JPH0639465Y2 - 発・受光素子 - Google Patents
発・受光素子Info
- Publication number
- JPH0639465Y2 JPH0639465Y2 JP1988163091U JP16309188U JPH0639465Y2 JP H0639465 Y2 JPH0639465 Y2 JP H0639465Y2 JP 1988163091 U JP1988163091 U JP 1988163091U JP 16309188 U JP16309188 U JP 16309188U JP H0639465 Y2 JPH0639465 Y2 JP H0639465Y2
- Authority
- JP
- Japan
- Prior art keywords
- stem
- chip
- receiving element
- cover
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 2
- 238000007789 sealing Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988163091U JPH0639465Y2 (ja) | 1988-12-16 | 1988-12-16 | 発・受光素子 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988163091U JPH0639465Y2 (ja) | 1988-12-16 | 1988-12-16 | 発・受光素子 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0284351U JPH0284351U (enrdf_load_html_response) | 1990-06-29 |
JPH0639465Y2 true JPH0639465Y2 (ja) | 1994-10-12 |
Family
ID=31447504
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988163091U Expired - Lifetime JPH0639465Y2 (ja) | 1988-12-16 | 1988-12-16 | 発・受光素子 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0639465Y2 (enrdf_load_html_response) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102008039147A1 (de) * | 2008-05-30 | 2009-12-03 | Osram Opto Semiconductors Gmbh | Optoelektronisches Modul und optoelektronische Anordnung |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5335414Y2 (enrdf_load_html_response) * | 1974-05-31 | 1978-08-30 | ||
JPS622782Y2 (enrdf_load_html_response) * | 1977-12-21 | 1987-01-22 | ||
JPS6125276Y2 (enrdf_load_html_response) * | 1980-11-17 | 1986-07-29 | ||
JPS58128779A (ja) * | 1982-01-27 | 1983-08-01 | Nec Corp | 半導体装置 |
JPS59101882A (ja) * | 1982-12-03 | 1984-06-12 | Nec Corp | 光半導体装置 |
JPS6196778A (ja) * | 1984-10-17 | 1986-05-15 | Nec Corp | 光フアイバ結合用の発光装置 |
-
1988
- 1988-12-16 JP JP1988163091U patent/JPH0639465Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0284351U (enrdf_load_html_response) | 1990-06-29 |
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