JPH0722784A - Decision of mounting order - Google Patents
Decision of mounting orderInfo
- Publication number
- JPH0722784A JPH0722784A JP5164631A JP16463193A JPH0722784A JP H0722784 A JPH0722784 A JP H0722784A JP 5164631 A JP5164631 A JP 5164631A JP 16463193 A JP16463193 A JP 16463193A JP H0722784 A JPH0722784 A JP H0722784A
- Authority
- JP
- Japan
- Prior art keywords
- mounting
- order
- region
- points
- mounting order
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、プリント基板に電子部
品を実装する際に効率的に実装できるように実装順序を
決定する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of deciding a mounting order so that electronic parts can be mounted efficiently on a printed circuit board.
【０００２】[0002]
【従来の技術】プリント基板に電子部品を実装する実装
機としては、図５に示すような全体構成のものがよく知
られている。図５において、１１は電子部品１０を実装
するプリント基板であり、Ｘ−Ｙ軸移動テーブル１２上
に固定され、電子部品１０を実装すべき所望位置が部品
装着位置に位置決めされる。電子部品１０を収容した多
数のパーツカセット１３がＺ軸移動テーブル１４上に設
置されており、所望の電子部品１０が部品吸着位置に位
置決めされる。Ｚ軸移動テーブル１４の移動方向を以後
Ｚ軸方向と呼ぶ。１５は部品吸着位置でパーツカセット
１３の電子部品１０を吸着保持して部品装着位置に搬送
し、プリント基板１１に実装する吸着ノズルであり、ロ
ータリーヘッド（図示せず）に固定されて矢印の如く部
品吸着位置と部品装着位置を通って旋回する。2. Description of the Related Art As a mounting machine for mounting electronic components on a printed circuit board, a mounting machine having an overall structure as shown in FIG. 5 is well known. In FIG. 5, reference numeral 11 denotes a printed circuit board on which the electronic component 10 is mounted, which is fixed on the XY axis moving table 12, and the desired position where the electronic component 10 should be mounted is positioned at the component mounting position. A large number of parts cassettes 13 accommodating the electronic components 10 are installed on the Z-axis moving table 14, and the desired electronic components 10 are positioned at the component suction position. The moving direction of the Z-axis moving table 14 is hereinafter referred to as the Z-axis direction. Reference numeral 15 denotes a suction nozzle that sucks and holds the electronic component 10 of the parts cassette 13 at the component suction position, conveys the electronic component 10 to the component mounting position, and mounts the electronic component 10 on the printed circuit board 11, and is fixed to a rotary head (not shown) as indicated by an arrow. It swivels through the component suction position and the component mounting position.
【０００３】以上の構成において、プリント基板１１に
実装すべき電子部品１０がＺ軸移動テーブル１４のＺ軸
方向の移動で部品吸着位置に移動すると、吸着ノズル１
５で吸着されて部品装着位置へ搬送される。一方、この
動作と並行してＸ−Ｙ軸移動テーブル１２上のプリント
基板１１が移動し、電子部品１０を実装すべき位置が部
品実装位置に位置決めされる。そして、吸着ノズル１５
で吸着された電子部品１０がプリント基板１１に実装さ
れる。以上の動作がプリント基板１１上に実装すべき電
子部品１０が無くなるまで繰り返される。In the above structure, when the electronic component 10 to be mounted on the printed board 11 moves to the component suction position by the movement of the Z-axis moving table 14 in the Z-axis direction, the suction nozzle 1
It is adsorbed at 5 and conveyed to the component mounting position. On the other hand, in parallel with this operation, the printed board 11 on the XY axis moving table 12 moves, and the position where the electronic component 10 is to be mounted is positioned at the component mounting position. And the suction nozzle 15
The electronic component 10 sucked in is mounted on the printed board 11. The above operation is repeated until there is no electronic component 10 to be mounted on the printed board 11.
【０００４】このような実装機において、その生産性を
高めるためには、１枚のプリント基板１１に対する実装
時間が最短になるように電子部品１０の実装順序を決定
する必要があり、そのための各種方法が従来から考えら
れている。In order to increase the productivity of such a mounting machine, it is necessary to determine the mounting order of the electronic components 10 so that the mounting time for one printed circuit board 11 is the shortest. Methods have been previously considered.
