JPH054543U - Multi-sided printed wiring board - Google Patents

Abstract

(57) [Abstract] [Purpose] The present invention is to improve the component mounting efficiency by changing the imposition of the printed wiring board. [Structure] The front and back patterns are impositioned on one side of the printed wiring board so that they are reversed symmetrically. After the one-sided process is completed, the printed wiring board is turned over, and the same process is repeated again to mount it on both sides and then divide it. Complete.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a printed wiring board by an imposition method that is efficient in mounting components on a laminated printed wiring board.

[0002]

[Prior Art]

 Conventionally, the method of imposing a plurality of the same printed wiring boards is to mount the electronic components P1 and P2 by using the same pattern “A and A” as a set on one surface of two wiring boards as shown in FIG. The printed wiring board Q is rotated about the X axis of the center line to mount the electronic components P3 and P4 in the B pattern as shown in FIG. 7 and reflow soldering is performed. In such imposition, one side is mounted and then the other side is mounted and the other side is mounted. As shown in FIG. 6 and FIG. 7, the mounting components on the front and back sides are different, so the printed wiring board Q was reversed. At this time, after mounting the parts for the B pattern on the A pattern line before mounting, or when the parts are not replaced, the line for B pattern in FIG. 7 is newly used for mounting. ..

[0003]

[Problems to be solved by the device]

 However, in the imposition according to the conventional technology, the mounted components differ depending on the surface, so it is necessary to perform the component setup change work of the automatic component mounter, and in order to increase the mounting efficiency without performing the setup work, the equipment of the new line must be installed. It had the drawback of requiring investment and equipment costs. Further, if the number of parts of the patterns A and B is significantly different, the mounting time is different due to the difference, and the mounting efficiency is determined by the line that takes much time to complete the mounting.

An object of the present invention is to realize a printed wiring board having improved component mounting efficiency by improving the imposition of the printed wiring board without extra capital investment.

[0005]

[Means for Solving the Problems]

 The present invention is characterized in that, in a printed wiring board for multi-sided mounting, patterns of a plurality of surfaces of the printed wiring board are placed on the same surface.

[0006]

[Action]

 In the present invention, by mounting the front surface and the back surface on the same surface to mount on one side, the printed wiring board is inverted and the other surface is flushed on the same line, so that both surfaces can be mounted.

[0007]

【Example】

 In FIG. 1, electronic components P1 and P2 having an A pattern and electronic components P3 and P4 having a B pattern are provided on one surface of a printed wiring board Q with an X axis, which is a rotation center in a later step, as a boundary. .. Further, the printed wiring board Q is turned upside down around the X axis, and the pattern of A and B becomes the same as that of FIG. 1 as shown in FIG.

FIG. 3 is a diagram for explaining a component mounting process on both sides according to the present invention for each process. The printed wiring board Q is completed by a method of mounting SMDs (surface mount components) on both sides by SMT (surface mount technology) and soldering both sides by reflow as the density of mounted components increases. In step 1 to step 2 in which two identical wiring boards A and B are placed on the same surface, cream solder is printed, in step 3 SMD parts are mounted, and in step 4, soldering is performed by reflow, The printed wiring board Q is inverted about the central X-axis, and parts are mounted on the opposite side on steps 5, 6 and 7. Is completed. In the prior art, after soldering on one side and reversing, the same line solder paste printing machine and automatic component mounting machine are used. Had to be implemented in the same way, or in another newly installed equipment line. According to the present invention, when imposition is performed as shown in FIG. 1 and the X-axis is inverted as shown by the arrow, the wiring board becomes as shown in FIG. Can be completed.

4 and 5 show another embodiment according to the present invention. In FIG. 4, when the Y axis is used as a boundary, patterns A and A are backside B on the upper side, patterns C and C are backside D on the lower side, and they are inverted around the X axis. , B, C, and D are configured, and after the components are mounted, they are divided with the X axis and the Y axis as boundaries. As a result, four substrates are completed by combining two different patterns. This can be done with two or more sheets of two types if the imposition is symmetrical so that the X-axis is the center of rotation and the patterns A, B, C, and The same arrangement can be obtained by arranging D as shown in the figure, and a convenient arrangement can be selected depending on the shape of the wiring board.

Although the embodiments according to the present invention have been described with respect to a double-sided wiring board, the same can be applied to a wiring board having a multi-layer laminate structure.

[0011]

[Effect of the device]

 According to the present invention, in the printed wiring board for double-sided surface mounting, by mounting the front surface and the back surface of the substrate on the same surface, there is no need for capital investment and component changeover of the automatic component mounting machine, and the components for the wiring board are eliminated. Since mounting becomes possible, the manufacturing process is simplified, and there are no time lags in the mounting process in many ways, which is a great advantage in improving productivity.

[Brief description of drawings]

FIG. 1 is an imposition view showing an embodiment of the present invention.

FIG. 2 is a view showing the present invention after being inverted.

FIG. 3 is a process diagram of a component mounting process of the present invention.

FIG. 4 is an imposition view showing another embodiment of the present invention.

FIG. 5 is an imposition view showing another embodiment of the present invention.

FIG. 6 is an imposition view of a conventional printed wiring board.

FIG. 7 is a diagram after the conventional printed wiring board is reversed.

[Explanation of symbols]

 Q: Printed wiring board P1 to P4: SMD electronic components A to D: Pattern X axis: Center of rotation when reversing the wiring board Y axis: Boundary line

Claims (1)

[Claim 1] A printed wiring board for multi-surface mounting, wherein a pattern of a plurality of surfaces of the printed wiring board is imprinted on the same surface.