JP2021022713A - Circuit board and power supply device - Google Patents

Circuit board and power supply device Download PDF

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JP2021022713A
JP2021022713A JP2019140333A JP2019140333A JP2021022713A JP 2021022713 A JP2021022713 A JP 2021022713A JP 2019140333 A JP2019140333 A JP 2019140333A JP 2019140333 A JP2019140333 A JP 2019140333A JP 2021022713 A JP2021022713 A JP 2021022713A
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fixing protrusion
electronic component
circuit board
hole
printed wiring
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JP7390637B2 (en
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進一 車田
Shinichi Kurumada
進一 車田
金井　教郎
Norio Kanai
教郎 金井
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Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

To provide a circuit board capable of smoothly mounting the electronic components on a printed circuit board in a proper posture even if the printed circuit board is warped or the machining dimensions of at least one of the printed circuit boards and the electronic component vary.SOLUTION: The circuit board includes: a printed circuit board 1 that has a plurality of through-holes 15; and a plurality of electronic components mounted on the printed circuit board 1 to form an electronic circuit. A predetermined electronic component 5 included in the plurality of electronic component has a plurality of fixing protrusions 52 which are inserted one-to-one into the plurality of through-holes 15. At least one of the plurality of through-holes 15 has a diameter larger than that of the fixing protrusion 52 which is inserted into the through-hole 15 in the plurality of fixing protrusions 52.SELECTED DRAWING: Figure 2

Description

本開示は、電子回路を構成する複数の電子部品を有する回路基板、及びこれを備えた電源装置に関する。 The present disclosure relates to a circuit board having a plurality of electronic components constituting an electronic circuit, and a power supply device including the same.

プリント配線板に電子部品を実装するための構造として、電子部品が備える複数の固定用突起を、プリント配線板に形成された複数の貫通孔に一対一で挿入し、各突起をプリント配線板に引っ掛ける構造が、知られている（特許文献１等参照）。 As a structure for mounting an electronic component on a printed wiring board, a plurality of fixing protrusions provided on the electronic component are inserted one-to-one into a plurality of through holes formed in the printed wiring board, and each protrusion is inserted into the printed wiring board. A hooking structure is known (see Patent Document 1 and the like).

特開昭６３−４０２７８号公報Japanese Unexamined Patent Publication No. 63-40278

上記した従来の構造では、プリント配線板の反りや、プリント配線板と電子部品の少なくとも一方の加工寸法のばらつきに起因して、固定用突起と貫通孔との位置関係が設定どおりでなくなる場合がある。この場合、プリント配線板に対して電子部品を円滑に実装することが困難になり、また、実装後の電子部品が、プリント配線板に対して傾いた姿勢となる。 In the above-mentioned conventional structure, the positional relationship between the fixing protrusion and the through hole may not be as set due to the warp of the printed wiring board or the variation in the processing dimensions of at least one of the printed wiring board and the electronic component. is there. In this case, it becomes difficult to smoothly mount the electronic component on the printed wiring board, and the mounted electronic component is in an inclined posture with respect to the printed wiring board.

本開示は、プリント配線板の反りや、プリント配線板と電子部品少なくとも一方の加工寸法のばらつきが生じた場合でも、電子部品を、適正な姿勢となるように円滑に実装することのできる技術を提案することを目的とする。 The present disclosure provides a technique capable of smoothly mounting an electronic component in an appropriate posture even when the printed wiring board is warped or the processing dimensions of at least one of the printed wiring board and the electronic component vary. The purpose is to make a proposal.

本開示の一態様に係る回路基板は、複数の貫通孔を有するプリント配線板と、電子回路を構成するように前記プリント配線板に実装された複数の電子部品とを備える。前記複数の電子部品に含まれる所定の電子部品は、前記複数の貫通孔に一対一で挿入される複数の固定用突起を有する。前記複数の貫通孔の少なくとも一つは、前記複数の固定用突起のうち当該貫通孔に挿入される固定用突起よりも、大径である。 The circuit board according to one aspect of the present disclosure includes a printed wiring board having a plurality of through holes, and a plurality of electronic components mounted on the printed wiring board so as to form an electronic circuit. A predetermined electronic component included in the plurality of electronic components has a plurality of fixing protrusions that are inserted one-to-one into the plurality of through holes. At least one of the plurality of through holes has a larger diameter than the fixing protrusions inserted into the through holes among the plurality of fixing protrusions.

本開示の一態様に係る電源装置は、前記回路基板と、前記回路基板が収容されるケースとを備える。 The power supply device according to one aspect of the present disclosure includes the circuit board and a case in which the circuit board is housed.

本開示は、プリント配線板の反りや、プリント配線板と電子部品の少なくとも一方の加工寸法のばらつきが生じた場合でも、電子部品を、適正な姿勢となるように円滑に実装することができるという効果を奏する。 According to the present disclosure, even if the printed wiring board is warped or the processing dimensions of at least one of the printed wiring board and the electronic component vary, the electronic component can be smoothly mounted so as to have an appropriate posture. It works.

