JPH0654081U - Luminous display - Google Patents

Abstract

(57) [Abstract] [Purpose] Highly reliable without being warped by thermal strain due to the difference in thermal expansion coefficient between the display substrate 2 and the mask plate 3 and being protected against local external pressure. An object is to provide a light emitting display. [Structure] LED light-emitting element 4 which emits light on display substrate 2
Are arranged vertically and horizontally, and are fixed to 8 corresponding to each LED light emitting element 4.
A mask plate 3 in which 8 × 8 through holes 31 are similarly formed with the stress buffer material 5 having 8 × 8 opening portions 51 interposed therebetween.
And stack LE in the opening 51 and the through hole 31, respectively.
The D light-emitting element 4 is housed and sealed, and is sealed with a resin 6 having a light-transmitting property, and 8 × 8 light-emitting dots 7 are formed as light-emitting portions vertically and horizontally at regular intervals. The thickness of the stress buffer material 5 is thinner than the mask plate in the range of 0.3 mm or more and 1.5 mm or less.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a dot matrix type or segment type light emitting display using a large number of point light emitting LED light emitting elements and a method for manufacturing the same.

[0002]

[Prior art]

 Conventionally, as a light emitting display using an LED light emitting element that emits point light such as an LED chip, for example, a dot matrix light emitting display as shown in FIGS. 4 and 5 has already been proposed.

That is, the dot-matrix light-emitting display 101 is provided on one side, for example, the conductive pattern 103 (X electrode) of the anode electrode, which is guided from the back surface of the display substrate 102 to the front surface through the through hole 109. The LED light emitting device 104 is mounted, and the LED light emitting device 104 is electrically connected by wire bonding to the other surface of the display substrate 102, for example, to the conductive pattern 103 '(Y electrode) of the cathode electrode, thus displaying. LED light emitting elements 104 are arranged and wired at light source locations arranged in a vertical and horizontal 8 × 8 array on the body substrate 102 to form an XY matrix dynamic lighting light emitting display circuit (not shown). Then, on the display substrate 102, a synthetic resin mask plate is formed in which 8 × 8 through holes 105, whose inner peripheral surface is a white light reflecting surface 111, are formed vertically and horizontally corresponding to the LED light emitting elements 104. 106 are stacked and adhered, each LED light emitting element 104 is housed in each through hole 105, and a transparent resin 107 is further injected into each through hole 105 to seal the wiring portion of the LED light emitting element 104. As a result, the light emitting portions 108 form light emitting dots arranged in an 8 × 8 dot matrix.

Such a light-emitting display body 101 displays the desired display pattern of characters, figures, symbols, etc. by light-emission control of the LED light-emitting element 104 of each light-emitting part 108 by a dynamic lighting method. In order to enhance the visibility when a desired display pattern is displayed by light emission, the surface of the mask plate 106 excluding the through holes 105 is made a black light non-reflective surface, while the light transmitting sections 108 are formed. The inner peripheral surface of the hole 105 is made into a mortar-shaped white light-reflecting surface so that the light of the turned-on LED light emitting element 104 is reflected and scattered in a wide range.

[0005]

[Problems to be solved by the device]

 However, in the light emitting display body 101, the display body substrate 102 is made of, for example, glass epoxy resin so that the light emitting display body 100 itself does not warp due to heat generation of the LED light emitting element 104 when a desired character, figure, symbol or the like is displayed. Although the mask plate 106 is made of a rubber elastic body such as silicone rubber, the light emitting display body 100 as described above can improve reliability against thermal stress as described above. There is a problem that a local external pressure is applied to the surface and side surfaces of the LED light emitting element 104 during the handling such as assembly to deform the wire, and the wire connected to the LED light emitting element 104 is easily damaged or broken.

Therefore, the mask plate 106 to be bonded to the display substrate 102 may be made of a hard synthetic resin. However, when the LED light emitting element 104 is turned on to generate heat, the mask plate 106 and the display substrate 102 are made. Due to the difference in the coefficient of thermal expansion of 102, thermal stress is generated, which causes distortion to warp the light-emitting display body 101 and disconnect the LED light-emitting element 104 and the wire.

[0007]

[Means for Solving the Problems]

 In order to solve the above-mentioned problems, the light emitting display of the present invention is a synthetic resin mask plate in which a large number of through holes corresponding to each LED light emitting element are formed on a display substrate on which a large number of LED light emitting elements are arranged. A light-emitting display body in which a plurality of light-emitting portions are formed by accommodating and arranging the LED light-emitting elements corresponding to the respective through-holes and sealing each through-hole with a light-transmitting resin. An opening is formed in the substrate and the mask plate corresponding to each of the above-mentioned light emitting parts, and a stress buffer material made of a rubber elastic body, which is thinner than the mask plate in the range of 0.3 mm or more and 1.5 mm or less, is interposed. It is characterized by being bonded and integrated.

[0008]

[Action]

 The light emitting display of the present invention is made of a rubber elastic body thinner than the mask plate in the range of 0.3 mm or more and 1.5 mm or less between the mask plate made of synthetic resin and disposed on the display substrate. When the display substrate and the mask plate are heated by the heat generated when the LED light emitting element is turned on to display a desired character or symbol by interposing the stress buffer, the difference in the coefficient of thermal expansion between the two is caused. The distortion caused by the absorption is surely absorbed and relaxed, and the light emitting display body is not warped. Moreover, it is protected against local external force during handling.

[0009]

【Example】

 An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic perspective view of a light emitting display body according to an embodiment of the present invention, and FIG. 2 is a schematic enlarged sectional view taken along the line AA of FIG. In the light emitting display body 1 shown in the figure, LED light emitting elements 4 for point emission are arranged vertically and horizontally on a display body substrate 2, and 8 × 8 openings 51 are punched corresponding to the respective LED light emitting elements 4. The mask plate 3 in which 8 × 8 through holes 31 are similarly formed is laminated with the stress buffering material 5 interposed therebetween, and the LED light emitting elements 4 are housed and arranged in the openings 51 and the through holes 31, respectively. This is a dot matrix light-emitting display body in which 8 × 8 light-emitting dots 7 are formed as light-emitting parts at regular intervals in a vertical direction, which is sealed with a resin 6 having a light property.

The display substrate 2 is a copper-clad laminate having a glass epoxy resin, paper phenol, etc. as a base material. By means of etching treatment on the front and back surfaces, for example, 8 in the vertical direction on the front surface side. The conductive pattern 8a serving as the anode is formed, and the eight conductive patterns 8b serving as the cathode are formed in the lateral direction on the back surface side, and the conductive pattern 8b on the cathode side is formed on the front surface side through the through holes 9. It is outsourced. The LED light emitting element 4 is die-bonded to each conductive pattern 8b formed on the front surface side by a conductive paste such as silver paste, and each LED light emitting element 4 and the conductive pattern 8a are connected by a wire 10. Has been done. Thus, an 8 × 8 XY dot matrix light emitting display circuit (dynamic lighting circuit) is constructed so that a desired display pattern of characters, figures, symbols, etc. can be selectively illuminated and displayed.

The mask plate 3 overlaid on the light emitting display 1 is a heat-resistant resin molded product such as a polycarbonate resin or a noryl resin, and is mounted on the LED light emitting element 4 arranged and wired on the display substrate 2. Correspondingly, 8 × 8 mortar-shaped through holes 31 are formed in the vertical and horizontal directions that spread toward the upper opening. The surface absorbs black or gray-based light in order to improve display visibility and visibility. Surface, and the inner peripheral surface 31 of each through hole 31 is a white or silver-colored light reflecting surface to increase the apparent light emitting area associated with the light emission of each LED light emitting element 2 and to increase the brightness, thereby improving the brightness of each adjacent LED. It has an effect of preventing light leakage between the light emitting elements 2.

The stress buffering material 5 interposed between the display body substrate 2 and the mask plate 3 is a plate-like body made of a rubber elastic body such as neoprene rubber or silicone rubber. 8 × 8 openings 51 are formed corresponding to 31. The opening 51 is connected to the through hole 31 by an upper opening surface 51a having the same opening area as the lower opening surface 31a of the through hole 31 and a lower opening surface 51b having an opening area narrower than that. It has a mortar shape, and the inner peripheral surface of each opening 51 is a white or silver light reflecting surface.

Further, in the above-mentioned embodiment, assuming that the practical use temperature range of the light emitting display body 1 is −20 ° C. to 100 ° C., as shown in FIG. When the distortion Δx is set to a practically allowable value, for example, within 0.1 mm, the maximum value of the thickness T of the mask plate 3 is within a practical range of 20 mm ≦ D ≦ 200 mm of the light emitting display body 1. The minimum value of the thickness t of the stress buffer material 5 is as shown in Table 1.

[0015]

[Table 1]

According to Table 1, if the thickness T of the mask plate 3 is within the range of 0.8 mm ≦ T ≦ 2.5 mm, the thickness t of the stress buffer 5 is T ≧ t, and , By setting the range of 0.3 mm ≤ t ≤ 1.5 mm, the warp strain Δx can be suppressed within the allowable range of 0.1 mm, and stress absorption and relaxation and protection from local external force can be reliably performed. It In this case, the shorter the maximum external dimension D, the thinner the thickness t of the stress cushioning material 5, and the thinner the thickness T of the mask plate 3, the thinner the thickness t of the stress cushioning material 5. Incidentally, the Young's modulus E of the stress buffer material 5 is a rubber elastic material of about (1.5 to 5.0) × 10 ⁻⁴ , and the Young's modulus E of the display substrate 2 and the mask plate 3 is (0 Since it is composed of a material in the range of about 1 to ¹⁰ ) × 10 ¹⁰ , the difference is 10 digits or more, and the stress buffer 5 sufficiently absorbs and relaxes the stress.

