JPH04253362A - Lead parts - Google Patents

Lead parts

Info

Publication number
JPH04253362A
JPH04253362A JP3009061A JP906191A JPH04253362A JP H04253362 A JPH04253362 A JP H04253362A JP 3009061 A JP3009061 A JP 3009061A JP 906191 A JP906191 A JP 906191A JP H04253362 A JPH04253362 A JP H04253362A
Authority
JP
Japan
Prior art keywords
leds
printed
parts
height
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3009061A
Other languages
Japanese (ja)
Inventor
Yoshihiro Uchino
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP3009061A priority Critical patent/JPH04253362A/en
Publication of JPH04253362A publication Critical patent/JPH04253362A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308Adaptations of leads

Abstract

PURPOSE:To eliminate the need for an additional member and enable a height of parts to be regulated when mounted by inserting a lead terminal into the parts hole provided on a printed-circuit board and then performing soldering. CONSTITUTION:LEDs 11a and 11b, where lead terminals 2a and 2b of an LED 1 are cut at cutting positions S1 and S2, are mounted on printed-circuit boards 13a and 13b. Soldering portions 14a and 14b are located on the boards 13a and 13b and there are parts holes for mounting the LEDs 11a and 11b. When a diameter of the parts hole is set to d, the diameter d is smaller than a dimension L1 and is larger than a dimension L2. When the LEDs 11a and 11b are inserted into the parts hole which is provided on the printed-circuit boards 13a and 13b, a protruding portion near the cutting position of the lead terminal hits the printed-circuit boards 13a and 13b and a height of the printed-circuit board 13a and 13b of the LEDs 11a and 11b from the surface can be regulated, thus enabling a height of the LEDs 11a and 11b to be changed.
JP3009061A 1991-01-29 1991-01-29 Lead parts Pending JPH04253362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3009061A JPH04253362A (en) 1991-01-29 1991-01-29 Lead parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3009061A JPH04253362A (en) 1991-01-29 1991-01-29 Lead parts

Publications (1)

Publication Number Publication Date
JPH04253362A true JPH04253362A (en) 1992-09-09

Family

ID=11710103

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3009061A Pending JPH04253362A (en) 1991-01-29 1991-01-29 Lead parts

Country Status (1)

Country Link
JP (1) JPH04253362A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021472A (en) * 2007-07-13 2009-01-29 Rohm Co Ltd Semiconductor light-emitting device
JP2009246343A (en) * 2008-03-11 2009-10-22 Rohm Co Ltd Semiconductor light-emitting apparatus and method of manufacturing the same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009021472A (en) * 2007-07-13 2009-01-29 Rohm Co Ltd Semiconductor light-emitting device
JP2009246343A (en) * 2008-03-11 2009-10-22 Rohm Co Ltd Semiconductor light-emitting apparatus and method of manufacturing the same

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