図１は、一実施形態の回路基板を備える電源装置を模式的に示す分解斜視図である。FIG. 1 is an exploded perspective view schematically showing a power supply device including the circuit board of one embodiment. 図２は、同上の回路基板のプリント配線板に所定の電子部品を実装する様子を模式的に示す一部破断側面図である。FIG. 2 is a partially broken side view schematically showing a state in which a predetermined electronic component is mounted on a printed wiring board of the same circuit board. 図３Ａは、図２のＰ部拡大図であり、図３Ｂは、図２のＱ部拡大図である。FIG. 3A is an enlarged view of a P portion of FIG. 2, and FIG. 3B is an enlarged view of a Q portion of FIG. 図４は、同上のプリント配線板に所定の電子部品を実装した様子を模式的に示す一部破断側面図である。FIG. 4 is a partially broken side view schematically showing a state in which a predetermined electronic component is mounted on the printed wiring board of the same. 図５Ａは、図４のＲ部拡大図であり、図５Ｂは、図４のＳ部拡大図である。5A is an enlarged view of the R portion of FIG. 4, and FIG. 5B is an enlarged view of the S portion of FIG. 図６は、同上のプリント配線板を模式的に示す平面図である。FIG. 6 is a plan view schematically showing the printed wiring board of the same. 図７は、同上のプリント配線板の変形例を模式的に示す平面図である。FIG. 7 is a plan view schematically showing a modified example of the printed wiring board of the above.

（一実施形態）
図１に示すように、一実施形態の電源装置８は、回路基板７と、回路基板７が収容される金属製のケース８２とを備える。回路基板７とケース８２との間には、電気絶縁性のシート材が配されることが好ましい。 (One Embodiment)
As shown in FIG. 1, the power supply device 8 of one embodiment includes a circuit board 7 and a metal case 82 in which the circuit board 7 is housed. It is preferable that an electrically insulating sheet material is arranged between the circuit board 7 and the case 82.

回路基板７は、プリント配線板１と、電子回路を構成するようにプリント配線板１に接続された複数の電子部品２とを備える。複数の電子部品２は、一例として、コンデンサ、ダイオード、抵抗器、トランジスタ、コネクタ等である。これら複数の電子部品２によって構成される電子回路は、例えば、外部の商用電源からの交流の入力電流を、所定の直流電流に変換する電源回路である。 The circuit board 7 includes a printed wiring board 1 and a plurality of electronic components 2 connected to the printed wiring board 1 so as to form an electronic circuit. The plurality of electronic components 2 are, for example, capacitors, diodes, resistors, transistors, connectors, and the like. The electronic circuit composed of the plurality of electronic components 2 is, for example, a power supply circuit that converts an alternating current input current from an external commercial power source into a predetermined direct current.

複数の電子部品２には、基板実装型のコネクタで構成された所定の電子部品５が含まれる。所定の電子部品５は、電気接続用の複数のピン５１と、これら複数のピン５１が保持された長尺の部品本体５３と、部品本体５３の長手方向の両端部に設けられた二つの固定用突起５２とを有する。 The plurality of electronic components 2 include a predetermined electronic component 5 composed of a board-mounted connector. The predetermined electronic component 5 includes a plurality of pins 51 for electrical connection, a long component body 53 in which the plurality of pins 51 are held, and two fixings provided at both ends of the component body 53 in the longitudinal direction. It has a protrusion 52.

複数のピン５１の各々は、電気的なやり取りを行うために設けられたＬ字状のピンである。複数のピン５１の各々の第一端部５１１が部品本体５３から突出する方向と、複数のピン５１の各々の第二端部５１２が部品本体５３から突出する方向は、互いに直交する方向である。本明細書で用いる直交の文言は、厳密な意味での直交に限定されず、略直交する場合も含む。 Each of the plurality of pins 51 is an L-shaped pin provided for performing electrical exchange. The direction in which the first end portion 511 of each of the plurality of pins 51 protrudes from the component body 53 and the direction in which the second end portion 512 of each of the plurality of pins 51 protrudes from the component body 53 are orthogonal to each other. .. The wording of orthogonality used in the present specification is not limited to orthogonality in a strict sense, and includes cases where it is substantially orthogonal.

複数のピン５１の第一端部５１１は、部品本体５３が有するＤ字状の金属シールド５３１に囲まれて位置する。部品本体５３から固定用突起５２が突出する方向は、複数のピン５１の第二端部５１２が部品本体５３から突出する方向と同じである。 The first end portion 511 of the plurality of pins 51 is located surrounded by the D-shaped metal shield 531 included in the component main body 53. The direction in which the fixing protrusion 52 protrudes from the component body 53 is the same as the direction in which the second end 512 of the plurality of pins 51 protrudes from the component body 53.

所定の電子部品５が有する二つの固定用突起５２は、互いに距離をあけて位置する第一固定用突起５２Ａと第二固定用突起５２Ｂである。 The two fixing protrusions 52 of the predetermined electronic component 5 are a first fixing protrusion 52A and a second fixing protrusion 52B located at a distance from each other.

図２、図３Ａ等に示すように、第一固定用突起５２Ａは、筒状に形成された金属製の突起である。第一固定用突起５２Ａには、第一固定用突起５２Ａの軸方向に沿って複数のスリット５２３が形成されている。複数のスリット５２３は、例えば、第一固定用突起５２Ａの周方向において互いに距離をあけて位置する三つのスリット５２３である。複数のスリット５２３を有する第一固定用突起５２Ａは、径方向において弾性変形が自在である。 As shown in FIGS. 2 and 3A, the first fixing protrusion 52A is a metal protrusion formed in a tubular shape. A plurality of slits 523 are formed in the first fixing protrusion 52A along the axial direction of the first fixing protrusion 52A. The plurality of slits 523 are, for example, three slits 523 located at a distance from each other in the circumferential direction of the first fixing protrusion 52A. The first fixing protrusion 52A having a plurality of slits 523 is elastically deformable in the radial direction.