【０００５】例えば、適当な実装位置を最初の実装位置
とし、現在の実装位置からの移動量の少ない次の実装位
置を数点見つけ、その中で実装条件に応じて最短時間の
実装位置を求めて次の実装位置とするという処理を繰り
返すという方法が一般的に行われている。For example, an appropriate mounting position is set as the first mounting position, several next mounting positions having a small amount of movement from the current mounting position are found, and the mounting position of the shortest time is obtained in accordance with the mounting conditions. Generally, a method of repeating the process of setting the next mounting position is performed.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、上記の
ような実装順序の決定方法では次のような問題がある。However, the above method of determining the mounting order has the following problems.
【０００７】第１に、次の実装位置の候補を数点求め
て、その中から更に最適な位置を選択するという試行錯
誤を繰り返すために、解を求めるのに時間がかかってし
まうという問題がある。例えば、多品種少量生産のため
に多種のプリント基板を生産する実装工程では、短時間
で各種のプリント基板の最適実装順序を決定する必要が
あるが、それに対処できないことがあるという問題があ
る。First, there is a problem that it takes a long time to find a solution because a trial and error process of finding several next mounting position candidates and selecting a more optimum position from them is repeated. is there. For example, in a mounting process for producing various printed circuit boards for high-mix low-volume production, it is necessary to determine the optimum mounting order of various printed circuit boards in a short time, but there is a problem that it may not be possible to cope with it.
【０００８】第２に、実装順序は、移動時間が最短とな
る順序以外に、各種の実装条件が実装機の種類、電子部
品の種類、プリント基板の生産計画等によって変化する
ため、それに応じて解を求める処理方法も変える必要が
あり、解を求めるのに一層時間がかかるという問題があ
る。例えば、高速実装機では体積の小なる部品を優先す
る必要があり、また実装機の吸着ノズルの形状の干渉を
考慮して必ず実装順序が決まる電子部品の実装位置関係
もあり、このように条件に応じて処理方法を変えるのは
多くの労力がかかり、また間違いも発生し易いという問
題がある。Secondly, in addition to the order in which the movement time is the shortest, various mounting conditions vary depending on the type of mounting machine, the type of electronic component, the production plan of the printed circuit board, etc. It is necessary to change the processing method for obtaining the solution, and there is a problem that it takes more time to obtain the solution. For example, in a high-speed mounting machine, it is necessary to give priority to parts with smaller volumes, and there is also the mounting positional relationship of electronic parts where the mounting order is always determined in consideration of the interference of the shape of the suction nozzle of the mounting machine. There is a problem that it takes a lot of labor to change the processing method depending on the situation, and errors are likely to occur.
【０００９】本発明は、上記従来の問題点に鑑み、最適
な実装順序を簡単に短時間で決定することができ、また
各種実装条件の変化に対しても容易に対処できる実装順
序の決定方法を提供することを目的とする。In view of the above-mentioned conventional problems, the present invention can determine the optimum mounting order easily and in a short time, and can easily cope with the changes in various mounting conditions. The purpose is to provide.
【００１０】[0010]
【課題を解決するための手段】本発明は、電子部品の実
装順序を決定するための条件に基づいて実装領域を分割
する第１工程と、分割した各領域で実装時間が最短とな
る順序を求める第２工程と、各領域の実装順序をつなぎ
合わせて全体の実装順序を決定する第３工程とから成る
ことを特徴とする。According to the present invention, there is provided a first step of dividing a mounting area on the basis of a condition for determining a mounting order of electronic components, and an order in which the mounting time is shortest in each divided area. It is characterized by comprising a second step of obtaining and a third step of connecting the mounting order of the respective areas to determine the overall mounting order.
【００１１】また、電子部品の実装順序を決定するため
の条件を複数指定してそれらの複数の条件が成立するよ
うに実装領域を分割する第１工程と、分割した各領域で
実装時間が最短となる順序を求める第２工程と、各領域
の実装順序をつなぎ合わせて全体の実装順序を決定する
第３工程とから成ることを特徴とする。The first step of designating a plurality of conditions for determining the mounting order of electronic components and dividing the mounting area so that the plurality of conditions are satisfied, and the mounting time is the shortest in each divided area. It is characterized by comprising a second step of determining the order of the above, and a third step of connecting the mounting orders of the respective areas to determine the overall mounting order.
