JPH0632695Y2 - 受光装置 - Google Patents

受光装置

Info

Publication number
JPH0632695Y2
JPH0632695Y2 JP3363087U JP3363087U JPH0632695Y2 JP H0632695 Y2 JPH0632695 Y2 JP H0632695Y2 JP 3363087 U JP3363087 U JP 3363087U JP 3363087 U JP3363087 U JP 3363087U JP H0632695 Y2 JPH0632695 Y2 JP H0632695Y2
Authority
JP
Japan
Prior art keywords
light receiving
light
receiving element
receiving device
outer peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3363087U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63140649U (US07655688-20100202-C00086.png
Inventor
吉美 稲葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP3363087U priority Critical patent/JPH0632695Y2/ja
Publication of JPS63140649U publication Critical patent/JPS63140649U/ja
Application granted granted Critical
Publication of JPH0632695Y2 publication Critical patent/JPH0632695Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape
JP3363087U 1987-03-06 1987-03-06 受光装置 Expired - Lifetime JPH0632695Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3363087U JPH0632695Y2 (ja) 1987-03-06 1987-03-06 受光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3363087U JPH0632695Y2 (ja) 1987-03-06 1987-03-06 受光装置

Publications (2)

Publication Number Publication Date
JPS63140649U JPS63140649U (US07655688-20100202-C00086.png) 1988-09-16
JPH0632695Y2 true JPH0632695Y2 (ja) 1994-08-24

Family

ID=30841415

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3363087U Expired - Lifetime JPH0632695Y2 (ja) 1987-03-06 1987-03-06 受光装置

Country Status (1)

Country Link
JP (1) JPH0632695Y2 (US07655688-20100202-C00086.png)

Also Published As

Publication number Publication date
JPS63140649U (US07655688-20100202-C00086.png) 1988-09-16

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