筒状である第一固定用突起５２Ａは、部品本体５３から突出した軸部５２１と、軸部５２１と一つながりに形成された抜け止め部５２５を有する。抜け止め部５２５は、軸部５２１よりも大径に形成されている。軸部５２１と抜け止め部５２５との間には、全周にわたって段差が形成されている。第一固定用突起５２Ａの径は、すなわち抜け止め部５２５の外径である。第一固定用突起５２Ａの各スリット５２３は、第一固定用突起５２Ａの全体つまり軸部５２１から抜け止め部５２５にかけて、直線状に形成されている。 The tubular first fixing protrusion 52A has a shaft portion 521 protruding from the component main body 53 and a retaining portion 525 formed in connection with the shaft portion 521. The retaining portion 525 is formed to have a diameter larger than that of the shaft portion 521. A step is formed over the entire circumference between the shaft portion 521 and the retaining portion 525. The diameter of the first fixing protrusion 52A is, that is, the outer diameter of the retaining portion 525. Each slit 523 of the first fixing protrusion 52A is formed in a straight line from the entire first fixing protrusion 52A, that is, from the shaft portion 521 to the retaining portion 525.

図２、図３Ｂ等に示すように、第二固定用突起５２Ｂは、第一固定用突起５２Ａと同様の構成を備える。つまり、第二固定用突起５２Ｂは、第一固定用突起５２Ａと同様の軸部５２１、スリット５２３及び抜け止め部５２５を有する。 As shown in FIGS. 2 and 3B, the second fixing protrusion 52B has the same configuration as the first fixing protrusion 52A. That is, the second fixing protrusion 52B has a shaft portion 521, a slit 523, and a retaining portion 525 similar to the first fixing protrusion 52A.

プリント配線板１は、所定の電子部品５が実装される箇所に、プリント配線板１の厚み方向Ｄ１に貫通した二つの貫通孔１５を有する。二つの貫通孔１５は、所定の電子部品５をプリント配線板１に実装するために用いられる。 The printed wiring board 1 has two through holes 15 penetrating in the thickness direction D1 of the printed wiring board 1 at a position where a predetermined electronic component 5 is mounted. The two through holes 15 are used to mount a predetermined electronic component 5 on the printed wiring board 1.

所定の電子部品５が有する第一固定用突起５２Ａと第二固定用突起５２Ｂは、プリント配線板１が有する二つの貫通孔１５に対して、一対一で挿入される。以下において、二つの貫通孔１５のうち、第一固定用突起５２Ａに対応する貫通孔１５（つまり第一固定用突起５２Ａが挿入される貫通孔１５）を、第一貫通孔１５Ａと称する。二つの貫通孔１５のうち、第二固定用突起５２Ｂに対応する貫通孔１５（つまり第二固定用突起５２Ｂが挿入される貫通孔１５）を、第二貫通孔１５Ｂと称する。 The first fixing protrusion 52A and the second fixing protrusion 52B of the predetermined electronic component 5 are inserted one-to-one into the two through holes 15 of the printed wiring board 1. In the following, of the two through holes 15, the through hole 15 corresponding to the first fixing protrusion 52A (that is, the through hole 15 into which the first fixing protrusion 52A is inserted) is referred to as the first through hole 15A. Of the two through holes 15, the through hole 15 corresponding to the second fixing protrusion 52B (that is, the through hole 15 into which the second fixing protrusion 52B is inserted) is referred to as a second through hole 15B.

図３Ａ等に示すように、第一貫通孔１５Ａは、ここに挿入される第一固定用突起５２Ａよりも小径に形成されている。 As shown in FIG. 3A and the like, the first through hole 15A is formed to have a smaller diameter than the first fixing protrusion 52A inserted therein.

より詳細には、第一貫通孔１５Ａの径は、第一固定用突起５２Ａの抜け止め部５２５の外径よりも小さく、かつ軸部５２１の外径と同一又はこれより大きくなるように設定されている。第一固定用突起５２Ａの軸部５２１が、第一貫通孔１５Ａに挿入された状態で、第一固定用突起５２Ａの抜け止め部５２５は、プリント配線板１に引っ掛かることができる。 More specifically, the diameter of the first through hole 15A is set to be smaller than the outer diameter of the retaining portion 525 of the first fixing protrusion 52A and equal to or larger than the outer diameter of the shaft portion 521. ing. With the shaft portion 521 of the first fixing protrusion 52A inserted into the first through hole 15A, the retaining portion 525 of the first fixing protrusion 52A can be hooked on the printed wiring board 1.

図３Ｂ等に示すように、第二貫通孔１５Ｂは、ここに挿入される第二固定用突起５２Ｂよりも大径に形成されている。より詳細には、第二貫通孔１５Ｂの径は、第二固定用突起５２Ｂの軸部５２１の外径よりも大きく、かつ抜け止め部５２５の外径よりも大きく設定されている。 As shown in FIG. 3B and the like, the second through hole 15B is formed to have a diameter larger than that of the second fixing protrusion 52B inserted therein. More specifically, the diameter of the second through hole 15B is set to be larger than the outer diameter of the shaft portion 521 of the second fixing protrusion 52B and larger than the outer diameter of the retaining portion 525.

更に、一実施形態の回路基板７では、図４、図５Ａ及び図５Ｂに示すように、第一固定用突起５２Ａと第二固定用突起５２Ｂを、それぞれプリント配線板１に対して半田１８で接合させている。なお、半田付けは一例に過ぎず、第一固定用突起５２Ａと第二固定用突起５２Ｂを、他の手段でプリント配線板１に接合させることも可能である。 Further, in the circuit board 7 of one embodiment, as shown in FIGS. 4, 5A and 5B, the first fixing protrusion 52A and the second fixing protrusion 52B are respectively attached to the printed wiring board 1 with solder 18. It is joined. Note that soldering is only an example, and the first fixing protrusion 52A and the second fixing protrusion 52B can be joined to the printed wiring board 1 by other means.

半田１８は、例えばフロー方式でプリント配線板１に接合することができる。この場合、半田槽から上方に噴出される半田噴流に対して、プリント配線板１を、水平方向に移動させながら接触させる。これにより、プリント配線板１の厚み方向Ｄ１の両面１１，１２のうち、所定の電子部品５の部品本体５３が配される面１１とは反対側の面１２の二箇所に、半田１８が接合される。面１２の二箇所のうち一方に接合された半田１８は、第一固定用突起５２Ａ及び第一貫通孔１５Ａを覆い隠す。面１２の二箇所のうち他方に接合された半田１８は、第二固定用突起５２Ｂ及び第二貫通孔１５Ｂを覆い隠す。 The solder 18 can be joined to the printed wiring board 1 by, for example, a flow method. In this case, the printed wiring board 1 is brought into contact with the solder jet that is ejected upward from the solder tank while moving in the horizontal direction. As a result, the solder 18 is bonded to two of the double-sided surfaces 11 and 12 of the printed wiring board 1 in the thickness direction D1 on the side opposite to the surface 11 on which the component body 53 of the predetermined electronic component 5 is arranged. Will be done. The solder 18 joined to one of the two locations on the surface 12 covers the first fixing protrusion 52A and the first through hole 15A. The solder 18 bonded to the other of the two locations on the surface 12 covers the second fixing protrusion 52B and the second through hole 15B.

一実施形態の回路基板７では、第二貫通孔１５Ｂの径が、ここに挿入される第二固定用突起５２Ｂの径よりも大きく（つまり第二固定用突起５２Ｂの軸部５２１及び抜け止め部５２５の外径よりも大きく）形成されているので、半田付けをする前段階において、第二貫通孔１５Ｂと第二固定用突起５２Ｂとの間にはクリアランスが存在する。そのため、プリント配線板１に反りが生じた場合や、プリント配線板１と電子部品５の少なくとも一方の加工寸法にばらつきが存在した場合でも、プリント配線板１に対して所定の電子部品５を円滑に実装すること可能となる。また、実装後の電子部品５が、プリント配線板１に対して傾いた姿勢になることを抑えることができる。 In the circuit board 7 of one embodiment, the diameter of the second through hole 15B is larger than the diameter of the second fixing protrusion 52B inserted therein (that is, the shaft portion 521 and the retaining portion of the second fixing protrusion 52B). Since it is formed (larger than the outer diameter of 525), there is a clearance between the second through hole 15B and the second fixing protrusion 52B in the stage before soldering. Therefore, even if the printed wiring board 1 is warped or there is a variation in the processing dimensions of at least one of the printed wiring board 1 and the electronic component 5, the predetermined electronic component 5 can be smoothly moved with respect to the printed wiring board 1. It can be implemented in. Further, it is possible to prevent the electronic component 5 after mounting from being tilted with respect to the printed wiring board 1.

また、プリント配線板１に実装される複数の電子部品２のうち所定の電子部品５を除いた他の電子部品２のグループを「他の電子部品群２Ｇ」としたとき（図６参照）、一実施形態の回路基板７では、他の電子部品群２Ｇと第一貫通孔１５Ａとの間の最小距離ｄ１は、他の電子部品群２Ｇと第二貫通孔１５Ｂとの間の最小距離ｄ２よりも、大きく設定されている。 Further, when the group of other electronic components 2 excluding the predetermined electronic component 5 among the plurality of electronic components 2 mounted on the printed wiring board 1 is defined as "other electronic component group 2G" (see FIG. 6). In the circuit board 7 of one embodiment, the minimum distance d1 between the other electronic component group 2G and the first through hole 15A is larger than the minimum distance d2 between the other electronic component group 2G and the second through hole 15B. Is also set large.

他の電子部品群２Ｇと第一貫通孔１５Ａとの間の最小距離ｄ１は、すなわち、他の電子部品群２Ｇに含まれる複数の電子部品２のうち最も第一貫通孔１５Ａに近い電子部品２と、第一貫通孔１５Ａとの間の距離である。他の電子部品群２Ｇと第二貫通孔１５Ｂとの間の最小距離ｄ２は、すなわち、他の電子部品群２Ｇに含まれる複数の電子部品２のうち最も第二貫通孔１５Ｂに近い電子部品２と、第二貫通孔１５Ｂとの間の距離である。 The minimum distance d1 between the other electronic component group 2G and the first through hole 15A is that is, the electronic component 2 closest to the first through hole 15A among the plurality of electronic components 2 included in the other electronic component group 2G. And the distance between the first through hole 15A. The minimum distance d2 between the other electronic component group 2G and the second through hole 15B is, that is, the electronic component 2 closest to the second through hole 15B among the plurality of electronic components 2 included in the other electronic component group 2G. And the distance between the second through hole 15B.

このように最小距離ｄ１，ｄ２を設定することで、所定の電子部品５の実装に際して、プリント配線板１に応力が生じた場合でも、その影響が、他の電子部品群２Ｇに含まれる電子部品２に及ぶことが抑えられる。そのため、耐応力性が比較的低い表面実装型の電子部品２を利用しやすくなる。 By setting the minimum distances d1 and d2 in this way, even if stress is generated in the printed wiring board 1 when mounting the predetermined electronic component 5, the influence of the stress is included in the other electronic component group 2G. It is suppressed to reach 2. Therefore, it becomes easy to use the surface mount type electronic component 2 having a relatively low stress resistance.

一実施形態の回路基板７では、所定の電子部品５が固定用突起５２を二つ有し、これに対応して、プリント配線板１が貫通孔１５を二つ有しているが、固定用突起５２と貫通孔１５の個数はこれに限定されない。 In the circuit board 7 of one embodiment, the predetermined electronic component 5 has two fixing protrusions 52, and the printed wiring board 1 has two through holes 15 corresponding to the fixing protrusions 52. The number of protrusions 52 and through holes 15 is not limited to this.

所定の電子部品５が三つ以上の固定用突起５２を有し、これに対応して、プリント配線板１が三つ以上の貫通孔１５を有してもよい。いずれの場合においても、複数の貫通孔１５のうち少なくとも一つの貫通孔１５を、複数の固定用突起５２のうち当該貫通孔１５に挿入される固定用突起５２よりも大径に形成することで、同様の効果が得られる。 The predetermined electronic component 5 may have three or more fixing protrusions 52, and the printed wiring board 1 may have three or more through holes 15 corresponding to the fixing protrusions 52. In any case, at least one of the plurality of through holes 15 is formed to have a diameter larger than that of the fixing protrusions 52 inserted into the through holes 15 among the plurality of fixing protrusions 52. , The same effect can be obtained.

図７には、一実施形態の回路基板７が備えるプリント配線板１の変形例を示している。この変形例では、プリント配線板１に実装される他の電子部品群２Ｇのうち、第一貫通孔１５Ａの近傍領域に位置する電子部品２の個数を、第二貫通孔１５Ｂの近傍領域に位置する電子部品２の個数よりも、少なく設定している。 FIG. 7 shows a modified example of the printed wiring board 1 included in the circuit board 7 of one embodiment. In this modification, among the other electronic component groups 2G mounted on the printed wiring board 1, the number of electronic components 2 located in the vicinity region of the first through hole 15A is located in the vicinity region of the second through hole 15B. It is set less than the number of electronic components 2 to be used.

第一貫通孔１５Ａの近傍領域は、すなわち、第一貫通孔１５Ａから所定距離ｄｓの範囲内の領域である。第二貫通孔１５Ｂの近傍領域は、すなわち、第二貫通孔１５Ｂから所定距離ｄｓの範囲内の領域である。 The region in the vicinity of the first through hole 15A is, that is, a region within a predetermined distance ds from the first through hole 15A. The region in the vicinity of the second through hole 15B is, that is, a region within a predetermined distance ds from the second through hole 15B.

このように設定することで、所定の電子部品５の実装に際して、プリント配線板１に応力が生じた場合でも、その影響が、他の電子部品群２Ｇに含まれる電子部品２に及ぶことが抑えられる。そのため、耐応力性が比較的低い表面実装型の電子部品２を利用しやすくなる。 By setting in this way, even if stress is generated in the printed wiring board 1 when mounting the predetermined electronic component 5, the influence is suppressed from affecting the electronic component 2 included in the other electronic component group 2G. Be done. Therefore, it becomes easy to use the surface mount type electronic component 2 having a relatively low stress resistance.

（態様）
一実施形態及びこれの変形例に基づいて説明したように、本明細書は、以下の第１から第６の態様の回路基板（７）を開示している。 (Aspect)
As described based on one embodiment and variations thereof, the present specification discloses the circuit board (7) of the following first to sixth aspects.

第１の態様の回路基板（７）は、複数の貫通孔（１５）を有するプリント配線板（１）と、電子回路を構成するようにプリント配線板（１）に実装された複数の電子部品（２）とを備える。複数の電子部品（２）に含まれる所定の電子部品（５）は、複数の貫通孔（１５）に一対一で挿入される複数の固定用突起（５２）を有する。複数の貫通孔（１５）の少なくとも一つは、複数の固定用突起（５２）のうち当該貫通孔（１５）に挿入される固定用突起（５２）よりも、大径である。 The circuit board (7) of the first aspect includes a printed wiring board (1) having a plurality of through holes (15) and a plurality of electronic components mounted on the printed wiring board (1) so as to form an electronic circuit. (2) and. The predetermined electronic component (5) included in the plurality of electronic components (2) has a plurality of fixing protrusions (52) that are inserted one-to-one into the plurality of through holes (15). At least one of the plurality of through holes (15) has a larger diameter than the fixing protrusion (52) inserted into the through hole (15) among the plurality of fixing protrusions (52).

第１の態様の回路基板（７）では、プリント配線板（１）に反りが生じた場合や、プリント配線板（１）と所定の電子部品（５）の少なくとも一方の加工寸法にばらつきが生じた場合でも、固定用突起（５２）と貫通孔（１５）との間のクリアランスで調整可能である。そのため、所定の電子部品（５）を、プリント配線板（１）に対して適正な姿勢で円滑に実装することが可能となる。 In the circuit board (7) of the first aspect, when the printed wiring board (1) is warped, or the processing dimensions of at least one of the printed wiring board (1) and the predetermined electronic component (5) vary. Even in this case, the clearance between the fixing protrusion (52) and the through hole (15) can be adjusted. Therefore, the predetermined electronic component (5) can be smoothly mounted on the printed wiring board (1) in an appropriate posture.

第２の態様の回路基板（７）では、第１の態様に加えて、複数の固定用突起（５２）の各々は、金属製でありかつプリント配線板（１）に対して半田接合されている。 In the circuit board (7) of the second aspect, in addition to the first aspect, each of the plurality of fixing protrusions (52) is made of metal and solder-bonded to the printed wiring board (1). There is.

第２の態様の回路基板（７）によれば、所定の電子部品（５）を、プリント配線板（１）に対して適正な姿勢となるように円滑に配置した後に、その姿勢でプリント配線板（１）に対して確実に接合させることができる。 According to the circuit board (7) of the second aspect, after the predetermined electronic component (5) is smoothly arranged so as to have an appropriate posture with respect to the printed wiring board (1), the printed wiring is performed in that posture. It can be reliably joined to the plate (1).

第３の態様の回路基板（７）では、第１又は第２の態様に加えて、複数の固定用突起（５２）の各々は、弾性変形可能な抜け止め部（５２５）を有する。 In the circuit board (7) of the third aspect, in addition to the first or second aspect, each of the plurality of fixing protrusions (52) has an elastically deformable retaining portion (525).

第３の態様の回路基板（７）によれば、固定用突起（５２）の抜け止め部（５２５）を利用して、固定用突起（５２）をプリント配線板（１）に対してより確実に保持させることができる。 According to the circuit board (7) of the third aspect, the fixing protrusion (52) is made more reliable with respect to the printed wiring board (1) by utilizing the retaining portion (525) of the fixing protrusion (52). Can be held by.

第４の態様の回路基板（７）では、第１から第３のいずれか一つの態様に加えて、所定の電子部品（５）は、複数の固定用突起（５２）の間に配置された電気接続用の複数のピン（５１）を有する。 In the circuit board (7) of the fourth aspect, in addition to any one of the first to third aspects, the predetermined electronic component (5) is arranged between the plurality of fixing protrusions (52). It has a plurality of pins (51) for electrical connection.

第４の態様の回路基板（７）によれば、プリント配線板（１）に実装された所定の電子部品（５）の複数のピン（５１）を通じて、電気的なやり取りを行うことができる。 According to the circuit board (7) of the fourth aspect, electrical exchange can be performed through a plurality of pins (51) of a predetermined electronic component (5) mounted on the printed wiring board (1).

第５の態様の回路基板（７）では、第１から第４のいずれか一つの態様に加えて、複数の固定用突起（５２）は、第一固定用突起（５２Ａ）と第二固定用突起（５２Ｂ）とを含む。複数の貫通孔（１５）は、第一固定用突起（５２Ａ）よりも小径でありかつ第一固定用突起（５２Ａ）が挿入される第一貫通孔（１５Ａ）と、第二固定用突起（５２Ｂ）よりも大径でありかつ第二固定用突起（５２Ｂ）が挿入される第二貫通孔（１５Ｂ）とを含む。複数の電子部品（２）のうち所定の電子部品（５）を除いた他の電子部品群（２Ｇ）と第一貫通孔（１５Ａ）との間の最小距離（ｄ１）は、他の電子部品群（２Ｇ）と第二貫通孔（１５Ｂ）との間の最小距離（ｄ２）よりも、大きい。 In the circuit board (7) of the fifth aspect, in addition to any one of the first to fourth aspects, the plurality of fixing protrusions (52) are the first fixing protrusion (52A) and the second fixing protrusion (52A). Includes protrusions (52B). The plurality of through holes (15) have a diameter smaller than that of the first fixing protrusion (52A), and the first through hole (15A) into which the first fixing protrusion (52A) is inserted and the second fixing protrusion (52A). It includes a second through hole (15B) having a diameter larger than 52B) and into which a second fixing protrusion (52B) is inserted. The minimum distance (d1) between the first through hole (15A) and the other electronic component group (2G) excluding the predetermined electronic component (5) among the plurality of electronic components (2) is the other electronic component. It is greater than the minimum distance (d2) between the group (2G) and the second through hole (15B).

第５の態様の回路基板（７）によれば、所定の電子部品（５）の実装に際して、プリント配線板（１）に応力が生じた場合でも、その影響が他の電子部品群（２Ｇ）に及ぶことが抑えられる。そのため、他の電子部品群（２Ｇ）において、耐応力性が比較的低い表面実装型の電子部品（２）を利用しやすい。 According to the circuit board (7) of the fifth aspect, even if stress is generated in the printed wiring board (1) when the predetermined electronic component (5) is mounted, the influence is affected by the other electronic component group (2G). Is suppressed. Therefore, in other electronic component groups (2G), it is easy to use the surface mount type electronic component (2) having a relatively low stress resistance.

第６の態様の回路基板（７）では、第１から第４のいずれか一つの態様に加えて、複数の固定用突起（５２）は、第一固定用突起（５２Ａ）と第二固定用突起（５２Ｂ）とを含む。複数の貫通孔（１５）は、第一固定用突起（５２Ａ）よりも小径でありかつ第一固定用突起（５２Ａ）が挿入される第一貫通孔（１５Ａ）と、第二固定用突起（５２Ｂ）よりも大径でありかつ第二固定用突起（５２Ｂ）が挿入される第二貫通孔（１５Ｂ）とを含む。第一貫通孔（１５Ａ）の近傍領域における複数の電子部品（２）の個数は、第二貫通孔（１５Ｂ）の近傍領域における複数の電子部品（２）の個数よりも、少ない。 In the circuit board (7) of the sixth aspect, in addition to any one of the first to fourth aspects, the plurality of fixing protrusions (52) are the first fixing protrusion (52A) and the second fixing protrusion (52A). Includes protrusions (52B). The plurality of through holes (15) have a diameter smaller than that of the first fixing protrusion (52A), and the first through hole (15A) into which the first fixing protrusion (52A) is inserted and the second fixing protrusion (52A). It includes a second through hole (15B) having a diameter larger than 52B) and into which a second fixing protrusion (52B) is inserted. The number of the plurality of electronic components (2) in the region near the first through hole (15A) is smaller than the number of the plurality of electronic components (2) in the region near the second through hole (15B).

第６の態様の回路基板（７）によれば、所定の電子部品（５）の実装に際して、プリント配線板（１）に応力が生じた場合でも、その影響が他の電子部品群（２Ｇ）に及ぶことが抑えられる。そのため、他の電子部品群（２Ｇ）において、耐応力性が比較的低い表面実装型の電子部品（２）を利用しやすい。 According to the circuit board (7) of the sixth aspect, even if stress is generated in the printed wiring board (1) when mounting the predetermined electronic component (5), the influence is affected by the other electronic component group (2G). Is suppressed. Therefore, in other electronic component groups (2G), it is easy to use the surface mount type electronic component (2) having a relatively low stress resistance.

また、一実施形態及びこれの変形例に基づいて説明したように、本明細書は、以下の第１の態様の電源装置（８）を開示している。 Further, as described based on one embodiment and a modification thereof, the present specification discloses the power supply device (8) of the following first aspect.

第１の態様の電源装置（８）は、上記した第１から第６のいずれか一つの態様の回路基板（７）と、回路基板（７）が収容されるケース（８２）とを備える。 The power supply device (8) of the first aspect includes a circuit board (7) of any one of the first to sixth aspects described above, and a case (82) in which the circuit board (7) is housed.

第１の態様の電源装置（８）によれば、電源装置（８）が備える回路基板（７）において、所定の電子部品（５）を、プリント配線板（１）に対して適正な姿勢で円滑に実装することが可能となる。 According to the power supply device (8) of the first aspect, in the circuit board (7) included in the power supply device (8), the predetermined electronic component (5) is placed in an appropriate posture with respect to the printed wiring board (1). It can be implemented smoothly.

１ プリント配線板
１５ 貫通孔
１８ 半田
２ 電子部品
２Ｇ 他の電子部品群
５ 所定の電子部品
５２ 固定用突起
５２Ａ 第一固定用突起
５２Ｂ 第二固定用突起
５２５ 抜け止め部
７ 回路基板
８ 電源装置
８２ ケース
ｄ１ 最小距離
ｄ２ 最小距離 1 Printed wiring board 15 Through hole 18 Solder 2 Electronic component 2G Other electronic component group 5 Predetermined electronic component 52 Fixing protrusion 52A First fixing protrusion 52B Second fixing protrusion 525 Retaining part 7 Circuit board 8 Power supply device 82 Case d1 Minimum distance d2 Minimum distance

Claims (7)

