JPH06296929A - Ink coating method on inside surface of hole in plate material - Google Patents

Abstract

PURPOSE:To provide an ink coating method for the inside surface of a hole in a plate material by which the printing is continuously carried out and the working hour is shortened by coating on the inside surface of a hole with an ink, while the plate material is transported. CONSTITUTION:A part of a letterpress roller 21 is inserted in the hole 15 of the plate material 14 and ink 20 is applied on the inside surface of the hole 15 by utilizing a speed difference between a circumferential speed A of the letterpress roller 21 and a feeding speed B of the plate material 14, while the plate material 14 is fed in the forward direction against the rotary direction of the letterpress roller 21.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for applying ink to the inner surface of a hole of a plate material for printing through holes such as through holes.

[0002]

2. Description of the Related Art Conventionally, when a conductive or insulating ink is applied to the inner surface of a through hole formed in a plate material such as a substrate, vacuum suction by a screen printing method has been generally used. That is, the plate material (workpiece) placed on the surface plate
By setting a screen mask on, screen printing the desired ink into the through holes of the plate material, and further sucking the ink in the through holes to the surface plate side with a vacuum pump,
Ink can be applied to the inner surface of the through hole.

[0003]

However, the above-mentioned conventional ink application method requires a cycle time of the screen printing machine of at least 5 seconds, and continuous printing cannot be performed, so that the speed cannot be increased. was there.

The present invention has been made in view of the above problems of the prior art, and an object of the present invention is to provide a method for applying ink to the inner surface of the hole of a plate material capable of performing continuous printing and shortening the working time. It is in.

[0005]

SUMMARY OF THE INVENTION The above-mentioned object of the present invention is to insert a part of a relief roller whose outer peripheral surface is supplied with ink into a through hole of a plate material and rotate the relief roller at a peripheral speed A. While feeding the plate material in the forward direction with respect to the rotation direction of the relief roller at the feed speed B, and when applying ink to the inner surface of the through hole on the front side in the feed direction, A> B is satisfied, When applying ink to the inner surface of the through hole on the rear side in the feeding direction, it is achieved by setting A <B.

[0006]

According to the above means, when the peripheral speed A of the relief roller is higher than the feed speed B of the plate material, the ink on the outer peripheral surface of the relief roller is scraped off at the front edge of the through hole of the plate material in the feed direction. Since it is possible to apply the ink to the inner surface of the through hole on the front side in the feeding direction, the peripheral speed A
Is smaller than the feed speed B, the ink on the outer peripheral surface of the relief roller can be scraped off by the edge of the through hole of the plate material in the feed direction, so that the ink is applied to the inner surface of the through hole in the feed direction on the back side. Can be made. Therefore, the ink of the relief roller can be continuously applied to the inner surfaces of the large number of through holes while the plate material is continuously supplied to the printing machine, and the printing speed can be increased.

[0007]

Embodiments of the present invention will be described below with reference to FIGS. Here, FIG. 1 is a manufacturing process diagram of the jumper chip according to the embodiment, FIG. 2 is a cross-sectional view showing an insulating ink applying process in the manufacturing process of the jumper chip, and FIG. 3 is a work content of the manufacturing process of the jumper chip. The flowchart shown in FIG. 4 is a perspective view of a finished product of the jumper chip.

The jumper chip 10 shown in FIG. 4 has a rectangular parallelepiped metal substrate 11 made by plating nickel on the upper and lower surfaces of an iron plate as a base material, and the entire surface of the metal substrate 11 excluding both sides is made of epoxy resin or the like. An insulating film 12 made of an insulating ink is applied and formed, and solder plating layers 13 are plated on both sides of the metal substrate 11. These solder plating layers 13 are soldered to a pattern to be short-circuited. It is used as an electrode for. That is, when the jumper chip 10 is mounted on a printed circuit board (not shown), the jumper chip 10 is placed at a position bridging a pair of patterns facing each other across a gap on the printed circuit board, Part of the solder plating layer 13 and each pattern are soldered. As a result, both of the patterns on the printed circuit board are short-circuited via the jumper chip 10, and the other patterns located in the gap between the two patterns face the insulating film 12 to prevent undesired short-circuiting. You can do it.

Next, a method of manufacturing the jumper chip 10 will be described.

