JPH05152710A - Surface mounting structure of printed wiring board - Google Patents

Surface mounting structure of printed wiring board

Info

Publication number
JPH05152710A
JPH05152710A JP31275491A JP31275491A JPH05152710A JP H05152710 A JPH05152710 A JP H05152710A JP 31275491 A JP31275491 A JP 31275491A JP 31275491 A JP31275491 A JP 31275491A JP H05152710 A JPH05152710 A JP H05152710A
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
imposition
mounting
surface mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31275491A
Other languages
Japanese (ja)
Inventor
Fumio Haruhara
文夫 春原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP31275491A priority Critical patent/JPH05152710A/en
Publication of JPH05152710A publication Critical patent/JPH05152710A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PURPOSE:To obtain surface mounting structure of printed wiring boards wherein machine balance after surface mounting is improved although mounting balance of a printed wiring board is imperfect as a single body. CONSTITUTION:The title structure has a structure wherein the same number of the surfaces 1 and the rears 2 of printed wiring boards mixedly exist on the single surface after surface mounting.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は両面実装用プリント配線
板の面付け構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a double-sided mounting printed wiring board imposition structure.

【0002】[0002]

【従来の技術】従来の両面実装用プリント配線板の面付
け構造は、図2に示す様にプリント配線板の表面又は裏
面のどちらか一方の面が面付け後の片面に揃う様に面付
けされていた。
2. Description of the Related Art As shown in FIG. 2, a conventional double-sided mounting printed wiring board has an imposition structure such that either the front surface or the back surface of the printed wiring board is aligned with one surface after the imposition. It had been.

【0003】[0003]

【発明が解決しようとする課題】しかし両面実装用プリ
ント配線板の実装部品は、プリント配線板の使われる製
品構造上からの制約や、プリント配線板の配線上からの
制約等により、表面と裏面の部品数及び種類のバランス
(以下実装バランスと称す)がとれない物が多い。
However, the mounting parts of the double-sided printed wiring board are mounted on the front surface and the back surface due to the restrictions on the product structure in which the printed wiring board is used and the restrictions on the wiring of the printed wiring board. There are many things that cannot balance the number of parts and types (hereinafter referred to as mounting balance).

【0004】そのため従来の技術では面付け後のプリン
ト配線板をチップマウンター等の自動実装装置で実装す
る時に、図2の表面視図である図2(a)に示す表面の
実装部品3を実装する装置のリードタイムと、図2の裏
面視図である図2(a)に示す裏面の実装部品4を実装
する装置のリードタイムのバランス(以下マシンバラン
スと称す)がとれず、装置の稼働率が悪いという欠点を
有していた。
Therefore, according to the prior art, when mounting a printed wiring board after imposition with an automatic mounting device such as a chip mounter, the mounting component 3 on the surface shown in FIG. 2A, which is a front view of FIG. 2, is mounted. The balance between the lead time of the device to be mounted and the lead time of the device to mount the backside mounting component 4 shown in FIG. 2A, which is a back view of FIG. It had the disadvantage of poor rate.

【0005】そこで本発明はこのような課題を解決する
もので、その目的とするところは単体でのプリント配線
板の実装バランスは悪くても、面付け後のマシンバラン
スが良くなるプリント配線板の面付け構造を提供すると
ころに有る。
Therefore, the present invention is intended to solve such a problem, and an object of the present invention is to provide a printed wiring board in which the machine balance after imposition is improved even if the mounting balance of the printed wiring board as a single unit is poor. There is an imposition structure.

【0006】[0006]

【課題を解決するための手段】本発明の両面実装用プリ
ント配線板の面付け構造は、前記プリント配線板の表面
と裏面が面付け後の片面に同数ずつ混在する事を特徴と
する。
The imposition structure of a double-sided printed wiring board according to the present invention is characterized in that the same number of front and back surfaces of the printed wiring board are mixed on one side after imposition.

【0007】[0007]

【実施例】以下、図面を用いて本発明を具体的に説明す
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically described below with reference to the drawings.

