JPH0697641A - Method of feeding solder paste - Google Patents
Method of feeding solder pasteInfo
- Publication number
- JPH0697641A JPH0697641A JP24240092A JP24240092A JPH0697641A JP H0697641 A JPH0697641 A JP H0697641A JP 24240092 A JP24240092 A JP 24240092A JP 24240092 A JP24240092 A JP 24240092A JP H0697641 A JPH0697641 A JP H0697641A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- solder paste
- suction
- screen printing
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、表面実装部品とスルー
ホール実装部品の混載をリフロー半田付けで行うための
基板への半田ペースト供給方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for supplying solder paste to a substrate for carrying out mixed mounting of surface mount components and through hole mount components by reflow soldering.
【０００２】昨今、電子機器の小型化・軽量化のため部
品実装の基板は小型化・軽量化が要求されており、実装
する部品も従来のスルーホール実装型から表面実装型へ
と切り替わってきている。しかし、機械的な実装強度が
要求される部品、例えばコネクタなどは、まだスルーホ
ール実装型が主流であり、基板は表面実装部品及びスル
ーホール実装部品の混載となっている。In recent years, there has been a demand for miniaturization and weight reduction of component mounting boards in order to reduce the size and weight of electronic devices, and the components to be mounted have been switched from the conventional through-hole mounting type to the surface mounting type. There is. However, for components requiring mechanical mounting strength, such as connectors, the through-hole mounting type is still the mainstream, and the board is a mixture of surface-mounting components and through-hole mounting components.
【０００３】これら部品の実装は半田付けによって行う
が、その半田付けをリフロー半田付けで行う場合は、基
板の半田付け箇所に予め半田ペーストを供給しておく必
要がある。The mounting of these components is carried out by soldering. When the soldering is carried out by reflow soldering, it is necessary to supply a solder paste in advance to the soldering portion of the board.
【０００４】[0004]
【従来の技術】上記混載を行う従来の方法は、先ず、基
板の表面実装用パッドに半田ペーストをスクリーン印刷
により供給し、表面実装部品をそのパッドに載せてリフ
ロー半田付けにより実装した後、スルーホール実装部品
をスルーホールに挿入してフロー半田付けにより実装す
るという２種類の半田付け工程が必要である。2. Description of the Related Art In the conventional method for carrying out the above mixed mounting, first, a solder paste is supplied to a surface mounting pad of a substrate by screen printing, a surface mounting component is mounted on the pad and mounted by reflow soldering, and then a through soldering is performed. Two types of soldering processes are required, in which the hole mounting component is inserted into the through hole and mounted by flow soldering.
【０００５】これに対して、上記スクリーン印刷を行う
と共にスルーホールに半田ペーストを塗布ノズルにより
供給し、リフロー半田付けだけで混載の実装を行う方法
がある。この方法は、半田付け工程が１種類で然も１回
で済むという利点がある。しかしながら、塗布ノズルを
用いるのでスルーホールの数が多いと半田ペーストの供
給に要する工数が多くなってしまう。On the other hand, there is a method of performing the above-described screen printing, supplying solder paste to the through holes by a coating nozzle, and performing mixed mounting only by reflow soldering. This method has the advantage that the number of soldering steps is one and only one is required. However, since the coating nozzle is used, if the number of through holes is large, the number of steps required to supply the solder paste will be large.
【０００６】[0006]
【発明が解決しようとする課題】上記後者の方法では、
半田ペーストのスルーホールへの供給量をパッドへの供
給量より多くするする必要があるため、スルーホールへ
の供給に塗布ノズルを用いている。パッドへの供給に用
いるスクリーン印刷は、供給箇所数が多くなっても能率
が良い。従って、スクリーン印刷を適用してスルーホー
ルにも適量な半田ペーストを供給できるようになれば、
スルーホールの数が多くなっても半田ペーストの供給に
要する工数が増えないで済む。SUMMARY OF THE INVENTION In the latter method described above,
Since it is necessary to make the supply amount of the solder paste to the through hole larger than the supply amount to the pad, an application nozzle is used for the supply to the through hole. The screen printing used for supplying to the pad is efficient even when the number of supplying places is large. Therefore, if it becomes possible to supply an appropriate amount of solder paste to the through holes by applying screen printing,
Even if the number of through holes increases, the number of steps required to supply the solder paste does not increase.
【０００７】そこで本発明は、表面実装部品とスルーホ
ール実装部品の混載をリフロー半田付けで行うための基
板への半田ペースト供給方法に関し、表面実装用のパッ
ドとスルーホール実装用のスルーホールに、スクリーン
印刷を適用してそれぞれで適量な半田ペーストを供給で
きるようにすることを目的とする。Therefore, the present invention relates to a method for supplying a solder paste to a substrate for carrying out mixed mounting of surface mount components and through hole mount components by reflow soldering, in which surface mount pads and through hole mount through holes are provided. The purpose is to apply screen printing so that an appropriate amount of solder paste can be supplied to each.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成するため
に、本発明による半田ペースト供給方法は、表面実装用
のパッドとスルーホール実装用のスルーホールとを有す
る基板の該パッドと該スルーホールに半田ペーストを供
給する方法であって、供給条件を該パッドに合わせたス
クリーン印刷により該パッド及び該スルーホールに半田
ペーストを供給し、その際、該基板の裏面から該スルー
ホール内の空気を吸引することを特徴としている。In order to achieve the above object, a solder paste supply method according to the present invention is a pad and a through hole of a substrate having a pad for surface mounting and a through hole for mounting through hole. A solder paste is supplied to the pad and the through hole by screen printing in which the supply condition is adjusted to the pad, and at that time, the air in the through hole is blown from the back surface of the substrate. Characterized by suction.
