JPH06302945A - Element mounting method and equipment - Google Patents

Abstract

PURPOSE:To realize a mounting method for bonding elements while uniformly applying pressure without single abutting, by arranging an indenter of high rigidity on each element, and bonding elements while pressurizing the indenters en bloc by a diaphragm. CONSTITUTION:Indenters 3a, 3b, 3c are bonded to a diaphragm 2 so as to correspond to the positions of semiconductor packages 4a, 4b, 4c which are mounted on a board 5. The thickness of each indenter is so designed that the distance between the board 5 and the diaphragm 2 becomes constsnt. By generating hydrostatic pressure in the inside of a cylinder block 1 and the diaphragm 2, pressurizing force is generated on each indenter which force is proportional to the bonding area to the diaphragm 2. Thereby bonding load is applied to each semiconductor package via each indenter. Hence solder spread on the bonding parts of the semiconductor packages 4a, 4b, 4c and the board 5 is fused by heat supplied from a hot-air generating equipment 6, and a plurality of semiconductor packages can be mounted en block on a board.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting method and apparatus for bonding an element to a substrate while uniformly pressing it without touching it.

[0002]

2. Description of the Related Art As a conventional mounting method, for example, Japanese Patent Laid-Open No.
A method using a copying mechanism using a spherical bearing as in JP-A-111633 and a method using deformation of an elastic material as in JP-A-03-225937 have been proposed.

[0003]

However, the method using the spherical bearing has a problem that the copying mechanism does not work well when the size of the element is small and the amount of moment generated by one-side contact is small. In addition, the method using an elastic material has a problem that it is impossible to apply a uniform load because the elastic deformation amount varies when the height of the element is inclined.

In addition, both methods use one device on the substrate.
Since it is a mechanism that presses and bonds only one piece, it is inevitable that productivity decreases when a plurality of elements are mounted on the substrate.

[0005]

In order to solve the above-mentioned problems, a mounting method for bonding a plurality of elements to a substrate according to the present invention while applying a predetermined load to the board is to arrange an indenter having high rigidity on each element. It is characterized in that the indenter is joined while being pressed together by a diaphragm.

[0006]

[Operation] By using a diaphragm for the pressure mechanism,
The variation in height of each element of the element is absorbed by the deformation of the diaphragm. Further, by inserting a highly rigid indenter between the element and the diaphragm, the hydrostatic pressure in the diaphragm is converted into a vertical pressing force to the element, and a uniform load is applied to each element.

[0007]

Embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1) FIG. 1 is a schematic view showing an embodiment in which the present invention is applied to solder mounting of a substrate and a semiconductor package. The cylinder block 1 is provided with a diaphragm 2, and the indenters 3a, 3b, corresponding to the positions of the semiconductor packages 4a, 4b, 4c mounted on the substrate 5,
3c is bonded to the diaphragm 2. The thickness of each indenter is designed according to the height of each semiconductor package so that the distance between the substrate 5 and the diaphragm 2 is constant.
Further, the bonding area of each indenter with the diaphragm 2 is designed to be proportional to the bonding load applied to each element.

The cylinder block 1 is filled with a fluid such as air or oil, and a hydrostatic pressure is generated inside the cylinder block 1 and the diaphragm 2 by a mechanism (an air compressor, an air-hydro converter, etc.) not shown. As a result, a pressing force proportional to the bonding area with the diaphragm 2 is generated in each indenter, and a bonding load is applied to each semiconductor package through each indenter. Variations in the height of each component due to the lead forming error of the semiconductor package are absorbed by the deformation of the diaphragm. Even if the semiconductor package is tilted as shown in FIG. 2, the indenter follows the tilt of the semiconductor package due to the deformation of the diaphragm, and a vertical load is applied to the semiconductor package due to the hydrostatic pressure generated inside the cylinder block 1. It is possible to pressurize uniformly without hitting.

The solder applied to the joints between the semiconductor packages 4a, 4b, 4c and the substrate 5 is melted by the heat supplied from the hot air generator 6. With the above configuration, a plurality of semiconductor packages can be collectively mounted on the substrate.

(Embodiment 2) FIG. 3 is a schematic view showing another embodiment of the present invention. The indenters 3a, 3b, 3c are fixed to the indenter mounting plate 7, and are installed between the diaphragm 2 and the semiconductor packages 4a, 4b, 4c. As shown in FIG. 4, the indenter mounting plate 7 is provided with slits 8a, 8b, 8c, and 8d around each indenter, so that it is possible to absorb height variations and inclinations of the semiconductor package parts. There is. Besides the present embodiment, the shape of the slit can be arbitrarily designed according to the height variation and the degree of inclination to be absorbed. Alternatively, the indenter mounting plate 7 may be replaced by the diaphragm 2
The slit may not be provided by using the same material as.

