JPH0241659Y2 - - Google Patents

Info

Publication number
JPH0241659Y2
JPH0241659Y2 JP1985170283U JP17028385U JPH0241659Y2 JP H0241659 Y2 JPH0241659 Y2 JP H0241659Y2 JP 1985170283 U JP1985170283 U JP 1985170283U JP 17028385 U JP17028385 U JP 17028385U JP H0241659 Y2 JPH0241659 Y2 JP H0241659Y2
Authority
JP
Japan
Prior art keywords
terminal
light emitting
terminals
joint
mounting board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1985170283U
Other languages
Japanese (ja)
Other versions
JPS6279284U (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985170283U priority Critical patent/JPH0241659Y2/ja
Publication of JPS6279284U publication Critical patent/JPS6279284U/ja
Application granted granted Critical
Publication of JPH0241659Y2 publication Critical patent/JPH0241659Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【考案の詳細な説明】 産業上の利用分野 本考案は、発光ダイオードなどの2端子型発光
体素子を取付けるための発光体素子取付基板の改
良に関する。
[Detailed Description of the Invention] Industrial Application Field The present invention relates to an improvement of a light emitting element mounting board for mounting a two-terminal type light emitting element such as a light emitting diode.

従来の技術 従来、多数の発光ダイオード等の2端子型発光
体素子を用いて文字、図形等のパターンを表示す
るデイスプレイ装置、例えば、固定サインボード
においては、発光体素子取付基板が用いられてお
り、発光体素子は基板の所定箇所に形成された挿
通孔に各端子リードを挿通させて取付けられてい
る。
BACKGROUND ART Conventionally, a light emitting element mounting board has been used in a display device, such as a fixed sign board, that uses two-terminal light emitting elements such as a large number of light emitting diodes to display patterns such as letters and figures. The light-emitting element is attached by inserting each terminal lead into an insertion hole formed at a predetermined location on the substrate.

このような従来の発光体素子取付基板では、所
定表示パターンを形成するための発光体素子の配
線および電源への配線は、基板裏面に突出した発
光体素子のリード端子に半田付け等によりリード
線を接続し、接続された多数のリード線を基板裏
面で相互に接続するという面倒な作業によつて行
なわれている。
In such a conventional light emitting element mounting board, the wiring of the light emitting element and the wiring to the power supply for forming a predetermined display pattern are connected by soldering or the like to the lead terminals of the light emitting element protruding from the back of the board. This is done through the tedious work of connecting a large number of connected lead wires to each other on the back side of the board.

例えば、固定サインボードを形成する場合に
は、第15図に示したように、予め絶縁基板10
0に所定の取付孔101を穿孔して、絶縁基板1
02となし、この取付基板102に、多数の2端
子型発光体素子LEDの接続端子を挿入し、挿入
した接続端子にリード線を逐一半田付けして接続
するなどの方法により取付けるのが通例となつて
いる。
For example, when forming a fixed sign board, as shown in FIG.
A predetermined mounting hole 101 is drilled in the insulating substrate 1.
02, it is customary to insert the connection terminals of a large number of two-terminal light emitting element LEDs into this mounting board 102, and to connect the lead wires to the inserted connection terminals by soldering one by one. It's summery.

したがつて、従来の発光体素子取付基板におい
ては、発光体素子の基板への取付に際して、配線
作業に多大の労力を要し、配線誤りが発生する可
能性が高いという問題があり、更には、一旦配線
がなされた後は、それを修正又は変更することは
極めて困難である。
Therefore, in the conventional light emitter element mounting board, when mounting the light emitter element on the board, there is a problem that a great deal of wiring work is required and there is a high possibility of wiring errors. , Once the wiring has been made, it is extremely difficult to modify or change it.

考案が解決しようとする問題点 本考案の取付基板は、従来の取付基板が有して
いた上記の如き欠点を解消することにあり、2端
子型発光体素子の取付が簡単で、電気接続パター
ンの選択、変更も容易な取付基板を提供すること
を目的としている。
Problems to be Solved by the Invention The mounting board of the present invention is intended to eliminate the above-mentioned drawbacks of conventional mounting boards. The purpose is to provide a mounting board that is easy to select and change.

