JPH10163607A - Printed circuit board device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the mounting strength by surely soldering long mounting pieces of mechanism components in a simple structure. SOLUTION: An elongated circular land 13a is formed round an elongated hole l2, and a mounting piece 14 of an antenna 14a pierces the elongated hole 12 with solder 14 formed on the entire area round the elongated circular land 13a. As a result, neither thick nor thin portion of the solder 15 appears and poor soldering or crack never occurs. The mounting piece 14 is butted to a land 13b. The solder 15 never penetrates the butted parts owing to the capillary effect and no crack occurs.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board device on which long mounting pieces such as an antenna, a connector and a metal housing are soldered and mounted.

[0002]

2. Description of the Related Art FIG. 9 is a front view showing the structure of a conventional printed circuit board device. FIG. 10 is a sectional view showing the configuration of a conventional printed circuit board device, and FIG. 11 is a perspective view of the configuration shown in FIG. 9, 10, and 11, in this example, a printed circuit board 1 is provided with, for example, an elongated hole 2 in which six round holes (through holes) are continuously formed. The long hole 2 is a through hole, and lands 3 having a shape similar to six round holes (through holes) are provided around the long hole 2. The pattern 3a is connected to the land 3. In the long hole 2, for example, the mounting piece 4 of the antenna 4a
Is inserted, and the mounting piece 4 is soldered with solder 5 through an automatic soldering device. As shown in FIG. 11, the solder 5 is attached to the mounting piece 4 of the antenna 4a penetrating the long hole 2.
Are solder 5a, 5b, 5 corresponding to the round shape of land 3.
c, 5d are formed. The solders 5a to 5d are:
In addition, it is formed all around the mounting piece 4.

FIG. 12 is a process diagram showing a state in which mechanical components are mounted on a conventional printed circuit board device. In FIG. 12, this example shows a printed circuit board
Are inserted into the elongated holes 13a, 13b, 13c, which are through holes. Thereafter, the solder 14 is attached to lands arranged around the long holes 13a to 13c.
a, 14b, and 14c are soldered. In this case, the mounting pieces 12a to 12c of the mechanical component 12 are long pieces similar to the mounting piece 4 shown in FIG.
As shown in FIG. In this case, a plurality of solders (5a to 5d) are formed on the solders 14a to 14c corresponding to the round shape of the land as shown in FIG.

FIG. 13 is a front view showing the configuration of another example of a conventional printed circuit board device. 13, in this example, for example, the mounting piece 4 of the antenna is bent into the long hole 2 of the printed circuit board 1 shown in FIG. 9, and only a part thereof is soldered with the solder 5. The solder in this case is shown in FIG.
A plurality of solders (5a to 5d) are formed corresponding to the round shape of the land as shown in FIG.

[0005]

However, in the above-mentioned conventional printed circuit board device, since the mounting pieces 4 of the antenna 4a are formed with the solders 5a to 5d corresponding to the round shape of the lands 3, the solder is thick. A portion and a thin portion are generated, and the solder is not apt to get in and cracks are easily generated. Further, as shown in FIG. 13, when a part of the mounting piece 4 is bent and soldered with the solder 5, there is a disadvantage that the mounting strength is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the prior art, and has an excellent printed circuit in which a long mounting piece of a mechanical component is securely soldered with a simple structure and its mounting strength is improved. A substrate device is provided.

[0007]

In order to achieve the above object, in a printed circuit board device according to the present invention, an oblong land formed around a long hole and a long mounting member are soldered. As a result, a thick portion and a thin portion are not generated as in the conventional example, and a long mounting piece of a mechanical component is securely soldered with a simple configuration, and the mounting strength is improved.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In a printed circuit board device according to the present invention, a long mounting member is inserted into a long hole formed by a continuous through hole formed in a printed circuit board, and the long hole is formed in a through hole. At the same time, an oval land portion is formed around the elongated hole, and the elongated mounting member and the land portion of the elongated hole are soldered.

Further, the printed circuit board device of the present invention comprises:
Both ends of the through hole formed in the elongated hole project on both sides of the printed circuit board, and one end of the elongated mounting member abuts one of the projected portions, and the elongated mounting member and the land portion of the elongated hole are soldered. Further, a part of the land portion is formed so as to protrude widely corresponding to the deformation of the long mounting member. Thereby, the land of the oval formed around the elongated hole and the long mounting member are soldered. Therefore, a thick portion and a thin portion as in the conventional example do not occur.

Next, an embodiment of the printed circuit board device of the present invention will be described in detail with reference to the drawings.

FIG. 1 is a front view showing the configuration of an embodiment of a printed circuit board device according to the present invention. FIG. 2 is a cross-sectional view showing the configuration of the printed circuit board device of the present invention, and FIG. 3 is a cross-sectional view showing another configuration of the printed circuit board device of the present invention. FIG. 4 shows a printed circuit board device according to the present invention.
FIG. 5 is a sectional view showing still another configuration, and FIG. 5 is a perspective view of the configuration shown in FIG.

1 and 5, in this example, a printed circuit board 11 is provided with, for example, an elongated hole 12 in which six round holes (through holes) are continuously formed. This long hole 12
Are through holes, and oval lands 13a and 13b are provided around the elongated hole 12. A pattern 13m is connected to the land 13a. For example, the mounting piece 14 of the antenna 14a is inserted into the long hole 12, and soldered with the solder 15 through an automatic soldering device. As shown in FIG. 5, the solder 15 is formed such that the mounting piece 14 of the antenna 14a penetrating the elongated hole 12 corresponds to the entire periphery of the oval land 13a. The solder 15 is attached to the entire periphery of the mounting piece 14 and the land 13a.

