JPH01202892A - Printed circuit board - Google Patents

Abstract

PURPOSE:To decrease the sum of equipment investment and the area of the occupied floor of the factory, by providing mounting surfaces rotationally- symmetrical with respect to an axis of the surface of a wiring board passing through the center of a plurality-manufactured printed circuit board from which a plurality of double-sided component boards are produced. CONSTITUTION:A component board 11 is provided rotationally-symmetrical with respect to an axis 13 of the surface of a wiring board passing through the center of a printed circuit board 12. Therefore, both surfaces of said printed circuit board 12 are of the same pattern and component arrangement. That is, the fitting of the part on both surfaces of the printed circuit board 12 can be completed by the two same procedures for each surface with a set of parts fitting equipments for one surface having only one kind of tools assortment. This decreases the sum of equipment investment and the development investment for product, shortens the non-operating time of the set of parts fitting equipments, and lowers the costs of products.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for arranging individual circuit boards in a printed wiring board for mounting double-sided components with multiple components.

[Conventional technology]

In conventional multi-chip printed wiring boards, the method of arranging the individual boards has been the type 2a method shown in the TFF2 diagram and the TSA diagram.

That is, first, as shown in FIGS. 2(a) and 2(b), the individual substrates 1 are arranged on the same surface, in the same direction, and at the same intervals. The purpose of this arrangement method is to facilitate the handling of boards during work when installing components such as soldering when the dimensions of individual boards are small or the aspect ratio is large.
This is also to improve work efficiency.

Second, as shown in FIGS. 3(a) and 3(b), the individual substrates 1 are arranged 180° rotationally symmetrically with respect to an axis 3 passing through the center of the printed wiring board 2 and perpendicular to the wiring board.

The purpose of this arrangement method is to
To reduce the amount of discarded portions of a printed wiring board and to facilitate handling.

(Problem to be Solved by the Invention) However, in the above-mentioned prior art, when parts are to be attached such as soldering on both sides of a printed wiring board, two sets of parts are attached, one for mounting the front side parts and the other for mounting the back side parts. This required a group of equipment, which led to problems such as increased equipment investment and increased factory floor area.On the other hand, for the installation of single-sided parts in the - group, a group of equipment was used, and the tool settings for two mttt were alternately set. When mounting parts on both sides of a printed wiring board, it is necessary to change the tool setting from the front side tool setting to the back side tool setting or vice versa for each flow unit. Part mounting reduces the availability of the equipment group, and there is a risk that new human errors will occur for each flow unit regarding the quality of part mounting.
There were problems with product quality.

The present invention is intended to solve these problems, and its purpose is to provide a printed layout that allows parts to be mounted on both sides by using a set of devices and by setting one type of tool! The goal is to realize the structure of H.

[Means to solve the problem]

The printed wiring board of the present invention is a printed wiring board for multi-layer double-sided component loading, in which the side substrates are arranged rotationally symmetrically with respect to a certain axis in the plane of the wiring board passing through the center of the printed wiring board. Features.

[Embodiment] FIG. 1 is a diagram showing an embodiment of the present invention, in which an individual substrate 1
1 are arranged rotationally symmetrically with respect to an axis 13 passing through the center of the printed wiring board 12 and within the plane of the wiring board. By arranging the individual boards as shown in FIG. 1, this printed wiring board exhibits the same shape and component arrangement whether viewed from the front or the back.

In other words, with this printed wiring board, a set of single-sided components with one type of tool setting can be mounted using a group of devices, and parts can be mounted twice on the first and second sides through a process. Installation can be completed. Therefore, when it comes to individual boards, it is possible to attach a set of single-sided parts with one type of tool setting using a group of devices, even if the parts are arranged differently on the front and back sides. The method for arranging individual boards in a printed wiring board according to the present invention can be applied to a printed wiring board for double-sided component mounting having one or more layers (11 layers).

〔Effect of the invention〕

As described above, according to the present invention, individual boards are arranged rotationally symmetrically with respect to one axis inside the printed wiring board that passes through the center of the printed wiring board. One set of parts can be installed on one side using a device group, and parts can be installed twice on the front and back through a process.a) - Installation of parts on a set can be achieved using a device group and one type of tool setting, so equipment investment is reduced. The amount of development costs and individual product development costs can be reduced, contributing to lower product costs.

b) Since there is no need to change tool settings on the front and back sides during flow, component attachment reduces the non-operating time of the equipment group and improves the operating rate, which helps reduce product costs.

C) Similarly, there is no need to change tool settings, which eliminates human error and improves product quality.

d) Product development costs are reduced and equipment operating rates are improved, making it possible to build a complete equipment group for parts installation that supports high-mix, medium- and low-volume production.

[Brief explanation of the drawing]

FIG. 1(a) and FIG. 1(b) are layout diagrams of the present invention. 11...Individual board 12...Printed wiring board 13...Axis of symmetry that's all Applicant: Seiko Epson Corporation Notebook 1 diagram (α) Akira 1 diagram (shi) Figure 2 (α) tears

Claims (1)

[Claims] (1) In a printed wiring board for mounting on both sides that can be divided into a plurality of individual boards by forming a circuit on an insulating board and then cutting and separating the parts after mounting them, the inside of the wiring board surface passing through the center of the printed wiring board A printed wiring board characterized in that individual circuit boards are arranged rotationally symmetrically with respect to a certain axis.