JPH0639345Y2 - 半導体の温度検出装置 - Google Patents
半導体の温度検出装置Info
- Publication number
- JPH0639345Y2 JPH0639345Y2 JP10598787U JP10598787U JPH0639345Y2 JP H0639345 Y2 JPH0639345 Y2 JP H0639345Y2 JP 10598787 U JP10598787 U JP 10598787U JP 10598787 U JP10598787 U JP 10598787U JP H0639345 Y2 JPH0639345 Y2 JP H0639345Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- temperature sensor
- heat sink
- temperature
- attached
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 65
- 239000002184 metal Substances 0.000 claims description 19
- 230000020169 heat generation Effects 0.000 description 12
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10598787U JPH0639345Y2 (ja) | 1987-07-10 | 1987-07-10 | 半導体の温度検出装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10598787U JPH0639345Y2 (ja) | 1987-07-10 | 1987-07-10 | 半導体の温度検出装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6410676U JPS6410676U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-01-20 |
| JPH0639345Y2 true JPH0639345Y2 (ja) | 1994-10-12 |
Family
ID=31339094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10598787U Expired - Lifetime JPH0639345Y2 (ja) | 1987-07-10 | 1987-07-10 | 半導体の温度検出装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0639345Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02197278A (ja) * | 1989-01-24 | 1990-08-03 | Fanuc Ltd | 回生抵抗の異常温度検出装置 |
| JP5407492B2 (ja) * | 2009-03-31 | 2014-02-05 | ダイキン工業株式会社 | 温度センサの取付構造 |
| JP2013229366A (ja) * | 2012-04-24 | 2013-11-07 | Meidensha Corp | 電子部品の固定構造 |
| JP6819163B2 (ja) * | 2016-09-12 | 2021-01-27 | 株式会社デンソーウェーブ | 絶縁型信号伝達装置、電子機器 |
-
1987
- 1987-07-10 JP JP10598787U patent/JPH0639345Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6410676U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-01-20 |