JPH0639510Y2 - サブラツクの棚式遮蔽板 - Google Patents

サブラツクの棚式遮蔽板

Info

Publication number
JPH0639510Y2
JPH0639510Y2 JP1988141877U JP14187788U JPH0639510Y2 JP H0639510 Y2 JPH0639510 Y2 JP H0639510Y2 JP 1988141877 U JP1988141877 U JP 1988141877U JP 14187788 U JP14187788 U JP 14187788U JP H0639510 Y2 JPH0639510 Y2 JP H0639510Y2
Authority
JP
Japan
Prior art keywords
plate
subrack
shelf type
shield plate
sheet metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988141877U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0173990U (enExample
Inventor
オイゲン、アセル
ブルクハルト、ダスバツハ
ブルーノ、ゲプハルト
Original Assignee
シーメンス、アクチエンゲゼルシヤフト
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by シーメンス、アクチエンゲゼルシヤフト filed Critical シーメンス、アクチエンゲゼルシヤフト
Publication of JPH0173990U publication Critical patent/JPH0173990U/ja
Application granted granted Critical
Publication of JPH0639510Y2 publication Critical patent/JPH0639510Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0062—Structures of standardised dimensions, e.g. 19" rack, chassis for servers or telecommunications
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1424—Card cages
    • H05K7/1425—Card cages of standardised dimensions, e.g. 19"-subrack

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP1988141877U 1987-10-30 1988-10-28 サブラツクの棚式遮蔽板 Expired - Lifetime JPH0639510Y2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE8714497.2 1987-10-30
DE8714497U DE8714497U1 (de) 1987-10-30 1987-10-30 Etagenschirmblech für einen Baugruppenträger

Publications (2)

Publication Number Publication Date
JPH0173990U JPH0173990U (enExample) 1989-05-18
JPH0639510Y2 true JPH0639510Y2 (ja) 1994-10-12

Family

ID=6813608

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988141877U Expired - Lifetime JPH0639510Y2 (ja) 1987-10-30 1988-10-28 サブラツクの棚式遮蔽板

Country Status (7)