問題点を解決するための具体例手段 本考案が採用する具体的手段は、絶縁基板の裏
面に、2端子型発光体素子の電気接続パターンを
任意に変更する複数のジヨイント端子を設けた発
光体素子取付基板の改良に係るものであつて、上
記ジヨイント端子の各々は、中央にピン挿通孔を
有し、かつこのピン挿通孔を取り囲むようにして
該ジヨイント端子の前後に隣接して設けられた2
端子型発光体素子の取付孔にそれぞれ通じる複数
の選択端子を設けるとともに、隣接するジヨイン
ト端子を連結する連結端子を形成してあり、これ
らのジヨイント端子の上記ピン挿通孔に、予め所
定の導電パターンの形成された接続ピンを挿入さ
せて、上記2端子型発光体素子の電気接続パター
ンを任意に変更する構造としたことを特徴として
いる。
Specific Example Means for Solving the Problems The specific means adopted by the present invention is a light emitting device that is provided with a plurality of joint terminals on the back side of an insulating substrate to arbitrarily change the electrical connection pattern of the two-terminal light emitting device. The invention relates to an improvement of an element mounting board, wherein each of the joint terminals has a pin insertion hole in the center, and is provided adjacent to the front and rear of the joint terminal so as to surround the pin insertion hole. 2
A plurality of selection terminals each communicating with the mounting hole of the terminal type light emitting element are provided, and a connecting terminal is formed to connect adjacent joint terminals, and a predetermined conductive pattern is inserted into the pin insertion hole of these joint terminals in advance. The present invention is characterized by a structure in which the electrical connection pattern of the two-terminal light emitting element can be arbitrarily changed by inserting a connecting pin formed with the above.

なお、本考案でいう2端子型発光体素子とは、
通電によつて発光する素子、部品といい、その大
きさ、形状は問わない。
Note that the two-terminal light-emitting element in the present invention is
An element or component that emits light when energized, and its size and shape do not matter.

例えば、第1b図〜第1d図に示したものが代
表的なものである。第1b図はLEDランプ、第
1b図は白熱電球、第1d図はLEDなどを封入
してブロツク体として構成したものを示してい
る。
For example, those shown in FIGS. 1b to 1d are typical. Fig. 1b shows an LED lamp, Fig. 1b shows an incandescent lamp, and Fig. 1d shows a block body in which LEDs are sealed.

考案の作用及び効果 本考案の発光体素子取付基板によれば、その構
造上の特徴から、ジヨイント端子に、所定の導電
パターンの形成された接続ピンを挿入するだけ
で、任意の電気接続パターンが形成でき、しかも
ジヨイント端子に挿入される接続ピンを取り替え
るだけで、基板に取付けられた2端子型発光体素
子の電気接続パターンを選択、変更できる。
Effects and Effects of the Invention According to the light emitter element mounting board of the present invention, due to its structural features, any electrical connection pattern can be established by simply inserting a connection pin on which a predetermined conductive pattern is formed into the joint terminal. Moreover, by simply replacing the connection pins inserted into the joint terminals, the electrical connection pattern of the two-terminal light emitting element attached to the substrate can be selected and changed.

したがつて、従来の取付基板のように、発光体
素子の端子を所定の取付孔に挿入してから、基板
裏面に突出した発光体素子のリード端子に半田付
け等によりリード線を接続し、多数のリード線を
基板裏面で相互に接続するというような手間が要
らず、接続作業が簡単となり、頗る便利である。
Therefore, as with conventional mounting boards, the terminals of the light emitting element are inserted into the predetermined mounting holes, and then the lead wires are connected by soldering or the like to the lead terminals of the light emitting element protruding from the back of the board. There is no need to take the trouble of connecting a large number of lead wires to each other on the back side of the board, making the connection work simple and extremely convenient.

また、本考案の取付基板は、絶縁基板の裏面に
のみ導電パターンを形成するだけで構成できるの
で、片面銅張積層板などの安価なものが使用で
き、製造コストも安価にできる利点がある。
Furthermore, since the mounting board of the present invention can be constructed by simply forming a conductive pattern on the back side of the insulating board, an inexpensive material such as a single-sided copper-clad laminate can be used, which has the advantage of reducing manufacturing costs.

考案の実施例 以下に、添付図とともに本考案の一実施例を説
明する。
Embodiment of the invention An embodiment of the invention will be described below with reference to the accompanying drawings.