【００１２】[0012]
【作用】本発明によれば、実装順序を決定するための条
件に基づいて最適条件が自明になるまで実装領域を分割
し続け、次に自明な最適実装順序をつなぎ合わせるとい
う処理によって実装順序を決定できるので、試行錯誤が
なく、極めて短時間でほぼ最適な実装順序の解を求める
ことができ、また実装順序を決定するための条件を変え
ることで、実装領域の分割方法が変わるため、実装機の
種類や電子部品の種類が変わった場合にも統一した処理
によって最適な実装順序を決定することができる。According to the present invention, the mounting area is continuously divided based on the condition for determining the mounting order until the optimum condition becomes obvious, and then the obvious optimum mounting order is connected to determine the mounting order. Since it can be determined, there is no trial and error, and it is possible to find the solution of the most suitable mounting order in an extremely short time.Also, by changing the conditions for determining the mounting order, the method of dividing the mounting area changes. Even when the type of machine or the type of electronic component is changed, the optimum mounting order can be determined by the unified processing.
【００１３】また、実装順序を決定するための条件を複
数指定してそれらの条件が成立するように実装領域を分
割して行くことにより、各種最適化条件を総合した最適
な実装順序を短時間で決定することができる。Further, by designating a plurality of conditions for determining the mounting order and dividing the mounting area so that those conditions are satisfied, the optimum mounting order in which various optimization conditions are integrated can be determined in a short time. Can be determined at.
【００１４】[0014]
【実施例】以下、本発明の実装順序の決定方法の一実施
例について、図１〜図３を参照しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the method for determining the mounting order according to the present invention will be described below with reference to FIGS.
【００１５】本実施例の実装順序決定方法による処理を
図１に示す。図１において、ステップ＃１で実装条件と
それに対応した実装領域の分割方法を決める。ここで
は、実装条件として実装点間の総移動距離を最短にする
という条件を満たすために、プリント基板上の実装領域
を、より正方形に近くなる方向に順次２分割して行くと
いう方法を採用している。FIG. 1 shows the processing by the mounting order determining method of this embodiment. In FIG. 1, in step # 1, the mounting condition and the mounting area dividing method corresponding thereto are determined. Here, in order to satisfy the condition that the total movement distance between the mounting points is the shortest as a mounting condition, a method of sequentially dividing the mounting area on the printed circuit board into two in a direction closer to a square is adopted. ing.
【００１６】次にステップ＃２で、ステップ＃１の分割
方法に基づいて実装領域を２分割する。図２にその具体
例を示している。まず実装点Ｐの中でＸの最大値と最小
値の差を求めてΔＸとし、Ｙの最大値と最小値の差を求
めてΔＹとし、図示例のようにΔＸ＞ΔＹの場合は、分
割線１によって実装点Ｐの数が半分になるようにＸ方向
に領域４と領域５に２分割する。Next, in step # 2, the mounting area is divided into two based on the dividing method of step # 1. FIG. 2 shows a specific example thereof. First, in the mounting point P, the difference between the maximum value and the minimum value of X is calculated to be ΔX, the difference between the maximum value and the minimum value of Y is calculated to be ΔY, and when ΔX> ΔY as shown in the figure, the division is performed. The line 1 divides the area into two areas 4 and 5 in the X direction so that the number of mounting points P is halved.
【００１７】次にステップ＃３で、分割された領域４、
５をそれぞれ上記と同様に２分割して行き、分割された
領域内の実装点Ｐ、Ｐ間の移動距離が最小となる実装順
序が自明となるまでその分割処理を繰り返す。例えば図
２の図示例では、領域５について分割線２によって領域
６と領域７に２分割し、領域４についても同様に２分割
する。次に、領域７について分割線３によって領域８と
領域９に２分割し、領域６や領域４内の分割領域につい
ても同様に２分割する。その結果、領域８、領域９のよ
うにその領域内の実装点Ｐが２点又は３点になって実装
順序が三角形又は線分を呈するようになり、その領域内
での実装順序が自明となる。Next, in step # 3, the divided area 4,
5 is divided into two in the same manner as described above, and the division processing is repeated until the mounting order in which the mounting distance P between the mounting points P in the divided area becomes the minimum becomes obvious. For example, in the example shown in FIG. 2, the area 5 is divided into two areas, the area 6 and the area 7, by the division line 2, and the area 4 is similarly divided into two. Next, the region 7 is divided into two by the division line 3 into the region 8 and the region 9, and the divided regions in the regions 6 and 4 are also divided into two. As a result, the mounting points P in the area become 2 or 3 points like the areas 8 and 9 and the mounting order becomes a triangle or a line segment, and the mounting order in the area becomes obvious. Become.
【００１８】次にステップ＃４、＃５で、分割した領域
が無くなるまで分割した領域を逆に結合して行く。図２
の例では領域８、領域９における実装点Ｐに対して、そ
れぞれ三角形の頂点を左回りでつなぐ規則を適用して
の実装順序を決定する。次に図３に示すように、領域８
と領域９を結合しての実装順序をつなぎ、の実装順
序を決定する。同様に領域６についてもの実装順序を
決定する。次に、領域６と領域７を結合しての実装順
序をつなぎ、の実装順序を決定する。同様に領域４に
ついてもの実装順序を決定する。最後に、領域４と領
域５を結合しての実装順序をつなぎ、実線で示すの
実装順序を決定する。かくして、全実装点Ｐの実装順序
が決定される。Next, in steps # 4 and # 5, the divided areas are joined in reverse until there is no more divided area. Figure 2
In the example, the mounting order is determined by applying the rule of connecting the vertices of the triangles counterclockwise to the mounting points P in the regions 8 and 9. Next, as shown in FIG.
And the area 9 are connected to connect the mounting order, and the mounting order is determined. Similarly, the mounting order for the area 6 is determined. Next, the area 6 and the area 7 are combined and the mounting order is connected to determine the mounting order. Similarly, the mounting order for the area 4 is determined. Finally, the areas 4 and 5 are combined to connect the mounting order, and the mounting order indicated by the solid line is determined. Thus, the mounting order of all mounting points P is determined.
【００１９】以上のように、実装領域をより正方形に近
くなる方向に順次２分割して行き、実装順序が自明な最
小分割領域になると、逆に分割領域を順次結合しながら
実装順序をつないで行って全実装点の実装順序を決定す
ることにより、簡単でかつ短時間の処理によって、常に
最短の解が得られる訳ではないにしても、総移動距離を
ほぼ最短にできる実装順序を決定することができる。As described above, when the mounting area is sequentially divided into two in a direction closer to a square, and the mounting order becomes the self-evident minimum divided area, conversely, the mounting areas are sequentially connected while connecting the mounting order. By determining the mounting order of all the mounting points, the mounting order that can make the total movement distance almost the shortest is determined by a simple and short-time process even if the shortest solution is not always obtained. be able to.
【００２０】次に、本発明の他の実施例について図４を
参照して説明する。上記実施例ではプリント基板上にお
ける実装点間の移動量（図５のＬXY）だけを条件にした
が、この実施例ではＺ軸方向の移動量（図５のＬZ ）、
即ち実装すべき電子部品が部品吸着位置まで移動する距
離を条件として加えている。実装機のＺ軸方向の移動量
は、Ｘ、Ｙ方向の移動とは単位が異なるため、図４に示
すようなＸ、Ｙ、Ｚ座標の実装領域を設定するには適当
な重み付けをする必要がある。例えば、Ｘ、Ｙ軸の１単
位移動量をＺ軸の１／Ｎ単位の移動量と等しいとする。
このようにして、実装条件に関する３次元的な領域を設
定することにより、領域をより立方体に近くなるという
条件で分割して行くことで、上記実施例の２次元の場合
と同様の処理を行ってＺ軸方向の移動量を条件に含め
た、より最適な実装順序を決定することができる。Next, another embodiment of the present invention will be described with reference to FIG. In the above embodiment, only the amount of movement between the mounting points on the printed circuit board (L XY in FIG. 5) was used as a condition, but in this embodiment, the amount of movement in the Z-axis direction (L Z in FIG. 5),
That is, the distance that the electronic component to be mounted moves to the component suction position is added as a condition. Since the amount of movement of the mounting machine in the Z-axis direction is different from the unit of movement in the X and Y directions, appropriate weighting is required to set the mounting areas of the X, Y, and Z coordinates as shown in FIG. There is. For example, it is assumed that one unit movement amount of the X and Y axes is equal to 1 / N unit movement amount of the Z axis.