FIG. 3 is different from FIG. 3 in that the shape of the mounting piece 14 of the antenna 14a is different, and a notch is formed in the lateral direction. In FIG. 4, a notch is formed in the mounting piece 14 of the antenna 14a in the vertical direction.

Next, the function of this embodiment will be described. 1, 2, and 5, oblong lands 13 a and 13 b are provided around an elongated hole 12.
The mounting piece 14 of the antenna 14a abuts on 3b. As a result, the solder 15 does not seep into this portion due to the capillary phenomenon, and the solder 15 does not crack. As shown in FIG. 5, the solder 15 is formed so that the mounting piece 14 of the antenna 14a penetrating the elongated hole 12 corresponds to the entire periphery of the oval land 13a. As a result, a thick portion and a thin portion are not generated in the solder 15 unlike the conventional example, so that the solder does not ride or crack does not occur.

3 and 4, the connection area between the solder 15 and the mounting piece 14 is improved, and the mounting strength is improved.

FIG. 6 is a front view showing a configuration of a modification of the embodiment. 6, in this example, a printed circuit board 21 is provided with a long hole 22, a land 23, and a pattern 23m. The mounting piece 24 of the antenna is formed in a U-shape, and approximately half of the lower side of the mounting piece 24 in FIG.
Then, as shown in FIG. 5, it is inserted into the elongated hole 22 and soldering is performed. A substantially half of the upper side of the mounting piece 24 in the drawing is disposed on the protruding portion 23a of the land 23, and, for example, soldering is also performed here. In this case, the soldering area is improved, and the mounting strength is improved.

FIG. 7 is a front view showing another configuration of the modified example of the embodiment. In FIG. 7, in this example, a long hole 32, a land 33, and a pattern 33m are formed in a printed circuit board 31. The mounting piece 34 of the antenna is formed in the shape of an inverted letter in both directions from the center. The central part of the mounting piece 24 in the figure is a long hole 32 as shown in FIGS.
And soldering is performed. The upper and lower portions of the mounting piece 34 in the figure are disposed on the respective protruding portions 33a and 33b of the land 33, and for example, soldering is also performed here. In this case, the soldering area is improved, and the mounting strength is improved.

FIG. 8 is a front view showing still another configuration of the modification of the embodiment. In FIG. 8, in this example, a long hole 42 is formed in which four round holes (through holes) are arranged in parallel in a printed circuit board and arranged linearly with a step. Further, a land 43 and a pattern 43m are provided. As shown in FIGS. 1 to 5, the mounting pieces 44a and 44b of the antenna and the like are inserted into the long holes 42 having the steps, respectively, and soldering is performed. In this case, the mounting pieces 44a and 44b having various structures can be mounted by soldering.

[0019]

As is apparent from the above description, according to the printed circuit board device of the present invention, since the land portion of the oval formed around the long hole and the long mounting member are soldered, As in the conventional example, the portions where the solder is thick and the portion where the solder is thin do not occur, and the long mounting piece of the mechanical component is securely soldered with a simple configuration, so that the mounting strength can be improved.

[Brief description of the drawings]

FIG. 1 is a front view showing a configuration of an embodiment of a printed circuit board device of the present invention.

FIG. 2 is a sectional view showing a configuration of a printed circuit board device according to the present invention.

FIG. 3 is a sectional view showing another configuration of the printed circuit board device of the present invention.

FIG. 4 is a sectional view showing still another configuration of the printed circuit board device of the present invention.

FIG. 5 is a perspective view of the configuration shown in FIG. 1;

FIG. 6 is a front view showing a configuration of a modification of the embodiment.

FIG. 7 is a front view showing another configuration of the modified example of the embodiment.

FIG. 8 is a front view showing still another configuration of the modified example of the embodiment.

FIG. 9 is a front view showing the configuration of a conventional printed circuit board device.

FIG. 10 is a sectional view showing a configuration of a conventional printed circuit board device.

FIG. 11 is a perspective view of the configuration shown in FIG. 9;

FIG. 12 is a process diagram showing a state in which mechanical components are mounted on a conventional printed circuit board device.

FIG. 13 is a front view showing the configuration of another example of a conventional printed circuit board device.

[Explanation of symbols]

 11, 21, 31 Printed circuit board 12, 22, 32, 42 Slot 13a, 13b, 23, 33, 43 Land 13m, 23m, 33m, 43m Pattern 14, 24, 34, 44a, 44b Mounting piece 14a Antenna 15 Solder 23a, 33a, 33b Projection

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Yoshiki Goto Inventor Matsushita Communication Industrial Co., Ltd. 4-3-1 Tsunashima Higashi, Kohoku-ku, Yokohama-shi, Kanagawa

Claims (3)

[Claims] 1. A long mounting member is inserted into a long hole formed by a continuous through hole formed in a printed circuit board.
A printed circuit board, wherein the elongated hole is formed in the through hole, an oval land portion is formed around the elongated hole, and the long mounting member and the land portion of the elongated hole are soldered. apparatus. 2. The long mounting member according to claim 1, wherein both ends of the through hole formed in the elongated hole protrude from both sides of the printed circuit board, and one end of the long mounting member abuts one of the protruding portions. And a land portion of the elongated hole is soldered. 3. The printed circuit board device according to claim 1, wherein a part of the land portion is formed so as to protrude widely in response to the deformation of the long mounting member.