第1図は、8×8ドツトの発光体素子取付部を
有する発光表示体に本考案を適用した例(1ドツ
トに1個の2端子型発光体素子を取付けたもの)
を示しており、取付基板1の絶縁基板10の裏面
1aに形成された導電パターンの模式配線図を示
している。取付基板1は、例えば、紙にフエノー
ル樹脂を含浸させたもの、ガラスクロスにエポキ
シ樹脂を含浸させたものなどを用いたプリント基
板で製される。
Figure 1 shows an example in which the present invention is applied to a light-emitting display having an 8 x 8 dot light-emitting element mounting section (one 2-terminal light-emitting element is attached to each dot).
, which is a schematic wiring diagram of a conductive pattern formed on the back surface 1a of the insulating substrate 10 of the mounting board 1. The mounting board 1 is made of a printed circuit board using, for example, paper impregnated with phenol resin, glass cloth impregnated with epoxy resin, or the like.

図において、2は発光ダイオード(以下では
LEDという)などの2端子型発光体素子に応じ
て設けられた取付孔、3はジヨイント端子、7,
8はLEDを点灯する場合に電源装置(不図示)
に接続される給電端子を示している。
In the figure, 2 is a light emitting diode (hereinafter
3 is a joint terminal; 7,
8 is a power supply device (not shown) when lighting the LED
It shows the power supply terminal connected to.

本考案におけるジヨイント端子3は、第1a図
に拡大して模式的に示されているが、実際には、
例えば、第2図に示したような構造に形成され
る。すなわち、第2図に示した実施例では、ジヨ
イント端子3は、中央に設けたピン挿入孔30の
周りに4つの選択端子31〜34と、隣接するジ
ヨイント端子3を連結する連結端子35,36を
設けた構造となつており、選択端子31〜34の
各々は導電枝パターン6を介してLEDの取付孔
2に接続されているが、連結端子35,36はそ
れぞれ別の導電パターン60,60を介して隣接
するジヨイント端子3の対応する連結端子36,
35に接続されている。
The joint terminal 3 in the present invention is schematically shown enlarged in FIG. 1a, but in reality,
For example, it is formed into a structure as shown in FIG. That is, in the embodiment shown in FIG. 2, the joint terminal 3 has four selection terminals 31 to 34 around a pin insertion hole 30 provided in the center, and connecting terminals 35 and 36 that connect the adjacent joint terminals 3. Each of the selection terminals 31 to 34 is connected to the LED mounting hole 2 via a conductive branch pattern 6, but the connection terminals 35 and 36 are connected to separate conductive patterns 60 and 60, respectively. Corresponding connection terminals 36 of adjacent joint terminals 3 via
It is connected to 35.

実施例では、ピン挿入孔30は、第3図、第4
図に示したように、絶縁基板10の裏面1aより
表面1b側に貫通する構造としているが、絶縁基
板10に厚いものを使用する場合には、ピン挿入
孔30は必ずしも絶縁基板10の貫通する必要は
なく、後述する接続ピン4を挿入固定できるもの
であれば良い。
In the embodiment, the pin insertion hole 30 is as shown in FIGS.
As shown in the figure, the structure is such that the pin insertion hole 30 penetrates from the back surface 1a of the insulating substrate 10 to the front surface 1b side. However, if a thick insulating substrate 10 is used, the pin insertion hole 30 does not necessarily penetrate through the insulating substrate 10. It is not necessary, and any material that can insert and fix the connecting pin 4 described later may be used.

第5図〜第9図は、接続ピン4の実施例を示し
ている。接続ピン4は把手軸42を指で摘み、ピ
ン軸41を上記したジヨイント端子3のピン挿入
孔30に挿入して使用する(第4図参照)。
5 to 9 show embodiments of the connecting pin 4. FIG. The connecting pin 4 is used by grasping the handle shaft 42 with fingers and inserting the pin shaft 41 into the pin insertion hole 30 of the joint terminal 3 described above (see FIG. 4).

ピン挿入孔30より大径のピン軸41に図示し
たような割溝41aを予め形成しておけば、ピン
挿入孔30に挿入した時に確実に固定できる。
If a split groove 41a as shown in the figure is formed in advance on the pin shaft 41 having a larger diameter than the pin insertion hole 30, the pin shaft 41 can be securely fixed when inserted into the pin insertion hole 30.