First, a metal hoop material 14 having both surfaces plated with nickel is prepared, and the metal hoop material 14 is mounted on a reel stand (not shown) and a hole is formed while supplying a hoop, and a length of 1.2 mm. , 1.1 mm square hole 1
5 and a long hole 16 having a width of 0.6 mm and a length of 2 mm are shown in FIG.
A large number of holes are drilled in the arrangement as shown in FIG. In addition, the reference numeral 17 in FIG.
In the chip area used as the metal substrate 11, the chip area 17 is sandwiched between two rectangular holes 15 and 15 on the left and right sides and between two elongated holes 16 and 16 on the top and bottom sides.

Next, with respect to the metal hoop material 14, a narrow crosspiece 18 located between two adjacent square holes 15 and 15.
Is crushed in the thickness direction by about 0.1 mm to facilitate the insertion of a later-described relief roller into the square holes 15 and 15, and both sides of the metal hoop material 14 are deburred by a deburring machine (not shown) to 0.0
Grinding is performed for about 5 mm to remove the sagging during the drilling process, and then the metal hoop material 14 is washed to remove the working oil and shavings.

The next step is ink application by the relief printing method and curing thereof, and as shown in FIG. 1B, a row of square holes 15 and a row of long holes 16 are formed on both sides of the metal hoop material 14. The insulating film 12 is applied and formed on the inner surface (the right inner surface or the left inner surface) of each square hole 15 on the side that becomes the end surface of the chip region 17 and the right inner surface and the left inner surface of each elongated hole 16. These insulating films 12 are formed by curing an insulating ink applied by a roller coating method in a UV curing oven (not shown). For example, the coating operation on the inner surface of the square hole 15 is shown in FIG. As described above, a part of the letterpress roller 21 to which the insulating ink 20 is supplied to the outer peripheral surface by the transfer roller 19 is inserted into the two square holes 15 and 15 arranged side by side with the crosspiece 18, and the letterpress roller is It is performed while rotating 21 in the forward direction with respect to the feeding direction of the metal hoop material 14. That is, when the insulating film 12 is formed on the inner surface of the square hole 15 on the front side in the feeding direction, as shown in FIG. 2A, the peripheral velocity A of the relief roller 21 is higher than the feeding velocity B of the metal hoop material 14. It is set to be larger so that the insulating ink 20 on the outer peripheral surface of the relief roller 21 can be scraped off at the upper edge of the right side of the square hole 15 (front side in the feeding direction).
After the insulating ink 20 is applied to the right inner surface of the figure, the metal hoop material 14 is supplied to the UV curing furnace to cure the insulating ink 20 to form the insulating film 12. Further, when forming the insulating film 12 on the inner surface of the square hole 15 on the rear side in the feeding direction, as shown in FIG. 2B, the peripheral speed A of the letterpress roller 21 is set to be lower than the feeding speed B of the metal hoop material 14. Smaller, square hole 1
5 is set so that the insulating ink 20 on the outer peripheral surface of the relief roller 21 can be scraped off at the upper edge on the left side (rear side in the feeding direction) in the figure, and the insulating ink 20 is formed on the inner surface on the left side in the figure of the square hole 15.
After being applied, it is cured to form the insulating film 12.

Similarly, the insulating film 12 can be formed by applying and curing the insulating ink 20 on the inner surface of each slot 16 on the front side and the rear side in the feeding direction. After the insulating film 12 is formed on the necessary portions of the long holes 16, the insulating film 12 is formed by applying and curing the insulating ink of the letterpress roller on the necessary portions of both surfaces of the metal hoop material 14, respectively.

Since the size of the square hole 15 along the feeding direction of the metal hoop material 14 is as small as 1.1 mm, when the letterpress roller 21 is inserted into one square hole 15, the insulating ink 20 is applied to the inner surface. However, in this embodiment, the cross-section 18 is crushed in advance so that the relief roller 21 can be inserted deeply by using the two square holes 15, 15. Further, if the edges of the square holes 15 and the long holes 16 disappear due to sagging during the drilling process, the insulating ink 20 may not be scraped sufficiently and the coating amount may be insufficient. Since the drainage is removed by means of, the edges of the square holes 15 and the long holes 16 are easily secured for the insulating ink 20. Therefore, in this embodiment, the insufficient amount of the insulating ink 20 applied to the inner surface of the hole is unlikely to occur, and the insulating film 12 having a sufficient thickness can be reliably formed.