【0008】図1は本発明の一実施例であるプリント配
線板の面付け構造をしめす平面図である。図1(a)は
表面視図、図1(b)は裏面視図である。図中1は単体
でのプリント配線板の表面が面付け後の表面に来る様に
面付けしたプリント配線板を、2は単体でのプリント配
線板の裏面が面付け後の表面に来る様に面付けしたプリ
ント配線板を、3は単体でのプリント配線板の表面に実
装される部品を、4は単体でのプリント配線板の裏面に
実装される部品をそれぞれ示している。1と2は単体で
は同じプリント配線板を表裏反転して面付けしたもので
ある。
FIG. 1 is a plan view showing an imposition structure of a printed wiring board which is an embodiment of the present invention. 1A is a front view and FIG. 1B is a rear view. In the figure, 1 is the printed wiring board that is mounted so that the surface of the printed wiring board as a single body is the surface after imposition, and 2 is that the back surface of the printed wiring board as a single body is the surface after imposition. The imposition printed wiring board, 3 is a component mounted on the front surface of a single printed wiring board, and 4 is a component mounted on the back surface of a single printed wiring board. As for 1 and 2, the same printed wiring board is impositioned by turning it over.

【0009】図1の様に単体では表面に実装される部品
3と裏面に実装される部品4の数がことなり実装バラン
スの悪いプリント配線板を、単体でのプリント配線板の
表面が面付け後の表面に来る様に面付けしたプリント配
線板1と、単体でのプリント配線板の裏面が面付け後の
表面に来る様に面付けしたプリント配線板2が同数とな
る様に面付けすることにより、例えば1と2を一枚ずつ
面付けすると、面付け後表面に実装される部品は図1
(a)に示す様に3と4を合計した数となる。一方面付
け後の裏面に実装される部品は図1(b)に示す様に4
と3を合計した数となる。ここで1と2は単体では同じ
プリント配線板であることから、面付け後の表面と裏面
の実装部品は、同じ種類の部品が同じ数だけ配置される
ため実装バランスが最も良い形とすることができる。
As shown in FIG. 1, the number of components 3 mounted on the front surface and the number of components 4 mounted on the back surface are different from each other. Imposition is performed so that the same number of printed wiring boards 1 are arranged so that they come to the front surface and printed wiring boards 2 that are arranged so that the back surface of a single printed wiring board comes to the surface after imposition. Therefore, for example, if 1 and 2 are impositioned one by one, the components mounted on the surface after imposition will be
As shown in (a), the total number is 3 and 4. On the other hand, the components mounted on the back surface after imposition are 4 as shown in Fig. 1 (b).
And the total is 3. Since 1 and 2 are the same printed wiring board as a single unit, the mounted components on the front and back surfaces after imposition are the same number of the same number of components, so the mounting balance should be the best. You can

【0010】尚本実施例では1と2が一枚ずつであった
が、同数であれば何枚でも可能である。
In this embodiment, 1 and 2 are provided one by one, but any number can be used as long as the numbers are the same.

【0011】[0011]

【発明の効果】以上説明したように本発明によれば、両
面実装用プリント配線板の表面と裏面が面付け後の片面
に同数混在する用に面付けすることにより、単体での実
装バランスが悪いプリント配線板であっても、面付けに
より実装バランスの最も良い形とすることができる為、
実装装置のマシンバランスが良くなり、稼働率が上がる
という効果を有する。
As described above, according to the present invention, by imposing the front and back surfaces of a double-sided mounting printed wiring board in the same number on one side after imposition, the mounting balance of a single unit is improved. Even if the printed wiring board is bad, the shape with the best mounting balance can be obtained by imposition.
This has the effects of improving the machine balance of the mounting apparatus and increasing the operating rate.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例であるプリント配線板の面付
け構造を示す平面図である。
FIG. 1 is a plan view showing an imposition structure of a printed wiring board that is an embodiment of the present invention.

【図2】従来のプリント配線板の面付け構造を示す平面
図である。
FIG. 2 is a plan view showing a conventional printed wiring board imposition structure.

