JPH0388384A - Electronic component mounting board - Google Patents
Electronic component mounting boardInfo
- Publication number
- JPH0388384A JPH0388384A JP22482789A JP22482789A JPH0388384A JP H0388384 A JPH0388384 A JP H0388384A JP 22482789 A JP22482789 A JP 22482789A JP 22482789 A JP22482789 A JP 22482789A JP H0388384 A JPH0388384 A JP H0388384A
- Authority
- JP
- Japan
- Prior art keywords
- mounting holes
- inner diameter
- mounting
- mounting hole
- electronic component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims abstract description 17
- 229910000679 solder Inorganic materials 0.000 abstract description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 229910052742 iron Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
本発明は、ＳＩＰ部品等の電子部品を実装する電子部品
実装基板に関する。Detailed Description of the Invention [Object of the Invention] (Industrial Application Field) The present invention relates to an electronic component mounting board on which electronic components such as SIP components are mounted.
（従来の技術）
従来から、ＳＩＰ部品をプリント基板上に実装する場合
、例えば第３図に示すように行われている。(Prior Art) Conventionally, SIP components have been mounted on a printed circuit board as shown in FIG. 3, for example.
同図に示すように、プリント基板１上には、複数の取付
穴２が直線上に設けられており、これらの各取付穴２に
、ＳＩＰ部品３の直線上に設けられた複数のリード４を
それぞれ挿入する。As shown in the figure, a plurality of mounting holes 2 are provided in a straight line on a printed circuit board 1, and each of these mounting holes 2 has a plurality of leads 4 provided in a straight line on a SIP component 3. Insert each.
そして、取付穴２とリード４とを、フロー半田付け、リ
フロー半田付けまたは半田ごて等による半田付けにより
電気的かつ機械的に接続する。Then, the mounting hole 2 and the lead 4 are electrically and mechanically connected by flow soldering, reflow soldering, or soldering using a soldering iron or the like.
ところで、取付穴２とリード４との間には、適当な間隙
が設けられ、リード４が挿入し易いように、あるいは取
付穴２がスルーホール構造の場合は溶融した半田が流れ
込み易いようにされている。Incidentally, an appropriate gap is provided between the mounting hole 2 and the lead 4 so that the lead 4 can be easily inserted, or if the mounting hole 2 has a through-hole structure, molten solder can easily flow into it. ing.
しかしながら、このような間隙を設けた場合、第４図に
示すように、リード４が取付穴２内で遊びを生じ、５ｔ
ｐｚ品３全体が傾くという欠点がある。However, when such a gap is provided, as shown in FIG. 4, the lead 4 has play within the mounting hole 2, and the
There is a drawback that the entire pz product 3 is tilted.
そこで、例えば第５図に示すように、リード４にクラン
ク状のフォーミングを施すことにより、傾きを防止する
ことが行われている。Therefore, as shown in FIG. 5, for example, the lead 4 is formed into a crank shape to prevent the lead from tilting.
しかしながら、この場合、フォーミングを施すための手
間を要するという欠点がある。However, in this case, there is a drawback in that forming requires time and effort.
（発明が解決しようとする課題）
このように従来の技術によりＳＩＰ部品をプリント基板
上に実装する場合、ＳＩＰ部品が傾くという問題があっ
た。また、これを防止するため、ＳＩＰ部品のリードに
加工を施した場合、手間を要するという問題があった。(Problems to be Solved by the Invention) As described above, when mounting SIP components on a printed circuit board using the conventional technology, there is a problem that the SIP components are tilted. Further, in order to prevent this, when processing the leads of the SIP component, there is a problem in that it requires time and effort.
本発明は、このような問題を解決するために成されたも
ので、基板に実装される電子部品の傾きを手間を要する
ことなく防止することができる電子部品実装基板を提供
することを目的としている。The present invention was made to solve such problems, and an object of the present invention is to provide an electronic component mounting board that can prevent electronic components mounted on the board from tilting without any effort. There is.
［発明の構成］
（課題を解決するための手段）
本発明は、電子部品に直線上に設けられた複数のリード
を、基板上に直線上に設けられた複数の各取付穴に挿入
し、前記リードと前記取付穴とを半田付けにより電気的
にかつ機械的に接続してなる電子部品実装基板において
、前記基板上に直線上Ｉこ設けられた複数の取付穴のう
ち少なくとも一端に設けられた取付穴の内径を、前記半
田付けが可能な範囲で、他の取付穴の内径より小さくし
たものである。[Structure of the Invention] (Means for Solving the Problems) The present invention includes inserting a plurality of leads provided in a straight line on an electronic component into each of a plurality of mounting holes provided in a straight line on a board, In an electronic component mounting board in which the lead and the mounting hole are electrically and mechanically connected by soldering, the mounting hole is provided at at least one end of the plurality of mounting holes provided in a straight line on the board. The inner diameter of the attached mounting hole is made smaller than the inner diameter of the other mounting holes within a range that allows soldering.
（作 用）
本発明では、基板上に直線上に設けられた複数の取付穴
のうち少なくとも一端に設けられた取付穴の内径を、半
田付けが可能な範囲で、他の取付穴の内径より小さくし
たので、この内径の小さな取付穴に挿入されるリードは
、傾くことはなくしかも電子部品全体の傾きを抑えるこ
とになる。(Function) In the present invention, the inner diameter of the mounting hole provided at at least one end of the plurality of mounting holes provided in a straight line on the board is set to be smaller than the inner diameter of the other mounting holes to the extent that soldering is possible. Since it is made small, the lead inserted into the mounting hole with a small inner diameter will not tilt, and the tilt of the entire electronic component will be suppressed.
従って、基板に実装される電子部品の傾きを手間を要す
ることなく防止することができる。Therefore, tilting of the electronic components mounted on the board can be prevented without requiring much effort.
（実施例） 以下、本発明の一実施例を図面に基づき説明する。(Example) Hereinafter, one embodiment of the present invention will be described based on the drawings.
第１図はこの実施例に係る電子部品実装基板の要部の斜
視図である。FIG. 1 is a perspective view of the main parts of the electronic component mounting board according to this embodiment.
同図に示すように、プリント基板５・上には、スルーホ
ール構造をもつ複数の取付穴６が直線上に設けられてい
る。これら複数の取付穴６のうち一端に設けられた取付
穴６ａの内径は、第２図に示すように、半田付けが可能
な範囲即ち半田の流込みに影響のない範囲で、他の取付
穴６の内径より小さくされている。例えば、Ｓ！Ｐ部品
７のり一ド８の外径φ ０．５としたとき、前記他の取
付穴６の内径はφ ０．８、取付穴６ａの内径はφ ０
．６が適当である。As shown in the figure, a plurality of mounting holes 6 having a through-hole structure are provided in a straight line on the printed circuit board 5. As shown in FIG. 2, the inner diameter of the mounting hole 6a provided at one end of the plurality of mounting holes 6 is within the range that allows soldering, that is, the range that does not affect the flow of solder. The inner diameter is smaller than that of 6. For example, S! When the outer diameter of the glue 8 of the P part 7 is φ 0.5, the inner diameter of the other mounting hole 6 is φ 0.8, and the inner diameter of the mounting hole 6a is φ 0.
．． 6 is appropriate.
そして、これらの各取付穴６には、ＳＩＰ部品７の直線
上に設けられた複数のリード８がそれぞれ挿入され、取
付穴６とリード８とが、フロー半田付け、リフロー半田
付けまたは半田ごて等による半田付けにより電気的かつ
機械的に接続されている。A plurality of leads 8 provided on a straight line of the SIP component 7 are respectively inserted into each of these mounting holes 6, and the mounting holes 6 and leads 8 are connected by flow soldering, reflow soldering, or a soldering iron. They are electrically and mechanically connected by soldering.
従って、この本実施例によれば、内径の小さな取付穴６
ａに挿入されるＳＩＰ部品７のリードは、傾くことはな
くなり、これにより手間を要することなくＳＩＰ部品７
全体の傾きを抑えることができるようになる。Therefore, according to this embodiment, the mounting hole 6 with a small inner diameter
The leads of the SIP component 7 inserted into a will no longer be tilted, so the SIP component 7
This makes it possible to suppress the overall tilt.
尚、内径の小さな取付穴６ａを一端に設けたことで、Ｓ
ＩＰ部品の逆付は防止にもなる。In addition, by providing a mounting hole 6a with a small inner diameter at one end, S
It also prevents reverse mounting of IP parts.
［発明の効果］
以上説明したように、本発明によれば、基板上に直線上
に設けられた複数の取付穴のうち少なくとも一端に設け
られた取付穴の内径を、半田付けが可能な範囲で、他の
取付穴の内径より小さくしたので、基板に実装される電
子部品の傾きを手間を要することなく防止することがで
きる。[Effects of the Invention] As explained above, according to the present invention, the inner diameter of the mounting hole provided at at least one end of the plurality of mounting holes provided in a straight line on the board is within the range in which soldering is possible. Since the inner diameter of the mounting hole is made smaller than that of the other mounting holes, it is possible to prevent the electronic components mounted on the board from tilting without any effort.
第１図は本発明の一実施例に係る電子部品実装基板の要
部の斜視図、第２図は第１図に示した取付穴の断面図、
第３図乃至第５図は従来例を説明するための図である。
５・・・プリント基板、６・・・取付穴、６ａ・・・内
径中の取付穴、７・・・ＳＩＰ部品、８・・・リード。FIG. 1 is a perspective view of the main parts of an electronic component mounting board according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the mounting hole shown in FIG. 1,
3 to 5 are diagrams for explaining conventional examples. 5... Printed circuit board, 6... Mounting hole, 6a... Mounting hole in the inner diameter, 7... SIP parts, 8... Lead.
Claims (1)
上に直線上に設けられた複数の各取付穴に挿入し、前記
リードと前記取付穴とを半田付けにより電気的にかつ機
械的に接続してなる電子部品実装基板において、 前記基板上に直線上に設けられた複数の取付穴のうち少
なくとも一端に設けられた取付穴の内径が、前記半田付
けが可能な範囲で、他の取付穴の内径より小さくされて
いることを特徴とする電子部品実装基板。[Claims] A plurality of leads provided linearly on an electronic component are inserted into a plurality of mounting holes provided linearly on a circuit board, and the leads and the mounting holes are electrically connected by soldering. In the electronic component mounting board which is physically and mechanically connected, the inner diameter of the mounting hole provided at at least one end of the plurality of mounting holes provided in a straight line on the board is such that the soldering is possible. An electronic component mounting board characterized in that the inner diameter of the other mounting holes is smaller than that of the other mounting holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22482789A JPH0388384A (en) | 1989-08-31 | 1989-08-31 | Electronic component mounting board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22482789A JPH0388384A (en) | 1989-08-31 | 1989-08-31 | Electronic component mounting board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0388384A true JPH0388384A (en) | 1991-04-12 |
Family
ID=16819817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22482789A Pending JPH0388384A (en) | 1989-08-31 | 1989-08-31 | Electronic component mounting board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0388384A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014239800A (en) * | 2013-06-12 | 2014-12-25 | 株式会社ソフイア | Game machine |
| JP2016093603A (en) * | 2016-02-10 | 2016-05-26 | 株式会社ソフイア | Game machine |
-
1989
- 1989-08-31 JP JP22482789A patent/JPH0388384A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014239800A (en) * | 2013-06-12 | 2014-12-25 | 株式会社ソフイア | Game machine |
| JP2016093603A (en) * | 2016-02-10 | 2016-05-26 | 株式会社ソフイア | Game machine |
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