接続ピン4の基本的な構造は、第5図〜第9図
に示されているが、鍔部40には、上記したジヨ
イント端子3の選択端子31〜34、連結端子3
5,36のうちより任意のもの同士を接続するた
めに導電パターン40aが形成される。
The basic structure of the connecting pin 4 is shown in Figs.
A conductive pattern 40a is formed to connect any one of 5 and 36 to each other.

鍔部40に導電パターン40aを形成するに
は、鍔部40を絶縁性素材で形成し、その下面
(ジヨイント端子3に接触する面側)に接続すべ
きパターンに応じた導電膜、導電層を形成した
り、あるいは鍔部40の下面に一部が露出するよ
うにして導電板を鍔部40に挟み込んだり、貼着
するなどして形成する。
To form the conductive pattern 40a on the flange 40, the flange 40 is made of an insulating material, and a conductive film or a conductive layer corresponding to the pattern to be connected is formed on the lower surface (the side that contacts the joint terminal 3) of the conductive pattern 40a. Alternatively, a conductive plate may be sandwiched or attached to the flange 40 so that a portion thereof is exposed on the lower surface of the flange 40.

なお、接続ピン4は導電材料で形成してもよ
く、その場合には第6図〜第9図のように、鍔部
40を導電パターン40aの形状に応じた形に形
成したり、鍔部40に凸凹を設けたりして形成す
る。また、図示はされないが、鍔部40の下面に
絶縁パターンを形成して導電パターン40aを形
成してもよい。このような接続ピン4に形成され
る導電パターン40aは、上記以外にも種々の方
法で形成できることはいうまでもない。
The connecting pin 4 may be formed of a conductive material, and in that case, the flange 40 may be formed in a shape corresponding to the shape of the conductive pattern 40a, or the flange may be 40 is formed by providing unevenness. Further, although not shown, an insulating pattern may be formed on the lower surface of the flange portion 40 to form the conductive pattern 40a. It goes without saying that the conductive pattern 40a formed on the connection pin 4 can be formed by various methods other than the above method.

また、このような導電パターン40aの構造
は、ジヨイント端子3において可能な電気接続パ
ターン例を示すことにより理解されるので、その
具体的に説明は省略する。
Furthermore, since the structure of the conductive pattern 40a can be understood by showing examples of possible electrical connection patterns at the joint terminal 3, a detailed explanation thereof will be omitted.

第10図a〜cは、ジヨイント端子3に、接続
ピン4を挿入することによつて可能となる電気接
続パターンの例を模式的に示している。a図は、
連結端子35,36を接続する場合、b図は連結
端子36の両側に形成された選択端子33,34
を接続する場合、c図は連結端子36と選択端子
33を接続する場合の接続パターンを示してお
り、これらの基本接続パターンの1つあるいは複
数のものが適宜組合わせられて取付基板1に取付
けたLED同士を任意の電気接続パターンに接続
する。
FIGS. 10 a to 10 c schematically show examples of electrical connection patterns that are possible by inserting the connection pins 4 into the joint terminals 3. Figure a is
When connecting the connecting terminals 35 and 36, Figure b shows the selection terminals 33 and 34 formed on both sides of the connecting terminal 36.
Figure c shows a connection pattern when connecting the connecting terminal 36 and the selection terminal 33, and one or more of these basic connection patterns can be appropriately combined and mounted on the mounting board 1. Connect the LEDs together in any electrical connection pattern.

第11図は、本考案の取付基板1における
LEDの電気接続パターンをより具体的に示す例
図であり、必要な取付孔2にLEDを取付けて直
列に接続したものを示している。
FIG. 11 shows the mounting board 1 of the present invention.
This is an example diagram more specifically showing an electrical connection pattern of LEDs, and shows LEDs mounted in necessary mounting holes 2 and connected in series.

特に図例の場合、LEDは「R」の文字パター
ンを構成しているが、取付基板1の裏面1aの導
電パターンを示しているので「R」の文字は、逆
方向に向いた恰好になつている。
In particular, in the case of the illustrated example, the LEDs form a letter pattern of "R", but since it shows the conductive pattern on the back surface 1a of the mounting board 1, the letter "R" appears to be facing in the opposite direction. ing.

なお、図においてEは電源、7,8は電源Eの
端子に接続される給電端子であり、RはLEDに
供給される電流を調整する電流調整抵抗を示して
いる。
In the figure, E is a power source, 7 and 8 are power supply terminals connected to the terminals of the power source E, and R is a current adjustment resistor that adjusts the current supplied to the LED.

