schematically showing conventional air circulation. 1 ... Light emitting display board, 2 ... Light emitting dot, 3 ... Display surface, 5, 6 ... Printed circuit board on which light emitting drive circuit is mounted, 7 ... Heat radiation through hole.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０１Ｌ 33/00 Ｎ 7376−4Ｍ ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Internal reference number FI technical display location H01L 33/00 N 7376-4M
Claims (1)
がマトリックス状に配列形成された発光表示板を縦横に
つなぎ合わせて表示面を形成し、該発光面背後に発光駆
動回路を実装したプリント基板を取り付けた発光表示装
置において、 上記プリント基板に複数の放熱用貫通孔を穿孔したこと
を特徴とする発光表示装置。1. A printed circuit board having a light-emitting display plate, on the surface of which light-emitting dots using light-emitting diodes are arranged in a matrix form, connected vertically and horizontally to form a display surface, and a light-emission driving circuit mounted behind the light-emitting surface. A light emitting display device having a plurality of through holes for heat dissipation provided in the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988103719U JPH0646014Y2 (en) | 1988-08-04 | 1988-08-04 | Light emitting display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988103719U JPH0646014Y2 (en) | 1988-08-04 | 1988-08-04 | Light emitting display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0225119U JPH0225119U (en) | 1990-02-19 |
| JPH0646014Y2 true JPH0646014Y2 (en) | 1994-11-24 |
Family
ID=31334800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988103719U Expired - Lifetime JPH0646014Y2 (en) | 1988-08-04 | 1988-08-04 | Light emitting display |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0646014Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008007473A1 (en) * | 2006-07-12 | 2008-01-17 | Sharp Kabushiki Kaisha | Optical part, illumination device for display device, and display device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8974077B2 (en) | 2012-07-30 | 2015-03-10 | Ultravision Technologies, Llc | Heat sink for LED light source |
| EP3416155A4 (en) * | 2016-12-28 | 2019-05-08 | Mitsubishi Electric Corporation | Light-emitting unit, display device, and multi-display device |
-
1988
- 1988-08-04 JP JP1988103719U patent/JPH0646014Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008007473A1 (en) * | 2006-07-12 | 2008-01-17 | Sharp Kabushiki Kaisha | Optical part, illumination device for display device, and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0225119U (en) | 1990-02-19 |
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