複数の貫通孔を有するプリント配線板と、
電子回路を構成するように前記プリント配線板に実装された複数の電子部品とを備え、
前記複数の電子部品に含まれる所定の電子部品は、前記複数の貫通孔に一対一で挿入される複数の固定用突起を有し、
前記複数の貫通孔の少なくとも一つは、前記複数の固定用突起のうち当該貫通孔に挿入される固定用突起よりも、大径である
回路基板。 A printed wiring board with multiple through holes and
A plurality of electronic components mounted on the printed wiring board so as to form an electronic circuit are provided.
A predetermined electronic component included in the plurality of electronic components has a plurality of fixing protrusions that are inserted one-to-one into the plurality of through holes.
At least one of the plurality of through holes is a circuit board having a diameter larger than that of the fixing protrusions inserted into the through holes among the plurality of fixing protrusions. 前記複数の固定用突起の各々は、金属製でありかつ前記プリント配線板に対して半田接合されている
請求項１の回路基板。 The circuit board according to claim 1, wherein each of the plurality of fixing protrusions is made of metal and is solder-bonded to the printed wiring board. 前記複数の固定用突起の各々は、弾性変形可能な抜け止め部を有する
請求項１又は２の回路基板。 The circuit board according to claim 1 or 2, wherein each of the plurality of fixing protrusions has an elastically deformable retaining portion. 前記所定の電子部品は、前記複数の固定用突起の間に配置された電気接続用の複数のピンを有する
請求項１から３のいずれか一項の回路基板。 The circuit board according to any one of claims 1 to 3, wherein the predetermined electronic component has a plurality of pins for electrical connection arranged between the plurality of fixing protrusions. 前記複数の固定用突起は、第一固定用突起と第二固定用突起とを含み、
前記複数の貫通孔は、前記第一固定用突起よりも小径でありかつ前記第一固定用突起が挿入される第一貫通孔と、前記第二固定用突起よりも大径でありかつ前記第二固定用突起が挿入される第二貫通孔とを含み、
前記複数の電子部品のうち前記所定の電子部品を除いた他の電子部品群と前記第一貫通孔との間の最小距離は、前記他の電子部品群と前記第二貫通孔との間の最小距離よりも、大きい
請求項１から４のいずれか一項の回路基板。 The plurality of fixing protrusions include a first fixing protrusion and a second fixing protrusion.
The plurality of through holes have a diameter smaller than that of the first fixing protrusion and have a diameter larger than that of the first through hole into which the first fixing protrusion is inserted and the second fixing protrusion. (Ii) Including a second through hole into which a fixing protrusion is inserted,
The minimum distance between the first through hole and the other electronic component group excluding the predetermined electronic component among the plurality of electronic components is between the other electronic component group and the second through hole. The circuit board according to any one of claims 1 to 4, which is larger than the minimum distance. 前記複数の固定用突起は、第一固定用突起と第二固定用突起とを含み、
前記複数の貫通孔は、前記第一固定用突起よりも小径でありかつ前記第一固定用突起が挿入される第一貫通孔と、前記第二固定用突起よりも大径でありかつ前記第二固定用突起が挿入される第二貫通孔とを含み、
前記第一貫通孔の近傍領域における前記複数の電子部品の個数は、前記第二貫通孔の近傍領域における前記複数の電子部品の個数よりも、少ない
請求項１から４のいずれか一項の回路基板。 The plurality of fixing protrusions include a first fixing protrusion and a second fixing protrusion.
The plurality of through holes have a diameter smaller than that of the first fixing protrusion and have a diameter larger than that of the first through hole into which the first fixing protrusion is inserted and the second fixing protrusion. (Ii) Including a second through hole into which a fixing protrusion is inserted,
The circuit according to any one of claims 1 to 4, wherein the number of the plurality of electronic components in the region near the first through hole is smaller than the number of the plurality of electronic components in the region near the second through hole. substrate. 請求項１から６のいずれか一項の前記回路基板と、
前記回路基板が収容されるケースとを備える
電源装置。 The circuit board according to any one of claims 1 to 6 and
A power supply device including a case in which the circuit board is housed.
JP2019140333A 2019-07-30 2019-07-30 Circuit board and power supply Active JP7390637B2 (en)

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Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340278A (en) * 1986-06-10 1988-02-20 ポジトロニツク・インダストリ−ズ・インコ−ポレイテツド Fixed connector for electrical connection of surface mount type printed board
JPS6423882U (en) * 1987-08-03 1989-02-08
JPH0438672U (en) * 1990-07-31 1992-03-31
JPH06152162A (en) * 1992-11-13 1994-05-31 Sony Corp Light-receiving module
JP2001210407A (en) * 2000-01-26 2001-08-03 Japan Aviation Electronics Industry Ltd Connector
US20080248678A1 (en) * 2007-04-03 2008-10-09 Dieter Tuerschmann Connector fastening arrangement for printed circuit boards
JP2011159664A (en) * 2010-01-29 2011-08-18 Autonetworks Technologies Ltd Method of manufacturing printed board equipped with through hole connector
JP2012044017A (en) * 2010-08-20 2012-03-01 Alps Electric Co Ltd Electronic apparatus
JP2016091774A (en) * 2014-11-04 2016-05-23 日本圧着端子製造株式会社 Connector and connector attachment structure
JP2018026219A (en) * 2016-08-09 2018-02-15 日立オートモティブシステムズ株式会社 Connector for substrate and battery control device including the same
JP2018092852A (en) * 2016-12-07 2018-06-14 日本航空電子工業株式会社 connector

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6340278A (en) * 1986-06-10 1988-02-20 ポジトロニツク・インダストリ−ズ・インコ−ポレイテツド Fixed connector for electrical connection of surface mount type printed board
JPS6423882U (en) * 1987-08-03 1989-02-08
JPH0438672U (en) * 1990-07-31 1992-03-31
JPH06152162A (en) * 1992-11-13 1994-05-31 Sony Corp Light-receiving module
JP2001210407A (en) * 2000-01-26 2001-08-03 Japan Aviation Electronics Industry Ltd Connector
US20080248678A1 (en) * 2007-04-03 2008-10-09 Dieter Tuerschmann Connector fastening arrangement for printed circuit boards
JP2011159664A (en) * 2010-01-29 2011-08-18 Autonetworks Technologies Ltd Method of manufacturing printed board equipped with through hole connector
JP2012044017A (en) * 2010-08-20 2012-03-01 Alps Electric Co Ltd Electronic apparatus
JP2016091774A (en) * 2014-11-04 2016-05-23 日本圧着端子製造株式会社 Connector and connector attachment structure
JP2018026219A (en) * 2016-08-09 2018-02-15 日立オートモティブシステムズ株式会社 Connector for substrate and battery control device including the same
JP2018092852A (en) * 2016-12-07 2018-06-14 日本航空電子工業株式会社 connector

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