According to this structure, since it is not necessary to bond the diaphragm and the indenter, the materials of the diaphragm and the indenter can be freely selected. Further, when switching models, it is only necessary to replace the mounting plate 7 to which the indenter 3 is fixed, and the model switching performance is improved compared to the first embodiment.

(Embodiment 3) FIG. 5 is a schematic view showing another embodiment of the present invention. The element mounted on the substrate is bare chip I
As shown in C, the parallelism of the parts is ensured, and it is applied when only the height variation of each part is absorbed.

The indenters 3a, 3b, 3c correspond to the positions of the bare chip ICs 9a, 9b, 9c, and the indenter holding block 1 is provided.
It is held at 0 so that it can move up and down. Here, the parallelism of the vertical movement axis of each indenter in the indenter holding block 10 and the perpendicularity of the contact surface with the bare chip IC based on the vertical movement axis of each indenter are ensured, and the load is applied vertically to each bare chip IC. Is added. The variation in height of each element of the element is absorbed by the deformation of the diaphragm 2. If the distance between the bare chip ICs is sufficiently wide, a linear bearing such as a cross roller guide may be used on the sliding surface between each indenter and the indenter holding block 10.

(Embodiment 4) FIG. 6 is a schematic view showing another embodiment of the present invention. It is applied when a bare chip IC is bonded to a transparent substrate with a photocurable adhesive.

A transparent substrate 11 is installed on a transparent pedestal 12,
The bare chip ICs 9a, 9b, 9c are pressed by the same pressing mechanism as in the first embodiment. A light energy irradiation device (not shown) is provided below the transparent pedestal 12, and the light energy is transmitted from the lower side of the figure to the transparent pedestal 1.
2. The adhesive is cured by passing through the transparent substrate 11 and irradiating the bonding surface. A mask 13 is provided on the transparent pedestal 12 in order to prevent light energy from leaking to a portion other than the bonding portion.

[0017]

According to the present invention, a plurality of elements can be collectively mounted on a substrate. In addition, it is possible to uniformly apply a predetermined load to each element by absorbing height variation and inclination of each element of the element. Due to these effects, mounting with high productivity and excellent bonding reliability is possible.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing a first embodiment of the present invention.

FIG. 2 is a first embodiment of the present invention showing the effect of the present invention.
Partial view of.

FIG. 3 is a schematic diagram showing a second embodiment of the present invention.

FIG. 4 is a partial view showing slits of an indenter mounting plate in Embodiment 2 of the present invention.

FIG. 5 is a schematic diagram showing a third embodiment of the present invention.

FIG. 6 is a schematic diagram showing a fourth embodiment of the present invention.

[Explanation of symbols]

 1 cylinder block 2 diaphragm 3, 3a, 3b, 3c indenter 4, 4a, 4b, 4c semiconductor package 5 substrate 6 hot air generator 7 indenter mounting plate 8a, 8b, 8c, 8d slit 9a, 9b, 9c bare chip IC 10 indenter holding Block 11 Transparent substrate 12 Transparent pedestal 13 Mask

Claims (6)

[Claims] 1. In a mounting method for bonding a plurality of elements to a substrate while applying a predetermined load, a pressurizing component having high rigidity (hereinafter referred to as an indenter) is arranged on each element, and the indenter is a diaphragm. An element mounting method characterized in that bonding is performed while applying pressure collectively. 2. The device mounting method according to claim 1, wherein hot air is used as the bonding energy between the substrate and the device. 3. The device mounting method according to claim 1, wherein light energy is used as a bonding energy between the substrate and the device. 4. A mounting apparatus for bonding a plurality of elements to a substrate while applying a predetermined load, and comprising a highly rigid indenter arranged corresponding to each element position and a diaphragm for collectively pressing the indenter. The device mounting apparatus comprises: a pressing unit that is provided; and a bonding unit that applies energy for bonding the substrate and the device. 5. The element mounting device according to claim 4, wherein the substrate and the element are joined by blowing hot air to the joining portion between the substrate and the element. 6. The device mounting apparatus according to claim 4, wherein the substrate and the device are bonded by irradiating the bonding portion between the substrate and the device with light energy.