In this way, by setting a three-dimensional area related to the mounting conditions, the area is divided on the condition that it becomes closer to a cube, and the same processing as in the two-dimensional case of the above embodiment is performed. Therefore, a more optimal mounting order can be determined in which the amount of movement in the Z-axis direction is included in the conditions.
【００２１】さらに、部品の体積順等の実装条件による
分割条件の追加は、次元を数学的に増加して処理するこ
とにより容易に可能である。Furthermore, it is possible to easily add a division condition according to the mounting conditions such as the order of volume of the parts by mathematically increasing the dimension and processing.
【００２２】[0022]
【発明の効果】本発明の実装順序の決定方法によれば、
以上のように、実装順序を決定するための条件に基づい
て最適条件が自明になるまで実装領域を分割し続け、次
に自明な最適実装順序をつなぎ合わせるという処理によ
って実装順序を決定するので、試行錯誤がなく、極めて
短時間でほぼ最適な実装順序の解を求めることができ、
また実装順序を決定するための条件を変えることで、実
装領域の分割方法が変わるため、実装機の種類や電子部
品の種類が変わった場合にも統一した処理によって最適
な実装順序を決定することができる。According to the method of determining the mounting order of the present invention,
As mentioned above, based on the conditions for determining the mounting order, the mounting area is continuously divided until the optimum condition becomes obvious, and then the mounting order is determined by the process of connecting the obvious optimum mounting order. There is no trial and error, and it is possible to find a solution with an almost optimal mounting order in an extremely short time.
Also, changing the conditions for determining the mounting order changes the method of dividing the mounting area, so even if the type of mounting machine or the type of electronic component changes, the optimum mounting order can be determined by unified processing. You can
【００２３】また、実装順序を決定するための条件を複
数指定してそれらの条件が成立するように実装領域を分
割して行くことにより、各種最適化条件を総合した最適
な実装順序を短時間で決定することができる。Further, by designating a plurality of conditions for determining the mounting order and dividing the mounting area so that those conditions are satisfied, the optimum mounting order in which various optimization conditions are integrated can be determined in a short time. Can be determined at.
【図１】本発明の一実施例における処理のフローチャー
トである。FIG. 1 is a flowchart of processing according to an embodiment of the present invention.
【図２】同実施例における領域を分割する工程の説明図
である。FIG. 2 is an explanatory diagram of a process of dividing an area in the embodiment.
【図３】同実施例における分割した領域をつなぐ工程の
説明図である。FIG. 3 is an explanatory diagram of a process of connecting divided areas in the embodiment.
【図４】本発明の他の実施例における分割方法の説明図
である。FIG. 4 is an explanatory diagram of a dividing method according to another embodiment of the present invention.
【図５】実装機の概略構成を示す平面図である。FIG. 5 is a plan view showing a schematic configuration of a mounting machine.
Ｐ 実装点 １、２、３ 分割線 ４、５、６、７、８、９ 分割領域 P Mounting point 1, 2, 3 Dividing line 4, 5, 6, 7, 8, 9 Dividing area
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｇ０６Ｆ 17/50 // Ｇ０５Ｂ 19/418 (72)発明者 佐藤 健一 大阪府門真市大字門真1006番地 松下電器 産業株式会社内─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification number Reference number within the agency FI Technical display location G06F 17/50 // G05B 19/418 (72) Inventor Kenichi Sato 1006 Kadoma, Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.
Claims (2)
件に基づいて実装領域を分割する第１工程と、分割した
各領域で実装時間が最短となる順序を求める第２工程
と、各領域の実装順序をつなぎ合わせて全体の実装順序
を決定する第３工程とから成ることを特徴とする実装順
序の決定方法。1. A first step of dividing a mounting area based on a condition for determining a mounting order of electronic components, a second step of obtaining an order in which the mounting time is the shortest in each divided area, and each area. And a third step of determining the entire mounting order by connecting the mounting orders of the above.