【符号の説明】[Explanation of symbols]

1 表面が面付け後の表面にくる様に面付けしたプリ
ント配線板 2 裏面が面付け後の表面にくる様に面付けしたプリ
ント配線板 3 単体でのプリント配線板の表面実装部品 4 単体でのプリント配線板の裏面実装部品
1 Printed wiring board impositioned so that the front surface comes to the surface after imposition 2 Printed wiring board impositioned so that the back surface comes to the surface after imposition 3 Surface-mounted components of the printed wiring board as a single unit 4 By itself Backside mounting components for printed wiring boards

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 表裏両面に部品が実装できるプリント配
線板の面付け構造において、前記プリント配線板の表面
と裏面が面付け後の片面に同数ずつ混在することを特徴
とするプリント配線板の面付け構造。
1. In a printed wiring board imposition structure in which components can be mounted on both front and back surfaces, the same number of front and back surfaces of the printed wiring board are mixed on one side after imposition, and the surface of the printed wiring board is characterized by the same number. Attachment structure.
JP31275491A 1991-11-27 1991-11-27 Surface mounting structure of printed wiring board Pending JPH05152710A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31275491A JPH05152710A (en) 1991-11-27 1991-11-27 Surface mounting structure of printed wiring board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31275491A JPH05152710A (en) 1991-11-27 1991-11-27 Surface mounting structure of printed wiring board

Publications (1)

Publication Number Publication Date
JPH05152710A true JPH05152710A (en) 1993-06-18

Family

ID=18033023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31275491A Pending JPH05152710A (en) 1991-11-27 1991-11-27 Surface mounting structure of printed wiring board

Country Status (1)

Country Link
JP (1) JPH05152710A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4433378A1 (en) * 1994-09-20 1996-03-21 Blaupunkt Werke Gmbh Automatic mounting of electronic SMD components on both sides of circuit board
US20100157559A1 (en) * 2008-12-24 2010-06-24 Panasonic Corporation Printed circuit board and method for mounting electronic components

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4433378A1 (en) * 1994-09-20 1996-03-21 Blaupunkt Werke Gmbh Automatic mounting of electronic SMD components on both sides of circuit board
DE4433378C2 (en) * 1994-09-20 1998-04-09 Blaupunkt Werke Gmbh Process for automatic assembly of the top and bottom of printed circuit boards with SMD components
US20100157559A1 (en) * 2008-12-24 2010-06-24 Panasonic Corporation Printed circuit board and method for mounting electronic components
US8270179B2 (en) 2008-12-24 2012-09-18 Panasonic Corporation Printed circuit board and method for mounting electronic components

Similar Documents

Publication Publication Date Title
JPS6457789A (en) Electronic component mounting structure
FR2669149B1 (en) INTERMEDIATE CONNECTOR BETWEEN PRINTED CIRCUIT BOARD AND SUBSTRATE WITH ACTIVE ELECTRONIC CIRCUITS.
EP0344793A3 (en) Device for mounting and/or soldering or gluing electronic components, particularly smd-components on printed circuit boards
JPH05152710A (en) Surface mounting structure of printed wiring board
JPH04101491A (en) Mounting method for chip component
JPH01321681A (en) Double-side mounting substrate
JPH04147660A (en) Package of electronic component and mounting structure thereof
JP2503665Y2 (en) Printed wiring board for surface mounting
JPH0325993A (en) Printed circuit board
JPS63292689A (en) Apparatus for circuit wiring of printed substrate
JPS58105166U (en) double-sided printed wiring board
JPH04312992A (en) Semiconductor device
JPH08148768A (en) Flexible printed circuit board
JPH03206489A (en) Display device
JPH03225890A (en) Printed wiring board
JP2581920Y2 (en) Product identification device
JPS63147350A (en) Hybrid integrated circuit for flat package
JP2552651Y2 (en) Double-sided board
JPH07147472A (en) Printed wiring board for surface mounting component
JPH0393298A (en) Method of mounting electronic parts
JPH04253362A (en) Lead parts
JPH04167585A (en) Mounting method of electric component
JP3003330U (en) Circuit board
JPH04171881A (en) Foil coupling parts
JPH03215966A (en) Power transistor mounting device