Country Link
US (1) US4879434A (enExample)
EP (1) EP0315798B1 (enExample)
JP (1) JPH0639510Y2 (enExample)
AT (1) ATE85182T1 (enExample)
CA (1) CA1310394C (enExample)
DE (2) DE8714497U1 (enExample)
IN (1) IN170256B (enExample)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3928461C3 (de) * 1989-08-29 1997-10-16 Aeg Intermas Gmbh Baugruppenträger
DE8911405U1 (de) * 1989-09-25 1989-11-16 Siemens AG, 1000 Berlin und 8000 München Etagenschirmblech für einen Baugruppenträger
US5218518A (en) * 1989-09-25 1993-06-08 Siemens Aktiengesellschaft Rack mountable box shaped module with conical positioning elements
US5307012A (en) * 1991-12-03 1994-04-26 Intel Corporation Test substation for testing semi-conductor packages
DE4205478C1 (enExample) * 1992-02-22 1993-07-29 Rittal-Werk Rudolf Loh Gmbh & Co Kg, 6348 Herborn, De
DE4205893C1 (en) * 1992-02-26 1993-05-27 Rittal-Werk Rudolf Loh Gmbh & Co Kg, 6348 Herborn, De Module carrier allowing HF screening for all sides - has transverse bars with screw channels for front and rear grooves with threaded bores accepting plates with flanges
DE4215182C2 (de) * 1992-05-08 1995-04-20 Siemens Ag Verfahren zur Herstellung einer elektromagnetisch dichten Halterung von zwei metallischen Bauteilen, und abgeschirmter Baugruppenträger mit derartigen Bauteilen
DE4237447A1 (de) * 1992-11-06 1994-05-11 Licentia Gmbh Baugruppenträger
EP0627876B1 (de) * 1993-06-01 1996-02-28 Siemens Aktiengesellschaft Verfahren zur Herstellung einer elektromagnetisch dichten Halterung von zwei metallischen Bauteilen, und abgeschirmter Baugruppenträger mit derartigen Bauteilen
CH688907A5 (de) 1993-08-30 1998-05-15 Elma Electronic Ag Baugruppentraeger mit Profilleisten und mit Deckplatten.
DE4336071A1 (de) * 1993-10-22 1995-04-27 Philips Patentverwaltung Baugruppenträger
US5920984A (en) * 1993-12-10 1999-07-13 Ericsson Ge Mobile Communications Inc. Method for the suppression of electromagnetic interference in an electronic system
SE503484C2 (sv) * 1994-04-11 1996-06-24 Ericsson Telefon Ab L M Kontaktfjäder
EP0840995B1 (de) * 1995-07-15 1999-03-31 Rittal-Werk Rudolf Loh GmbH & Co. KG Schaltschrank mit rahmengestell und verkleidungselementen
DE29604599U1 (de) * 1996-03-12 1997-04-10 Siemens AG, 80333 München Elektromagnetisch abgeschirmtes Gehäuse mit über eine Kontaktfederleiste verrastbaren metallischen Gehäuseteilen
DE29619565U1 (de) * 1996-11-11 1997-12-18 Siemens AG, 80333 München Baugruppenträger für Leiterplatten mit abgeschirmter Front- und Rückseite
US5858509A (en) * 1996-11-15 1999-01-12 Digital Equipment Corporation Attenuating vibrations in a mounting shelf for multiple disk drives
US5926366A (en) * 1996-11-15 1999-07-20 Digital Equipment Corporation Tab and slot disk drive vibration reduction structure
US6018125A (en) * 1996-11-15 2000-01-25 Collins; Pat Eliot High frequency EMI shield with air flow for electronic device enclosure
EP0866650B1 (de) * 1997-03-22 2003-06-25 Intermas-Elcom GmbH Anordnung zur hochfrequenzdichten Abschirmung
DE29806284U1 (de) 1998-04-06 1998-07-23 Knürr-Mechanik für die Elektronik AG, 81829 München Einrichtung zur Kabelführung
DE29818497U1 (de) 1998-10-16 1999-02-04 Rational GmbH, 86899 Landsberg Kühlplatte mit zumindest einem integrierten elektronischen Bauelement
FR2815778B1 (fr) * 2000-10-23 2002-12-06 Alstom Dispositif de protection d'un connecteur electrique pour plaque de circuit imprime contre les perturbations electromagnetiques
US6900383B2 (en) * 2001-03-19 2005-05-31 Hewlett-Packard Development Company, L.P. Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
US20050095410A1 (en) * 2001-03-19 2005-05-05 Mazurkiewicz Paul H. Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
DE10142497B9 (de) * 2001-08-30 2005-11-17 Siemens Ag Gerätegehäuse eines elektronischen Gerätes zum stationären Einsatz
US6610922B1 (en) 2001-12-20 2003-08-26 Cisco Technology, Inc. Apparatus for securing an electromagnetic shield in a conductive casing
EP2404488A2 (en) * 2009-03-06 2012-01-11 Saint-gobain Performance Plastics Corporation Overlap helical conductive spring
JP5129396B2 (ja) * 2009-03-06 2013-01-30 サン−ゴバン パフォーマンス プラスティックス コーポレイション 直線運動電気コネクタ組立体
RU2504933C2 (ru) * 2009-10-02 2014-01-20 Сэнт-Гобен Перформанс Пластикс Корпорейшн Уплотнение, содержащая его система и способ изготовления уплотнения
US10192846B2 (en) 2014-11-05 2019-01-29 Infineon Technologies Austria Ag Method of inserting an electronic component into a slot in a circuit board
US10064287B2 (en) 2014-11-05 2018-08-28 Infineon Technologies Austria Ag System and method of providing a semiconductor carrier and redistribution structure
US10553557B2 (en) * 2014-11-05 2020-02-04 Infineon Technologies Austria Ag Electronic component, system and method

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB802586A (en) * 1956-02-17 1958-10-08 Ft Products Ltd Improvements relating to fasteners
US3340587A (en) * 1965-11-26 1967-09-12 Herbert K Beyer Method of fabricating shielding enclosures
US3502784A (en) * 1968-09-11 1970-03-24 Scanbe Mfg Corp Gasket
US4114848A (en) * 1975-01-03 1978-09-19 La Telemecanique Electrique Mounting plate
US4716493A (en) * 1985-05-21 1987-12-29 Philip Zelkowitz Electronic instrument housing

Also Published As

Publication number Publication date
CA1310394C (en) 1992-11-17
DE3877900D1 (de) 1993-03-11
EP0315798A1 (de) 1989-05-17
EP0315798B1 (de) 1993-01-27
ATE85182T1 (de) 1993-02-15
DE8714497U1 (de) 1987-12-10
IN170256B (enExample) 1992-03-07
US4879434A (en) 1989-11-07
JPH0173990U (enExample) 1989-05-18

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