JPH0635475Y2 - フランジ構造 - Google Patents
フランジ構造Info
- Publication number
- JPH0635475Y2 JPH0635475Y2 JP17081087U JP17081087U JPH0635475Y2 JP H0635475 Y2 JPH0635475 Y2 JP H0635475Y2 JP 17081087 U JP17081087 U JP 17081087U JP 17081087 U JP17081087 U JP 17081087U JP H0635475 Y2 JPH0635475 Y2 JP H0635475Y2
- Authority
- JP
- Japan
- Prior art keywords
- flange
- cooling module
- ceramic substrate
- integrated circuit
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Mounting Of Printed Circuit Boards And The Like (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17081087U JPH0635475Y2 (ja) | 1987-11-09 | 1987-11-09 | フランジ構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17081087U JPH0635475Y2 (ja) | 1987-11-09 | 1987-11-09 | フランジ構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0176058U JPH0176058U (cg-RX-API-DMAC7.html) | 1989-05-23 |
| JPH0635475Y2 true JPH0635475Y2 (ja) | 1994-09-14 |
Family
ID=31462073
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17081087U Expired - Lifetime JPH0635475Y2 (ja) | 1987-11-09 | 1987-11-09 | フランジ構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0635475Y2 (cg-RX-API-DMAC7.html) |
-
1987
- 1987-11-09 JP JP17081087U patent/JPH0635475Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0176058U (cg-RX-API-DMAC7.html) | 1989-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0989606B1 (en) | Power module substrate, method of producing the same, and semiconductor device including the substrate | |
| KR950703796A (ko) | 히트싱크를 리드프레임에 열적으로 커플링하는 방법(method for thermally coupling a heat sink to a lead frame) | |
| JP4089493B2 (ja) | 電子制御装置 | |
| JPH0635475Y2 (ja) | フランジ構造 | |
| KR950034715A (ko) | 반도체 다이로부터 열을 제거하기 위한 전자 모듈 및 그 제조 방법 | |
| JP3519755B2 (ja) | 液化ガスタンクの保冷パネル継手構造 | |
| JPS603465A (ja) | 金属ガスケツト | |
| JP2004253495A (ja) | 液冷型電力用半導体モジュール及びそれを包含するインバータ | |
| JP2002368170A (ja) | 冷却器 | |
| JP4631128B2 (ja) | シリンダヘッドガスケット | |
| JPS6281047A (ja) | 半導体装置 | |
| JP2000073860A (ja) | タイミングチェーンケースのシール構造 | |
| KR200452313Y1 (ko) | 금속 와이어 그물망 기반 마이크로구조체를 구비하는 구부릴 수 있는 열분산기 | |
| JP3982947B2 (ja) | ヒートシンクの固定構造 | |
| JPH0648870Y2 (ja) | 集積回路の冷却素子構造 | |
| JPH07147341A (ja) | 容 器 | |
| JP2536925Y2 (ja) | ピストン | |
| JP2000124373A (ja) | ヒートシンクとそれを用いた冷却構造 | |
| JPH11294978A (ja) | 板型ヒートパイプとその実装構造 | |
| JP2513789Y2 (ja) | 金属積層形ガスケット | |
| JPH07176659A (ja) | 半導体装置の冷却構造 | |
| JPH10148123A (ja) | 一体型熱交換器 | |
| JPS62172167A (ja) | 冷蔵庫 | |
| JP2705410B2 (ja) | 燃焼装置 | |
| JP2973953B2 (ja) | Tcpテープ構造 |