JPH0632686Y2 - 半導体チップ用ウェハの取付け装置 - Google Patents

半導体チップ用ウェハの取付け装置

Info

Publication number
JPH0632686Y2
JPH0632686Y2 JP1988158689U JP15868988U JPH0632686Y2 JP H0632686 Y2 JPH0632686 Y2 JP H0632686Y2 JP 1988158689 U JP1988158689 U JP 1988158689U JP 15868988 U JP15868988 U JP 15868988U JP H0632686 Y2 JPH0632686 Y2 JP H0632686Y2
Authority
JP
Japan
Prior art keywords
wafer
support member
magnet
pressing
force
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1988158689U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0279036U (US07582779-20090901-C00044.png
Inventor
薫 楠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP1988158689U priority Critical patent/JPH0632686Y2/ja
Publication of JPH0279036U publication Critical patent/JPH0279036U/ja
Application granted granted Critical
Publication of JPH0632686Y2 publication Critical patent/JPH0632686Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Jigs For Machine Tools (AREA)
JP1988158689U 1988-12-06 1988-12-06 半導体チップ用ウェハの取付け装置 Expired - Fee Related JPH0632686Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988158689U JPH0632686Y2 (ja) 1988-12-06 1988-12-06 半導体チップ用ウェハの取付け装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988158689U JPH0632686Y2 (ja) 1988-12-06 1988-12-06 半導体チップ用ウェハの取付け装置

Publications (2)

Publication Number Publication Date
JPH0279036U JPH0279036U (US07582779-20090901-C00044.png) 1990-06-18
JPH0632686Y2 true JPH0632686Y2 (ja) 1994-08-24

Family

ID=31439240

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988158689U Expired - Fee Related JPH0632686Y2 (ja) 1988-12-06 1988-12-06 半導体チップ用ウェハの取付け装置

Country Status (1)

Country Link
JP (1) JPH0632686Y2 (US07582779-20090901-C00044.png)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6287385B1 (en) * 1999-10-29 2001-09-11 The Boc Group, Inc. Spring clip for sensitive substrates

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5844848U (ja) * 1981-09-21 1983-03-25 日本電気株式会社 半導体ウエハ−固定用治具

Also Published As

Publication number Publication date
JPH0279036U (US07582779-20090901-C00044.png) 1990-06-18

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees