JPH06304854A - Method and device for duplex surface grinding - Google Patents

Abstract

PURPOSE:To ensure high grinding accuracy by forcing a workpiece rotated regardless of its thickness, in duplex surface grinding. CONSTITUTION:Grinding resistance force, generated when a workpiece W is ground, is utilized to press the workpiece peripheral surface Wa to peripheral frictional surfaces of friction wheels 15, 16 rotated in outside positions of grinding wheels 1, 2, and by friction resistance force between these friction wheels 15, 16 and workpiece W, the workpiece W is forced to rotate. In this way, a drive system for driving the workpiece W rotated can be arranged in the outside of the grinding wheels 1, 2, and duplex surface grinding, using a forced rotating method from a very thin workpiece to a general workpiece regardless of thickness, is realized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided surface grinding method and apparatus, and more particularly, to a double-sided surface grinding machine, which is used for ultra-thin workpieces such as hard disk substrates for OA equipment and wafers for electronic parts. The present invention relates to a technique suitable for grinding both sides.

[0002]

2. Description of the Related Art Generally, a workpiece (hereinafter referred to as a work)
As a flat finishing method for the above, polishing processing (precision processing) such as lapping and polishing is performed. However, due to the processing mechanism, the processing efficiency of these precision processing is not so good, and rapid processing is required. It is a processing method that is not suitable for the workpiece.

For this reason, for a work which requires a quick processing, a grinding work by a surface grinder is generally performed. Fig. 7 shows an example of the grinding section of a surface grinder.
This grinder is a vertical double-headed surface grinder used to grind both sides of a work.
b, and a carrier disc c passing between the two grinding wheels a and b. The carrier disc c is provided with a plurality of pockets d for accommodating and holding the work W at predetermined intervals in the circumferential direction. There is. Reference characters e and f indicate the bases of the upper and lower grinding wheels a and b, respectively.

The pocket d of the carrier disk c,
When the carrier disk c is rotationally driven in the arrow direction at a predetermined speed while holding the workpieces W in d, ..., Each workpiece W sequentially drives the upper and lower grinding wheels a and b that are rotationally driven at high speed. While continuously feeding through (through feed),
Both surfaces thereof are configured to be ground.

Although not shown, the work W, which requires higher precision and higher grinding accuracy, has a structure in which the work W itself is forcibly rotated in addition to the movement of the carrier disk c. As the surface grinding method, in addition to the rotary carrier method as described above, an in-feed method in which the work W is fed between the two grinding wheels a and b, or an oscillating in which an oscillation action is added thereto There are feed methods and the like, but the basic grinding mechanism is the same as above.

[0006]

By the way, recently, OA
With the rapid development of equipment, the demand for double-sided grinding of ultra-thin workpieces such as hard disk substrates and wafers for electronic components, which are the component parts of the equipment, has increased the following problems. There is.

As the thickness of the work W is reduced (for example, in the case of a glass hard disk substrate, the diameter is 65 mm and the thickness is about 0.8 mm), the carrier disk c holding the work W is held. Whereas the thickness also needs to be made thinner than this, the material of the conventional general carrier disk c does not have strength when it is thin (for example, 0.6 mm or less).

In this regard, as disclosed in Japanese Patent Laid-Open No. 1-92065, a carrier circle formed by arranging a fiber reinforced resin layer having excellent abrasion resistance on both sides of a steel plate as a mechanical strength retaining material. Since the plate c has been developed, the problem of thinning the carrier disk c itself has been solved for the time being.

However, in the case of the work W such as a hard disk substrate, not only the extremely thin work but also higher grinding accuracy is required, and it is necessary to provide the above-mentioned structure for forcibly rotating the work W itself. However, the conventional structure could not be applied to a double-sided surface grinder for such an extremely thin work W. That is, in the conventional work forced rotation structure, the drive system is also the carrier disk c.
Along with it, it is configured so as to pass through the gap between the upper and lower grinding wheels a and b.
Since the gap between them was extremely narrow, it was structurally impossible to manufacture.

The present invention has been made in view of the above conventional problems, and an object thereof is to forcibly rotate a workpiece in double-sided surface grinding regardless of the thickness of the workpiece. By doing so, it is an object of the present invention to provide a double-sided surface grinding method and device capable of ensuring high grinding accuracy.

[0011]

In order to achieve the above object, the double-sided surface grinding method of the present invention holds the outer peripheral surface of the work or this work by utilizing the grinding resistance force generated during the work grinding. It is characterized in that the work holding jig outer peripheral surface is pressed against the outer peripheral friction surface of the friction wheel that rotates at the outer position of the grinding wheel to forcibly rotate the workpiece.

A first double-sided surface grinding apparatus of the present invention is an apparatus for carrying out the above-mentioned grinding method, and is a carrier that holds a workpiece between the grinding wheel surfaces of a pair of grinding wheels provided facing each other. In a double-sided surface grinding machine in which the means can be passed through or inserted, a friction wheel and a drive mechanism for rotating the workpiece are arranged outside the grinding wheel, and a circular workpiece can be rotated in the carrier means. Is provided with a work pocket for storing and holding therein, and a communication portion is provided at a peripheral portion of the work pocket, and the outer peripheral surface of the circular workpiece stored and held in the work pocket is provided through the communication portion. It is characterized in that it is capable of abutting and engaging with the outer peripheral friction surface of the friction wheel.

A second double-sided surface grinding apparatus of the present invention is an apparatus for carrying out the above-mentioned grinding method, which is a carrier holding a workpiece between the grinding wheel surfaces of a pair of grinding wheels provided facing each other. In the double-sided surface grinding device means is passable or insertable, in the outer position of the grinding wheel, a friction wheel for driving the workpiece and its drive mechanism are arranged, in the jig circular hole of the carrier means, A circular workpiece holding jig that holds a non-circular workpiece is rotatably accommodated and held, and a communication portion is provided in the peripheral portion of the jig circular hole, and the jig circular shape is provided through this communication portion. It is characterized in that the outer peripheral surface of the circular work holding jig housed and held in the hole is capable of abuttingly engaging with the outer peripheral friction surface of the friction wheel.

[0014]

In the present invention, by utilizing the grinding resistance force generated during the grinding of the workpiece, the friction of rotating the outer peripheral surface of the workpiece or the outer peripheral surface of the work holding jig for holding the workpiece at the outer position of the grinding wheel. The workpiece is pressed against the outer peripheral friction surface of the vehicle, and the workpiece is forcibly rotated by the frictional resistance between the friction wheel and the workpiece.

For this reason, it is possible to dispose a drive system for rotating the workpiece outside the grinding wheel, and regardless of the wall thickness, a forced rotation method can be applied from an extremely thin workpiece to a general workpiece. The double-sided surface grinding used is realized.

[0016]

Embodiments of the present invention will be described below with reference to the drawings.

Example 1 A double-sided surface grinder according to the present invention is shown in FIGS. 1 and 2.
This grinder specifically grinds both sides of an ultra-thin work W such as a hard disk substrate of an office automation equipment simultaneously by an oscillating infeed method.
2 are arranged vertically independently of each other, and a work support device 3 for loading and unloading the work W between the grinding wheels 1 and 2 is arranged outside the grinding wheels 1 and 2. There is.

The two grinding wheels 1 and 2 are so-called cup type grinding wheels, and the grinding wheel surfaces 1a and 2a thereof are flat surface grinding surfaces, and are arranged so as to face each other and parallel to each other. There is. The rotating spindles 4 and 5 of the grinding wheels 1 and 2 are linked to a drive source via a power transmission mechanism such as a gear mechanism (not shown). Both whetstone surfaces 1
The interval dimension H between a and 2a is set to the final thickness dimension of the work W (for example, about 0.8 mm for a glass hard disk substrate, about 2.0 mm for an aluminum hard disk substrate). At the same time, the rotary main shafts 4 and 5 are moved in the axial direction (vertical direction) so that they can be adjusted appropriately.

The work supporting device 3 is provided with a swing arm 6, a carrier plate (carrier means) 7, a work rotating part 8 and the like as main parts.

The swinging arm 6 inserts / retracts the carrier plate 7 between the grinding wheels 1 and 2 and at the same time,
In between, the oscillator is operated. The swinging arm 6 has a swinging shaft 9 linked to a drive source via a power transmission mechanism such as a gear mechanism (not shown), and is swingable in the horizontal direction. The swing shaft 9 is a hollow cylindrical shaft as shown in FIG. 2, and a work drive shaft 20 described later is concentrically provided therein.

The carrier plate 7 holds the work W and is attached and fixed to the lower surface of the swing arm 6.
The work holding portion 7a is moved from the swing arm 6 to the grinding wheels 1 and 2.
This work holding portion 7a is projected in the lateral direction.
In addition, one work pocket 10 for storing and holding the work W is provided. The work pocket 10 has a circular contour corresponding to the outer shape of the work W, and its inner diameter is set to be slightly larger than the outer diameter of the work W. Further, a communication portion 10a is provided in a part of the periphery of the work pocket 10 so that the peripheral portion of the work W faces the outside of the work pocket 10 from here.

The work holding portion 7a having the work pocket 10 is swung by the swing arm 6 in FIG. 1, and the work retracting position (two-dot chain line position) outside the grinding wheels 1 and 2 and the grinding wheel 1 are shown in FIG. And 2 work grinding position (solid line position)
And a slewing operation between them and an oscillating operation at this work grinding position.

For this purpose, the carrier plate 7 is formed of a material having excellent mechanical strength and abrasion resistance, and the thickness dimension thereof is the distance dimension H between the grindstone surfaces 1a and 2a.
That is, it is set to be thinner than the final finished thickness dimension of the work W. For example, if the workpiece W has a final finished thickness dimension of about 0.8 mm, the thickness dimension of the carrier plate 7 is 0.
It is set to about 6 mm.

In connection with this, a surface plate 11 provided on the fixed side is provided below the carrier plate 7,
The flat upper surface 11a slidably supports the lower surface of the carrier plate 7. As shown in FIG. 2, the upper surface 11a of the surface plate 11 is set at substantially the same height as the grinding wheel surface 2a of the lower grinding wheel 2, and functions as a reinforcing portion of the carrier plate 7 and the work pocket 10 described above. Work W held by
Function as a guide surface.

The work rotating part 8 is for forcibly rotating the work W housed and held in the work pocket 10 of the carrier plate 7, and is mounted on the swing arm 6 and also has a pair of friction wheels 15, 16. And a drive mechanism 17 for rotationally driving them and the drive mechanism 17 as main parts.

The pair of friction wheels 15 and 16 includes a swing arm 6
1 is rotatably supported by support shafts 19a and 19b, and its arrangement position is such that the work holding portion 7a of the carrier plate 7 is at the work grinding position (solid line position in FIG. 1) as shown in FIG. ), The outer positions of the grinding wheels 1 and 2 are set to be located close to the outer peripheral edge of the grinding wheels.

In other words, these friction wheels 15, 16
As shown in FIG. 3, the outer peripheral friction surfaces 15a, 16a
To contact the contour of the inner peripheral surface of the work pocket 10,
They are arranged at intervals. As a result, the outer peripheral surface Wa of the work W in the work pocket 10 can be brought into contact with and engaged with the outer peripheral friction surfaces 15a and 16a of the friction wheels 15 and 16 at the same time via the communicating portion 10a.

The drive mechanism 17 comprises a work drive shaft 20 and a gear train 21. The work drive shaft 20 is provided inside the swing shaft 9 of the swing arm 6 described above.
It is provided concentrically with and is linked to a drive source via a power transmission mechanism such as a gear mechanism (not shown) so as to be rotatable about a vertical axis.

The gear train 21 is specifically composed of five transmission gears 25 to 29 that mesh with each other. First transmission gear 25
Is fixed to the upper end of the work drive shaft 20. The second transmission gear 26 that meshes with the first transmission gear 25
Is pivotally supported on the swing arm 6 via a support shaft 30 and meshes with a third transmission gear 27 mounted and fixed on the support shaft 19a of the friction wheel 15. Also, this third
The fourth transmission gear 28 that meshes with the transmission gear 27 has a support shaft 31.
It is pivotally supported on the swinging arm 6 via and is meshed with the fifth transmission gear 29 mounted and fixed on the support shaft 19b of the friction wheel 16. As a result, when the work drive shaft 20 is rotationally driven, the two friction wheels 15 and 16 are rotationally driven via the gear train 21.

In the double-sided surface grinder constructed as described above, the work W is automatically or manually operated in the work pocket 10 at the work retreat position of the carrier plate 7 (the position indicated by the chain double-dashed line in FIG. 1). When stored and held in
The oscillating arm 6 oscillates in the arrow X direction while the friction wheels 15 and 16 of the work rotating unit 8 are rotationally driven at a constant rotational speed. As a result, the carrier plate 7 is rotated to a position between the upper and lower grinding wheels 1 and 2 which are rotationally driven at a high speed, that is, a work grinding position (position indicated by a chain double-dashed line in FIG. 1), and is oscillated at this position to work W. Both surfaces are subjected to surface grinding by the grinding wheel surfaces 1a and 2a of the above grinding wheels 1 and 2.

At this time, the work W is moved in the radial direction (arrow Z direction) of the grinding wheels 1 and 2 by the component force of the grinding resistance force generated when the work W is ground, as shown in FIG.
Is the outer peripheral surface Wa of the friction wheels 15 and 16.
a, 16a. As a result, while the workpiece W is forcibly rotated in the arrow direction, the surface grinding is performed by the grindstone surfaces 1a and 2a, and high grinding accuracy is secured.

When the work W receives grinding resistance from the grinding wheels 1 and 2, the work W is rotated in either direction as it is. The friction wheels 15 and 16 are rotated more than the rotational force due to the grinding resistance. Since the rotational force due to is stronger, constant rotation control of the work W according to the rotational direction and rotational speed of the friction wheel is realized.

When the grinding of one work W is completed as described above, the swing arm 6 swings in the arrow Y direction, and the carrier plate 7 is swung to the work retreat position. Then, when a succeeding work is newly stored and held in place of the work W in the work pocket 10, the same operation is repeated again thereafter.

Embodiment 2 This embodiment is shown in FIG. 4, and is provided with a structure in which a deformed work, that is, a non-circular work W is surface-ground on both sides while being forcedly rotated.

That is, the work holding portion 7 of the carrier plate 7
A circular hole for jig 40 similar to the work pocket 10 of the first embodiment is provided in a, and a circular work holding jig 41 is rotatably held therein. A communication portion 40a is provided in a part of the peripheral edge of the jig circular hole 40 so that the outer peripheral portion of the circular workpiece holding jig 41 faces the outside of the jig circular hole 40. Further, the circular work holding jig 41 is provided with a work pocket 42 for storing and holding a non-circular work W (a rectangular work in the illustrated example).

When the carrier plate 7 is rotated to the workpiece grinding position shown in the figure, the circular workpiece holding jig 41 for holding the workpiece W is held by the component force of the grinding resistance force generated when the workpiece W is ground. The outer peripheral surface 41a is moved in the radial direction (arrow Z direction) of the grinding wheels 1 and 2 and pressed against the outer peripheral friction surfaces 15a and 16a of the friction wheels 15 and 16. As a result, the circular work holding jig 41, that is, the work W
While being forcibly rotated in the direction of the arrow, surface grinding is performed by the grindstone surfaces 1a and 2a. Other configurations and operations are similar to those of the first embodiment.

By appropriately changing the shape of the work pocket 42 of the circular work holding jig 41, surface grinding can be performed on various non-circular works W other than the illustrated example.

Embodiment 3 This embodiment is shown in FIGS. 5 and 6, in which both sides of an ultra-thin work W are simultaneously ground by a through-feed system while being forcedly rotated, and they are arranged outside the grinding wheels 1 and 2. The work supporting device 3 is provided with a carrier disk 45 that is rotationally driven as a carrier means, and has a structure suitable for mass-producing a large number of works W, W, ... At the same time.

That is, the work supporting device 3 is provided with the carrier disk 45, the carrier rotating portion 46, the work rotating portion 47 and the like as main parts.

The carrier disk 45 holds the work W, and its material and thickness conditions are the same as those of the carrier plate 7 of the first embodiment. The carrier disk 45 is slidably rotatably arranged on a flat upper surface 50a of a surface plate 50 provided on the fixed side via drive gears 51, 51, 51 of a carrier rotating unit 46 described later. There is. Upper surface 5 of surface plate 50
0a is set at substantially the same height as the grinding wheel surface 2a of the lower grinding wheel 2, functions as a reinforcing portion of the carrier plate 7, and is a work W held in a work pocket 52 described later.
Function as a guide surface.

The shape of the carrier disc 45 is a substantially annular shape having a circular opening in the center as shown in FIG. 5, and a work pocket 52 for accommodating and holding a work W in the circumferential direction thereof.
Are provided at a predetermined interval (eight in the illustrated example). A part of the outer peripheral portion of the carrier disk 45 is shown in FIG.
It is set so as to pass between the upper and lower grinding wheels 1 and 2, as shown in FIG. In this regard, a part of the surface plate 50 is provided with an arcuate recess 50b along the outer periphery of the lower grinding wheel 2.

The work pocket 52 has a circular contour corresponding to the outer shape of the work W and a linear portion, and its inner diameter is set to be slightly larger than the outer diameter of the work W. Further, a communication portion 52a that communicates with the circular opening is provided on the peripheral edge of the work pocket 52 on the inner diameter side of the carrier disk 45, and the peripheral portion of the work W is exposed from here to the outside of the work pocket 52. .

The carrier rotating portion 46 includes three drive gears 5
1, 51, 51, and a driven gear 53 provided on the outer peripheral portion of the carrier disk 45. The drive gears 51, 51, 51 are horizontally rotatably supported on the surface plate 50 via the support shafts 51a at positions equidistantly arranged on the outer circumference of the carrier disc 45, and the carrier disc 45 is driven by the driven gears 51, 51, 51. It meshes with the gear 53 to support the outer periphery of the carrier disk 45.

Further, the support shaft 51a of each drive gear 51 described above.
Are linked to a drive shaft 55 arranged at the axial center position of the carrier disk 45 via a common transmission belt 54. The drive shaft 55 is a hollow cylinder shaft shown in the drawing, and a work drive shaft 61, which will be described later, is concentrically provided therein.

The drive shaft 55 is linked to a drive source via a power transmission mechanism such as a gear mechanism (not shown). When the drive shaft 55 is rotationally driven, its rotational force is transmitted to the three drive gears 51, 51, 51 via the transmission belt 54, and the rotation of these drive gears causes the carrier disk 45 to pass through the driven gear 53. While being supported by three points, it is rotationally driven (workpiece feed) in the arrow X direction.

The work rotating part 47 is mounted on the surface plate 50 and includes one friction wheel 60 arranged in the central opening of the carrier disc 45 and a work drive shaft 61 for rotating and driving the friction wheel 60. It is provided as a main part, and in the illustrated example, the two works W, W held by the carrier disk 45 are forcibly rotated simultaneously.

The work drive shaft 61 is provided inside the drive shaft 55 of the carrier disk 45 concentrically with the drive shaft 55, and is linked to a drive source via a power transmission mechanism such as a gear mechanism (not shown). And is rotatable about a vertical axis. The friction wheel 60 is attached and fixed to the upper end of the work drive shaft 61, and is rotationally driven concentrically with the carrier disc 45.

The outer peripheral friction surface 60a of the friction wheel 60
Is the outer peripheral surface Wa of the work W in each work pocket 52.
However, it is possible to abut and engage via the communication portion 52a. In relation to this, an inclined guide portion (inclined portion) 65 that is inclined to face the outer peripheral friction surface 60a of the friction wheel 60 is formed on the peripheral edge portion of the work pocket 52, and as described later, It is configured so as to facilitate the movement in the direction of the friction wheel 60.

The work W housed and held in each work pocket 52 of the carrier disc 45 is rotationally driven at high speed as the carrier disc 45 rotates in the feed direction (arrow X direction). While being fed through the position between the upper and lower grinding wheels 1 and 2, that is, the work grinding position, surface grinding is performed on the both surfaces by the grinding wheel surfaces 1a and 2a of the grinding wheels 1 and 2.

At this time, the friction wheel 60 of the work rotating part 47 is also rotationally driven at a constant rotational speed, and the two works W, W at the grinding position are each divided by the component force of the grinding resistance force generated during the grinding. Is guided by the inclined guide portion 65 of the work pocket 52 and moved in the center direction (arrow Z direction) of the friction wheel 60, and the outer peripheral surfaces Wa, W of the works W, W are moved.
The a is pressed against the outer peripheral friction surface 60a of the friction wheel 60.
As a result, the workpieces W and W are forcedly rotated in the arrow direction while the surface grinding by the grindstone surfaces 1a and 2a is performed.

The workpieces W, W, which have been ground as described above, are moved as the carrier disk 45 rotates,
The work is taken out from the work pockets 52, 52 at a predetermined work taking-out position, and instead, the following work is newly stored and held, and the same operation is repeated thereafter.
Other configurations and operations are similar to those of the first embodiment.

The carrier disk 45 can be driven continuously or intermittently by controlling the rotation of the drive shaft 55, and in the case of intermittent driving, it is possible to add a constant oscillating motion.

Further, in the illustrated example, the two workpieces W, W are structured such that they are brought into contact with and engaged with the friction wheel 60 at the same time. However, the contact relationship between the friction wheel 60 and the workpiece W is It can be increased or decreased as appropriate depending on the shape of the object W, the carrier disc 45 or the friction wheel 60, or other conditions.

Furthermore, Examples 1 to 3 described above merely show preferred embodiments of the present invention, and the present invention is not limited to this, and various design changes can be made within the scope thereof.

For example, the present invention, as described above, particularly
It is most suitable for highly accurate grinding of both surfaces of an ultra-thin work W such as a hard disk substrate of an A-equipment or a wafer for electronic parts, but of course it can be applied to conventional general work grinding.

Further, the relative rotation direction / speed of the upper and lower grinding wheels 1 and 2 in each of the first to third embodiments, or the relative rotation direction / speed of these grinding wheels 1 and 2 and the carrier means 7, 45. The above can be variously set without being limited to this, and in that case, the same effects as those obtained in the above-described first to third embodiments can be obtained.

[0057]

As described in detail above, according to the present invention,
Using the grinding resistance force generated during grinding of the work piece, the work piece outer peripheral surface or the work piece holding jig outer peripheral surface for holding the work piece is pressed against the outer peripheral friction surface of the friction wheel rotating at the outer position of the grinding wheel, Since the workpiece is forcibly rotated by the frictional resistance force between the friction wheel and the workpiece, it is possible to dispose the drive system for rotating the workpiece outside the grinding wheel.

Therefore, regardless of the wall thickness,
An extremely thin work piece (for example, about 0.1 mm to 1.0 mm) to a work piece having a general thickness (for example, a thickness of 5 mm)
Double-sided surface grinding using the forced rotation method can be realized up to about 10 mm). In particular, a remarkable effect (particularly greatly contributing to the improvement of flatness) is exhibited in high precision grinding of both surfaces of an extremely thin workpiece such as a hard disk substrate of OA equipment or a wafer for electronic parts.