一方、第12図は、ジヨイント端子3の他例を
示している。この実施例では、ジヨイント端子3
の端子は全部で5つとなつており、選択端子の一
つ(図例では31)が連結端子を兼ねた構造にな
つている。
On the other hand, FIG. 12 shows another example of the joint terminal 3. In this embodiment, joint terminal 3
There are a total of five terminals, and one of the selection terminals (31 in the illustrated example) doubles as a connection terminal.

なお、図において第1a図と同一符号を付した
部分には同一符号を付して説明を省略してある。
In addition, in the figure, the parts given the same reference numerals as in FIG. 1a are given the same reference numerals, and the explanation is omitted.

第13図、第14図は、本考案の更に具体的な
実施例における取付基板の構造例を示している。
図において、11はマスク板であり、このような
マスク板11は、発光部B(LEDを取付けて構成
される)に相当する部分に透孔11aを設けてあ
り、発光部Bの輪郭を明瞭にし光源の見掛け上の
大きさを増大させて視認性を改善するために絶縁
基板10の上面に配置される。
FIGS. 13 and 14 show an example of the structure of a mounting board in a more specific embodiment of the present invention.
In the figure, 11 is a mask plate, and such a mask plate 11 is provided with a through hole 11a in a portion corresponding to the light emitting part B (consisting of an LED attached), so that the outline of the light emitting part B can be clearly seen. The light source is disposed on the top surface of the insulating substrate 10 to increase the apparent size of the light source and improve visibility.

第13図のものでは、絶縁基板10に直接
LEDを取付けあり、マスク板11はLEDの取付
とは別に絶縁基板10の上面に取着できる構造と
しているが、第14図のものでは絶縁基板10に
マスク板11を取着してからLEDの接続端子1
2をマスク板11のの底板部11bに形成された
取付孔11cより絶縁基板10の取付孔2に挿入
して絶縁基板10に取付ける構造とされている。
いずれの構造のものでも本考案の取付基板が適用
できることはいうまでもない。
In the case of FIG. 13, the insulating substrate 10 is directly
The LED is attached and the mask plate 11 is structured so that it can be attached to the top surface of the insulating substrate 10 separately from the LED attachment, but in the one shown in Fig. 14, the mask plate 11 is attached to the insulating substrate 10 and then the LED is attached. Connection terminal 1
2 is inserted into the mounting hole 2 of the insulating substrate 10 through the mounting hole 11c formed in the bottom plate portion 11b of the mask plate 11, and is attached to the insulating substrate 10.
It goes without saying that the mounting board of the present invention can be applied to any structure.

また、マスク板11を絶縁基板10に設ける場
合には、各発光部Bの底面(マスク板11の透孔
11aより露顕する絶縁基板10の上面部分)や
マスク板11の透孔11aの内周面あるいはこれ
らの両方に光反射面を形成しておけば、発光部B
の発光効率を増大させるのに効果的である。
In addition, when the mask plate 11 is provided on the insulating substrate 10, the bottom surface of each light emitting section B (the upper surface portion of the insulating substrate 10 exposed through the through hole 11a of the mask plate 11) and the inner periphery of the through hole 11a of the mask plate 11 If a light reflecting surface is formed on one or both of these surfaces, the light emitting part B
is effective in increasing the luminous efficiency of.

