JPH0640590Y2 - プラズマ処理装置 - Google Patents

プラズマ処理装置

Info

Publication number
JPH0640590Y2
JPH0640590Y2 JP1946890U JP1946890U JPH0640590Y2 JP H0640590 Y2 JPH0640590 Y2 JP H0640590Y2 JP 1946890 U JP1946890 U JP 1946890U JP 1946890 U JP1946890 U JP 1946890U JP H0640590 Y2 JPH0640590 Y2 JP H0640590Y2
Authority
JP
Japan
Prior art keywords
wafer
chamber
opening
plasma
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1946890U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03111563U (enrdf_load_stackoverflow
Inventor
宏明 中村
輝雄 山田
照明 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Steel Works Ltd
Original Assignee
Japan Steel Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Steel Works Ltd filed Critical Japan Steel Works Ltd
Priority to JP1946890U priority Critical patent/JPH0640590Y2/ja
Publication of JPH03111563U publication Critical patent/JPH03111563U/ja
Application granted granted Critical
Publication of JPH0640590Y2 publication Critical patent/JPH0640590Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • ing And Chemical Polishing (AREA)
  • Drying Of Semiconductors (AREA)
  • Chemical Vapour Deposition (AREA)
JP1946890U 1990-03-01 1990-03-01 プラズマ処理装置 Expired - Lifetime JPH0640590Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1946890U JPH0640590Y2 (ja) 1990-03-01 1990-03-01 プラズマ処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1946890U JPH0640590Y2 (ja) 1990-03-01 1990-03-01 プラズマ処理装置

Publications (2)

Publication Number Publication Date
JPH03111563U JPH03111563U (enrdf_load_stackoverflow) 1991-11-14
JPH0640590Y2 true JPH0640590Y2 (ja) 1994-10-26

Family

ID=31522584

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1946890U Expired - Lifetime JPH0640590Y2 (ja) 1990-03-01 1990-03-01 プラズマ処理装置

Country Status (1)

Country Link
JP (1) JPH0640590Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH03111563U (enrdf_load_stackoverflow) 1991-11-14

Similar Documents

Publication Publication Date Title
US7255747B2 (en) Coat/develop module with independent stations
US4548699A (en) Transfer plate rotation system
US4776744A (en) Systems and methods for wafer handling in semiconductor process equipment
KR101059307B1 (ko) 도포 현상 장치 및 도포 현상 방법
JP2637730B2 (ja) ウエハ状物品を輸送して少くとも一つの処理工程にかけるための装置及び方法
JP2000195925A (ja) 基板処理装置
KR20010098658A (ko) 기판 처리 장치, 기판 처리 방법 및 반도체 장치의 제조방법
JP2003179121A (ja) 半導体加工装置のためのローディング及びアンローディング用ステーション
US6136168A (en) Clean transfer method and apparatus therefor
JP2000124192A (ja) 真空成膜処理装置および方法
JPH0640590Y2 (ja) プラズマ処理装置
JPH10144774A (ja) 基板保持装置
JPH03285068A (ja) スパッタリング装置
JP3530774B2 (ja) 基板搬送装置、処理装置、基板の処理システムおよび搬送方法
JP2002009131A (ja) 基板処理装置、基板処理方法および半導体装置の製造方法
JPH04314349A (ja) 真空リソグラフィ装置
JPS62264128A (ja) ウエハ真空処理装置
JPS6233745B2 (enrdf_load_stackoverflow)
JP2895505B2 (ja) スパッタリング成膜装置
JP4108896B2 (ja) 成膜装置
JP3578983B2 (ja) 縦型熱処理装置、および被処理体移載方法
JPH01261843A (ja) ウェハースハンドリング用チャック
JPH08125003A (ja) 挟込み式基板搬送アーム
JP2001127135A (ja) 真空処理装置
JPS62204515A (ja) 試料の搬送装置