[Brief description of drawings]

FIG. 1 is a schematic plan view showing a double-sided surface grinder that is Embodiment 1 of the present invention with an upper grinding wheel omitted.

FIG. 2 is a cross-sectional view showing the grinder along line II-II in FIG.

FIG. 3 is an enlarged plan view for explaining a mechanism of forced rotation of a work in the grinding machine.

FIG. 4 is an enlarged plan view corresponding to FIG. 3, showing a double-sided surface grinder that is Embodiment 2 of the present invention.

FIG. 5 is a schematic plan view showing a double-sided surface grinding machine according to a third embodiment of the present invention with an upper grinding wheel omitted.

FIG. 6 is an enlarged plan view for explaining a mechanism of forced rotation of a work in the grinding machine.

FIG. 7 is a schematic perspective view showing a conventional double-sided surface grinder.

[Explanation of sign]

Z Work movement direction W Work Wa Work outer peripheral surface H Vertical grinding wheel surface distance dimension (workpiece final finishing thickness dimension) 1 Upper grinding wheel 1a Upper grinding wheel grinding wheel surface 2 Lower grinding wheel 2a Lower grinding wheel grinding wheel surface 3 work support device 6 swing arm 7 carrier plate (carrier means) 7a work holding part of carrier plate 8 work rotating part 9 swing shaft 10 work pocket 10a communication part of work pocket 15,16 friction wheel 15a, 16a of friction wheel Outer peripheral friction surface 17 Drive mechanism 40 Circular hole for jig 40a Communication part of circular hole for jig 41 Circular work holding jig 41a Outer peripheral surface of circular work holding jig 42 Work pocket 45 Carrier disc (carrier means) 46 Carrier rotation Part 47 Work rotation part 52 Work pocket 52a Work pocket communication part 60 Friction wheel 60a Outer circumference of friction wheel Friction surface 65 Work pocket slope guide (slope)

Claims (4)

[Claims] 1. In a double-sided surface grinding method in which carrier means holding a workpiece can be passed through or inserted between the grinding wheel surfaces of a pair of grinding wheels provided opposite to each other, a grinding resistance force generated at the time of grinding a workpiece. By utilizing the outer peripheral surface of the workpiece or the outer peripheral surface of the work holding jig that holds the workpiece against the outer peripheral friction surface of the friction wheel that rotates at the outer position of the grinding wheel, the workpiece is forcibly rotated. A double-sided surface grinding method characterized in that 2. A double-sided surface grinding machine in which carrier means holding a workpiece can be passed through or inserted between the grindstone surfaces of a pair of grindstone wheels provided facing each other, at a position outside the grindstone wheel. At least one friction wheel for rotationally driving the workpiece and its drive mechanism are arranged, and the carrier means is provided with a work pocket for rotatably storing and holding the circular workpiece, and a communication portion is provided at a peripheral portion of the work pocket. Is provided, and the outer peripheral surface of the circular workpiece housed and held in the work pocket is capable of abuttingly engaging with the outer peripheral friction surface of the friction wheel through the communication portion. Double-sided surface grinding machine. 3. One of the friction wheels is arranged at an outer position of the grinding wheel, and an outer peripheral surface of a plurality of circular workpieces can be abutted and engaged with an outer peripheral friction surface of the friction wheel at the same time. Item 2
The double-sided surface grinding machine described in. 4. A double-sided surface grinding apparatus in which carrier means holding a workpiece can be passed through or inserted between the grindstone surfaces of a pair of grindstone wheels provided facing each other. A friction wheel for driving the workpiece to rotate and a drive mechanism therefor are arranged. A circular workpiece holding jig for holding a non-circular workpiece is rotatably accommodated and held in the jig circular hole of the carrier means. A communication part is provided in the peripheral portion of the jig circular hole, and the outer peripheral surface of the circular work holding jig housed and held in the jig circular hole is connected to the outer peripheral friction surface of the friction wheel through the communication part. A double-sided surface grinding device, which is capable of abutting engagement.