また、発光部Bの輝度を向上させるためには、
発光部Bに複数の発光体素子を取付ける構造にし
てもよい。
In addition, in order to improve the brightness of the light emitting part B,
A structure may be adopted in which a plurality of light emitting elements are attached to the light emitting section B.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の取付基板の裏面に形成された
導電パターンの模式配線図、第1a図はジヨイン
ト端子の拡大模式配線図、第1b図〜第1d図は
2端子型発光体素子の例図、第2図はジヨイント
端子の一実施例をを示す平面構造図、第3図は第
2図の−線縦断面構造図、第4図は接続ピン
の使用状態を示すジヨイント端子の縦断面構造
図、第5図〜第9図は接続ピンの変形態様を示す
図、第10図はジヨイント端子における電気接続
パターンの模式配線図、第11図は本考案の取付
基板にLEDを取付けた例図、第12図は本考案
の取付基板の他例におけるジヨイント端子の模式
配線図、第13図、第14図は取付基板にマスク
板を使用する場合の縦断面構造図、第15図は従
来の発光体素子取付基板の裏面の導電パターンを
示す図である。 符号の説明、1……本考案の取付基板、10…
…その絶縁基板、1a……その裏面、2……2端
子型発光体素子の取付孔、3……ジヨイント端
子、30……ピン挿入孔、31〜34……選択端
子、35,36……連結端子、4……接続ピン、
40……鍔部、40a……導電パターン、41…
…ピン軸、42……把手軸、LED……発光ダイ
オード(2端子型発光体素子)。
Fig. 1 is a schematic wiring diagram of a conductive pattern formed on the back side of the mounting board of the present invention, Fig. 1a is an enlarged schematic wiring diagram of a joint terminal, and Figs. 1b to 1d are examples of a two-terminal light emitting device. Figure 2 is a planar structural view showing one embodiment of the joint terminal, Figure 3 is a vertical cross-sectional view taken along the line - in Figure 2, and Figure 4 is a vertical cross-section of the joint terminal showing how the connecting pin is used. Structure diagrams, Figures 5 to 9 are diagrams showing variations of the connection pin, Figure 10 is a schematic wiring diagram of the electrical connection pattern at the joint terminal, and Figure 11 is an example of an LED mounted on the mounting board of the present invention. Figures 12 and 12 are schematic wiring diagrams of joint terminals in other examples of the mounting board of the present invention, Figures 13 and 14 are vertical cross-sectional structural diagrams when a mask plate is used as the mounting board, and Figure 15 is the conventional FIG. 3 is a diagram showing a conductive pattern on the back side of the light emitter element mounting board of FIG. Explanation of symbols, 1...Mounting board of the present invention, 10...
...The insulating substrate, 1a...The back surface, 2...The mounting hole for the two-terminal light emitting element, 3...Joint terminal, 30...Pin insertion hole, 31-34...Selection terminal, 35, 36... Connection terminal, 4... Connection pin,
40... Flange portion, 40a... Conductive pattern, 41...
...Pin shaft, 42...Handle shaft, LED...Light emitting diode (2 terminal type light emitting element).

Claims (1)

【実用新案登録請求の範囲】 絶縁基板の裏面に、2端子型発光体素子の電気
接続パターンを任意に変更する複数のジヨイント
端子を設けた2端子型発光体素子取付基板であつ
て、 上記ジヨイント端子の各々は、中央にピン挿入
孔を有し、かつこのピン挿入孔を取り囲むように
して該ジヨイント端子の前後に隣接して設けられ
た2端子型発光体素子の取付孔にそれぞれ通じる
複数の選択端子を設けるとともに、隣接するジヨ
イント端子を連結する連結端子を形成してあり、
これらのジヨイント端子の上記ピン挿入孔に、予
め所定の導電パターンを形成した接続ピンを挿入
させて、上記2端子型発光体素子の電気接続パタ
ーンを任意に変更する構造にしたことを特徴とす
る発光体素子取付基板。
[Claims for Utility Model Registration] A two-terminal light emitter element mounting board, which has a plurality of joint terminals on the back side of an insulating substrate for arbitrarily changing the electrical connection pattern of the two-terminal light emitter element, Each of the terminals has a pin insertion hole in the center, and a plurality of holes surrounding the pin insertion hole and communicating with the mounting holes of the two-terminal light emitting element provided adjacently at the front and rear of the joint terminal. In addition to providing a selection terminal, a connecting terminal is formed to connect adjacent joint terminals.
The invention is characterized in that a connecting pin having a predetermined conductive pattern formed thereon is inserted into the pin insertion hole of these joint terminals to arbitrarily change the electrical connection pattern of the two-terminal light emitting element. Light emitter element mounting board.
JP1985170283U 1985-11-05 1985-11-05 Expired JPH0241659Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985170283U JPH0241659Y2 (en) 1985-11-05 1985-11-05

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985170283U JPH0241659Y2 (en) 1985-11-05 1985-11-05

Publications (2)

Publication Number Publication Date
JPS6279284U JPS6279284U (en) 1987-05-21
JPH0241659Y2 true JPH0241659Y2 (en) 1990-11-06

Family

ID=31104870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985170283U Expired JPH0241659Y2 (en) 1985-11-05 1985-11-05

Country Status (1)

Country Link
JP (1) JPH0241659Y2 (en)

Also Published As

Publication number Publication date
JPS6279284U (en) 1987-05-21

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