Now, after the insulating film 12 is applied and formed on the predetermined portion of the metal hoop material 14 in this manner, the hoop is supplied and dipped into a molten solder bath (not shown) for dip soldering. As shown, insulating film 12
A solder plating layer 13 is formed on the metal surface not covered with the solder. By performing such dip soldering, the chip area 17 of the metal hoop material 14 is solder-plated on both side portions adjacent to the elongated hole 16 including the end face (inner surface of the elongated hole 16). Further, the slit-shaped elongated hole has a drawback that the solder tends to be clogged because the molten solder easily forms an undesired film due to the surface tension.
Since the insulating film 12 is previously formed on a part of the inner surface of the 6 mm long hole 16, the insulating film 12 serves as a solder resist layer, and a film of molten solder is not formed in the long hole 16. It is not necessary to remove the excess solder in the slot 16 using an air knife or a vacuum nozzle after the dip soldering process. That is, on the inner surface of the slit-shaped long hole 16, the insulating ink 20 is previously formed at both end portions in the length direction.
Since the insulating film 12 formed by applying the solder plating layer is formed, the slot 16 is formed in the dip soldering process only on the upper inner surface and the lower inner surface on the side that becomes the end surface of the chip region 17 in FIG. 1C. There is no concern that the elongated holes 16 will be plugged with solder because the holes 13 are formed.

Then, after the flux is washed after the dip soldering, the metal hoop material 14 is sent to a press machine (not shown), and as shown in FIG.
The single jumper chip 10 is pulled out from the metal hoop material 14 by cutting the part connecting the square hole 15 and the long hole 16 around the. As described above with reference to FIG. 4, the jumper chip 10 thus obtained has a rectangular parallelepiped metal substrate 11 in which the chip region 17 of the metal hoop material 14 is punched out, and all the metal substrate 11 except both side portions thereof. It is composed of an insulating film 12 provided on the surface and a solder plating layer 13 as an electrode provided on both sides of the metal substrate 11. After being removed from the metal hoop material 14, it can be directly tape-packaged.

As described above, in the above embodiment, the letterpress roller 21 is used.
Using the speed difference between the peripheral speed of the metal hoop material and the feeding speed of the metal hoop material 14, the metal hoop material 14 is continuously supplied to the printing machine, and ink is continuously supplied to the inner surface of each square hole 15 or each long hole 16. Since it can be applied to the ink, the printing work can be speeded up compared to the conventional method of applying ink to the inner surface of the hole by screen printing and vacuum suction.
Productivity can be increased.

Although the above embodiment describes printing on the inner surface of the hole of the metal plate, the present invention is also applicable to printing on the inner surface of the hole of a plate material other than metal.

[0019]

As described above, by utilizing the speed difference between the peripheral speed of the relief roller and the feeding speed of the plate material, the ink on the outer peripheral surface of the relief roller is applied to the inner surface of the through hole of the plate material. According to the invention, unlike the conventional method in which screen printing is performed, it is possible to continuously perform printing on the inner surface of the hole while feeding the plate material, so that the work time of the printing process can be shortened and contributes to productivity improvement. It's big.

[Brief description of drawings]

FIG. 1 is a manufacturing process diagram of a jumper chip according to an embodiment.

FIG. 2 is a cross-sectional view showing an ink applying step in the manufacturing process of the jumper chip.

FIG. 3 is a flowchart showing work contents of a manufacturing process of the jumper chip.

FIG. 4 is a perspective view of a finished product of the jumper chip.

[Explanation of symbols]

 10 Jumper Chip 12 Insulating Film 13 Solder Plating Layer 14 Metal Hoop Material 15 Square Hole 16 Long Hole 20 Insulating Ink 21 Letterpress Roller

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Teruo Nishikawa 1-7 Yukiya Otsukacho, Ota-ku, Tokyo Alps Electric Co., Ltd.

Claims (1)

[Claims] 1. In a printing step of applying ink to the inner surface of a through hole formed in a plate material, a part of a relief roller whose ink is supplied to the outer peripheral surface is inserted into the through hole of the plate material, and the relief roller is inserted. When the plate material is fed in the forward direction with respect to the rotation direction of the relief roller at a feed speed B while rotating at a peripheral speed A, and ink is applied to the inner surface of the through hole on the front side in the feed direction. Is A> B, and when ink is applied to the inner surface on the rear side in the feeding direction of the through-hole, A <B is set, and the ink is applied to the inner surface of the hole of the plate material.