Then, each LED light emitting element 4 housed in each through hole 31 of the mask plate 3 laminated on the display substrate 2 with the stress buffer material 5 interposed therebetween is similar to the stress buffer material 5. A transparent light-transmitting resin 6 having elasticity such as silicone resin is used as a concave spherical surface to seal the wiring portion of each LED light-emitting element 4 to form 8 × 8 light-emitting dots 7. There is.

In the light emitting display body 1 in which the 8 × 8 light emitting dots 7 are arranged in a dot matrix, the desired characters, numbers and figures are controlled by selectively controlling the lighting of the respective light emitting dots 7. , A symbol or the like is displayed in a luminescent manner. At this time, since the display body substrate 2 and the mask plate 3 are made of different materials due to the heat generated by the light emission of each LED light emitting element 4, their respective thermal expansion coefficients are different, and therefore, due to the expansion due to heating and the temperature decrease. Although thermal strain occurs due to contraction, the stress buffer material 5 made of rubber elastic material is interposed between the two, so the stress buffer material 5 absorbs and relaxes the strain, and the light emitting display body 1 itself warps. In addition, there is no problem such as disconnection of the wire 10 connected to each LED light-emitting element 4 and the light-emitting display 1 is highly reliable. At this time, if the surface of the light-transmissive resin 6 forming the light-emitting dots 7 is a concave spherical surface, a concave lens action is exerted on the emitted light, so that each surface of the light-emitting dots 7 has a flat surface or a convex surface. It is possible to obtain the effect that the light is more likely to be concentrated on the peripheral portion of the light emitting dot 7, the contour is clear, and the viewing angle is large.

Such a light emitting display 1 is manufactured, for example, as follows. That is, as shown in FIG. 3, the display body substrate 2 in which the LED light emitting elements 4 are arranged and fixed on the conductive pattern 8b, the mask plate 3 in which 8 × 8 through holes 31 are formed, and 8 × 8 are formed. The stress cushioning material 5 having the individual openings 51 formed therein is prepared, and the mask board 3 is laminated on the display substrate 2 with the stress cushioning material 5 interposed therebetween so as to be integrally bonded, as shown in FIG. The transparent light-transmissive resin 6 is inflow-cured into each mortar-shaped opening formed by each through hole 31 and the opening 51 to form 8 × 8 luminescent dots 7, which can be easily manufactured. . In this case, it goes without saying that the stress due to curing shrinkage during manufacturing is also absorbed and relaxed.

Further, in the above-described embodiment, the rectangular light emitting display body 1 in which 8 × 8 light emitting dots 7 are formed vertically and horizontally has been described. However, the light emitting display body 1 provided with 16 × 16 light emitting dots, 24 × For example, 24 or 12 × 24 light emitting dots may be provided, or each light emitting dot 7 may be formed on a circular light emitting display, or the light emitting portion may be a segment type light emitting display. Even in the body, the stress absorbing material can be surely absorbed and relaxed by interposing the stress buffer between the light emitting display and the mask plate.

[0021]

[Effect of device]

 As is apparent from the above description, in the light emitting display body of the present invention, the stress absorbing material is interposed between the display body substrate and the mask plate so that the display body substrate and the mask due to the lighting heat of the LED light emitting element are generated. Stress strain due to the difference in thermal expansion coefficient from the plate is absorbed and relaxed by the stress buffer material made of rubber elastic material to prevent warpage, and the surface and side surface during handling such as assembly of the display body are prevented. It is also protected against damage due to local external pressure on the light emitting element and has the effect of providing a highly reliable light emitting display.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a light emitting display according to an embodiment of the present invention.

FIG. 2 is a schematic sectional view taken along line AA of FIG. 1 in the embodiment.

FIG. 3 is a schematic cross-sectional view showing a manufacturing process of the light emitting display of the present invention.

FIG. 4 is a schematic sectional view showing a manufacturing process of the light emitting display of the present invention.

FIG. 5 is a perspective view of a conventional light emitting display body.

6 is a schematic cross-sectional view taken along the line BB of FIG.

FIG. 7 is a side view schematically showing a distorted state of the light emitting display body.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Light emitting display body 2 Display body substrate 3 Mask plate 5 Stress buffer material 6 Resin 7 Light emitting part (light emitting dot) 31 Through hole 51 Opening part

Claims (1)

[Scope of utility model registration request] 1. A synthetic resin mask plate having a large number of through holes corresponding to each LED light emitting element is arranged on a display substrate on which a large number of LED light emitting elements are arranged. A light-emitting display body in which LED light-emitting elements are respectively housed and arranged, and the respective through-holes are sealed with a light-transmissive resin to form a large number of light-emitting portions, wherein the display body substrate and the mask plate are provided with the above-mentioned light-emitting elements. An opening is formed corresponding to the part, and the thickness is 0.3 mm or more and 1.5 mm
A light emitting display body characterized in that it is integrally bonded with a stress buffer material made of a rubber elastic body thinner than the mask plate in the following range.