JPH06330320A - Vacuum deposition device - Google Patents

Abstract

PURPOSE:To prevent the deterioration and deformation of a substrate by heat and to enable vacuum deposition over a large length with high sticking efficiency by cooling a carrier belt with an electronic cooler in a winding type vacuum deposition device in which the substrate is transferred along the carrier belt. CONSTITUTION:A carrier belt 4 for transferring a polymer substrate 1 is disposed in the vacuum vessel of a vacuum deposition device and electric current is supplied to an electronic cooler 11 fitted to the carrier belt 4 to cool the belt 4 by Peltier effect. The rise of the temp. of the polymer substrate 1 adhering to the carrier belt 4 can be made small and the substrate 1 is not deteriorated and deformed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum vapor deposition apparatus for continuously forming a thin film on a polymer substrate.

[0002]

2. Description of the Related Art In recent years, the application range of thin films has been expanding due to the demand of the times such as resource saving and miniaturization.

In oblique vapor deposition or the like, which is often used to give optical and magnetic anisotropy, only a part of the vaporized material can be deposited on the substrate, which saves resources and high productivity. From the viewpoint of the above, as a method for improving the deposition efficiency of the evaporated material, a method of transporting the polymer substrate by a carrier belt has been tried.

A conventional vapor deposition apparatus will be described below.
FIG. 3 shows the structure of a conventional vacuum vapor deposition apparatus. In FIG. 3, 1 is a polymer substrate, 2.3 is a carrier belt drive shaft, 4 is a carrier belt, 5 is a refractory vessel, 6 is an evaporation material, 7 is a vapor flow, 8 is an electron beam, and 9 is a mask.

The operation of the vacuum vapor deposition apparatus configured as described above will be described below. First, the vaporized material 6 is heated by the accelerated electron beam 8 to generate the vapor flow 7. This vapor flow adheres to the moving substrate 1 which is partially blocked by a mask 9 which limits the angle of incidence on the substrate 1 which is often used in the manufacture of magnetic tape. The polymer substrate 1 is cooled by being in close contact with the carrier belt 4 so that the radiant heat of the evaporation material 6 and the heat of the vapor flow 7 do not increase above the heat resistant temperature.

[0006]

However, in the above-mentioned conventional configuration, the evaporation material 6 does not change with the lapse of time in the vapor deposition process.
There is a problem that the temperature of the carrier belt 4 rises due to the radiant heat from the polymer substrate 1 and the polymer substrate 1 becomes a temperature higher than the heat resistant temperature and is deformed or melted.

The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide a roll-up type vacuum vapor deposition apparatus capable of performing long vapor deposition with high deposition efficiency.

[0008]

In order to achieve this object, a vacuum vapor deposition apparatus of the present invention comprises a belt mechanism for conveying a polymer molded product substrate in a vacuum chamber, an electronic cooling mechanism provided on the belt, It has a configuration including a mechanism for cooling the heat generation side of the electronic cooling mechanism.

[0009]

With this configuration, the carrier belt is cooled by energizing the electronic cooling mechanism provided on the carrier belt, and the temperature rise of the polymer substrate can be suppressed.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 shows the structure of the vacuum vapor deposition apparatus of the present invention. In FIG. 1, 1 is a polymer substrate, 2 and 3 are carrier belt drive shafts, 4 is a carrier belt, 5 is a refractory vessel, 6 is an evaporation material, 7 is a vapor flow, 8 is an electron beam, and 9 is a beam.
Is a mask, 10 is a cooling can, and 11 is an electronic cooler.

The operation of the vacuum vapor deposition apparatus constructed as above will be described. First, the vaporized material 6 is heated by the accelerated electron beam 8 to generate the vapor flow 7. This vapor flow is partially blocked by a mask 9 that limits the incident angle to the polymer substrate 1 that is often used in the manufacture of magnetic tapes, and adheres to the polymer substrate 1 that moves in close contact with the carrier belt 4. The carrier belt 4 is an electronic cooler 11 provided on the opposite side of the surface in contact with the polymer substrate 1.
Is cooled by. Further, the heat generating side of the electronic cooler 11 is brought into contact with the cooling can 10 kept at a constant temperature by water cooling or the like, so that the temperature is kept constant. Next, the operation of the electronic cooler 11 will be described. FIG. 2 is an enlarged view of a part of the carrier belt 4. The electronic cooler 11 shown in FIG. 1 includes an electrode 1 through an insulating layer (not shown) on the carrier belt 4.
2, a P-type semiconductor 14 and an N-type semiconductor 15 are arranged, and the electrode 13 connects the P-type semiconductor 14 and the N-type semiconductor 15 to form a PN junction. If a current is applied to this electronic cooler using a DC power supply 16, heat and heat are generated due to the Peltier effect, and the carrier belt 4 is cooled by selecting the direction of the current. Will also be cooled.

The vacuum vapor deposition apparatus according to this embodiment was compared with the conventional vacuum vapor deposition apparatus by making a trial vapor deposition magnetic tape suitable for high density recording.

The carrier belt is made of a stainless steel plate having a thickness of 0.5 mm, and the thickness is 5 μm along the carrier belt.
A 6000 m long polyethylene terephthalate film is moved at a speed of 120 m / min, and Co8 is deposited on this substrate.
A prototype was formed in which a magnetic layer of 0% -Ni120% and a thickness of 0.2 μm was formed. In this example, the direct current passed through the electronic cooler was set to 100 A, and the cooling can was kept at 5 ° C. by circulating water. As a result, in the comparative example, the polymer substrate was melted due to temperature rise 5 to 10 minutes after the start of vapor deposition. In this example, full length vapor deposition could be performed without any problem.

As described above, according to the present embodiment, by directly cooling the carrier belt electronically, the polymer substrate is efficiently cooled and long vapor deposition is possible, and long vapor deposition with high deposition efficiency. It is possible to provide a roll-up type vacuum vapor deposition device capable of performing the above.

[0016]

As described above, according to the present invention, a belt mechanism for conveying a polymer molded product substrate, an electronic cooling mechanism provided on the belt, and a mechanism for cooling the heat generating side of the electronic cooling mechanism are provided in a vacuum chamber. By providing the above, the temperature rise of the substrate during vapor deposition can be suppressed to a low level, and a roll-up type vacuum vapor deposition apparatus capable of long vapor deposition with high deposition efficiency can be realized.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a vacuum vapor deposition device in an embodiment of the present invention.

FIG. 2 is a configuration diagram for explaining the operation of the electronic cooler in the embodiment of the present invention.

FIG. 3 is a block diagram of a conventional vacuum vapor deposition device.

[Explanation of symbols] 1 polymer substrate 2, 3 carrier belt drive shaft 4 carrier belt 5 refractory container 6 evaporation material 7 vapor flow 8 electron beam 9 mask 10 cooling can 11 electron cooler 12, 13 electrode 14 P-type semiconductor 15 N Type semiconductor 16 DC power supply

Claims (1)

[Claims] 1. A belt mechanism for conveying a polymer molded product substrate in a vacuum chamber, an electronic cooling mechanism provided on the belt,
A vacuum vapor deposition apparatus comprising a mechanism for cooling the heat generating side of an electronic cooling mechanism.