件を複数指定してそれらの複数の条件が成立するように
実装領域を分割する第１工程と、分割した各領域で実装
時間が最短となる順序を求める第２工程と、各領域の実
装順序をつなぎ合わせて全体の実装順序を決定する第３
工程とから成ることを特徴とする実装順序の決定方法。2. A first step of designating a plurality of conditions for determining a mounting order of electronic components and dividing a mounting area so that the plurality of conditions are satisfied, and a mounting time is the shortest in each divided area. The second step of determining the order of the above and the third order of connecting the mounting order of each area to determine the total mounting order
A method for determining a mounting order, which comprises:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16463193A JP3461532B2 (en) | 1993-07-02 | 1993-07-02 | How to determine the mounting order |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16463193A JP3461532B2 (en) | 1993-07-02 | 1993-07-02 | How to determine the mounting order |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0722784A true JPH0722784A (en) | 1995-01-24 |
| JP3461532B2 JP3461532B2 (en) | 2003-10-27 |
Family
ID=15796877
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16463193A Expired - Fee Related JP3461532B2 (en) | 1993-07-02 | 1993-07-02 | How to determine the mounting order |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3461532B2 (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2000001211A1 (en) * | 1998-06-27 | 2000-01-06 | Daewoo Electronics Co., Ltd. | Method for generating an insertion path of a new printed circuit board by using an insertion path of a previously-used printed circuit board |
| WO2000001212A1 (en) * | 1998-06-27 | 2000-01-06 | Daewoo Electronics Co., Ltd. | Method for setting an option for automatic insertion path generation of a component inserter |
| US6260178B1 (en) | 1999-03-26 | 2001-07-10 | Philips Electronics North America Corporation | Component placement machine step size determination for improved throughput via an evolutionary algorithm |
| SG94693A1 (en) * | 1995-12-29 | 2003-03-18 | Compaq Computer Corp | Component placement |
| JP2003131714A (en) * | 2000-11-13 | 2003-05-09 | Sumitomo Heavy Ind Ltd | Method and device for working plan, and for preparing working data therefor |
| JP2006053951A (en) * | 2000-11-13 | 2006-02-23 | Sumitomo Heavy Ind Ltd | Method and device for working planning, and working method and device |
| CN101945570A (en) * | 2010-09-28 | 2011-01-12 | 福建捷联电子有限公司 | Method for expanding mountable length range of mounting machine |
| CN103747628A (en) * | 2013-12-27 | 2014-04-23 | 四川凯越光电科技股份有限公司 | A tool dedicated to a chip mounter |
-
1993
- 1993-07-02 JP JP16463193A patent/JP3461532B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| SG94693A1 (en) * | 1995-12-29 | 2003-03-18 | Compaq Computer Corp | Component placement |
| WO2000001211A1 (en) * | 1998-06-27 | 2000-01-06 | Daewoo Electronics Co., Ltd. | Method for generating an insertion path of a new printed circuit board by using an insertion path of a previously-used printed circuit board |
| WO2000001212A1 (en) * | 1998-06-27 | 2000-01-06 | Daewoo Electronics Co., Ltd. | Method for setting an option for automatic insertion path generation of a component inserter |
| US6260178B1 (en) | 1999-03-26 | 2001-07-10 | Philips Electronics North America Corporation | Component placement machine step size determination for improved throughput via an evolutionary algorithm |
| JP2003131714A (en) * | 2000-11-13 | 2003-05-09 | Sumitomo Heavy Ind Ltd | Method and device for working plan, and for preparing working data therefor |
| JP2006053951A (en) * | 2000-11-13 | 2006-02-23 | Sumitomo Heavy Ind Ltd | Method and device for working planning, and working method and device |
| CN101945570A (en) * | 2010-09-28 | 2011-01-12 | 福建捷联电子有限公司 | Method for expanding mountable length range of mounting machine |
| CN103747628A (en) * | 2013-12-27 | 2014-04-23 | 四川凯越光电科技股份有限公司 | A tool dedicated to a chip mounter |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3461532B2 (en) | 2003-10-27 |
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