【０００９】[0009]
【作用】スクリーン印刷による半田ペーストの供給は、
マスクの厚さ、マスク開口部の寸法、スキージの圧力、
スキージのマスクとなす角度、スキージの硬度、スキー
ジの移動速度、マスクと基板とのギャップ、などにより
供給量が定まるので、供給条件を上記パッドに合わせる
ことができる。[Operation] Supplying solder paste by screen printing
Mask thickness, mask opening dimensions, squeegee pressure,
Since the supply amount is determined by the angle formed by the squeegee with the mask, the hardness of the squeegee, the moving speed of the squeegee, the gap between the mask and the substrate, etc., the supply conditions can be adjusted to the pad.
【００１０】ところがその条件では、上記スルーホール
に対する供給量が不足する。しかし上記吸引を行えば、
半田ペーストがスルーホール内に吸い込まれてこの不足
を補填することができる。However, under that condition, the supply amount to the through hole is insufficient. However, if the above suction is performed,
The solder paste can be sucked into the through holes to make up for this shortage.
【００１１】従って、表面実装用のパッドとスルーホー
ル実装用のスルーホールに、スクリーン印刷を適用して
それぞれで適量な半田ペーストを供給できるようにな
り、然もそのスクリーン印刷を１回で済ますことができ
る。Therefore, it becomes possible to apply an appropriate amount of solder paste to each of the surface mounting pad and the through hole mounting through hole to supply an appropriate amount of solder paste, and the screen printing can be performed only once. You can
【００１２】[0012]
【実施例】以下本発明の実施例について図１及び図２を
用いて説明する。図１は実施例の要部を示す断面図、図
２は実施例におけるスルーホールの吸引機構を示す断面
図、である。Embodiments of the present invention will be described below with reference to FIGS. FIG. 1 is a sectional view showing a main part of the embodiment, and FIG. 2 is a sectional view showing a through-hole suction mechanism in the embodiment.
【００１３】図１において、１は基板、２は基板１にお
ける表面実装用のパッド、３は同じくスルーホール実装
用のスルーホール、４はスクリーン印刷のマスク、５は
同じくマスク開口部、６は同じくスキージ、７は半田ペ
ースト、８は吸引、である。In FIG. 1, 1 is a substrate, 2 is a pad for surface mounting on the substrate 1, 3 is also a through hole for mounting a through hole, 4 is a screen printing mask, 5 is a mask opening, and 6 is the same. A squeegee, 7 is solder paste, and 8 is suction.
【００１４】スクリーン印刷は、パッド２に適量な半田
ペースト７が供給される条件でスキージ６を移動させて
行う。その際、基板１の裏面から吸引８によりスルーホ
ール３内の空気を吸引する。半田ペースト７のパッド２
への供給は、吸引８が関係しないのでパッド２にとって
適量となり、スルーホール３への供給は、吸引８が半田
ペースト７をスルーホール３内に吸い込んで半田ペース
ト７の供給量を多くし、スルーホール３にとって適量と
なる。Screen printing is performed by moving the squeegee 6 under the condition that an appropriate amount of the solder paste 7 is supplied to the pad 2. At that time, the air in the through hole 3 is sucked by the suction 8 from the back surface of the substrate 1. Pad 2 of solder paste 7
The supply to the through hole 3 is appropriate for the pad 2 because the suction 8 is not involved. This is a proper amount for Hall 3.
【００１５】若し、スルーホール３への供給量に過不足
がある場合は、吸引８の強さを加減すればよい。本発明
者の実験によれば、吸引８を調整して半田ペースト７の
供給量を増加させることにより、スルーホール３内を半
田ペースト７で完全に充填することも可能である。If there is an excess or deficiency in the amount supplied to the through hole 3, the strength of the suction 8 may be adjusted. According to the experiment of the present inventor, it is possible to completely fill the inside of the through hole 3 with the solder paste 7 by adjusting the suction 8 to increase the supply amount of the solder paste 7.
【００１６】図２の（ａ）及び（ｂ）は、それぞれが吸
引８のための機構を示す。図中、９はスクリーン印刷機
に備えられて基板１を保持する基板保持台、１０は吸引
孔１１を介して基板１を基板保持台９に固定するための
吸引、１２は吸引８のための吸引孔、である。吸引孔１
１はスルーホール３の位置を外して配置され、吸引孔１
２はスルーホール３の位置に配置される。2 (a) and 2 (b) each show a mechanism for the suction 8. In the figure, 9 is a substrate holder provided in a screen printing machine for holding the substrate 1, 10 is suction for fixing the substrate 1 to the substrate holder 9 through a suction hole 11, and 12 is suction 8 It is a suction hole. Suction hole 1
1 is arranged by removing the position of the through hole 3, and the suction hole 1
2 is arranged at the position of the through hole 3.
【００１７】図２（ａ）では、吸引１０を利用して吸引
８を行っている。吸引１０のための吸気装置はスクリー
ン印刷機に備えられているので、吸引８のためとして別
の吸気装置を必要としない利点がある。一方、図２
（ｂ）では、吸引８を独立させてある。このため別の吸
気装置を必要とするが、半田ペースト７のスルーホール
３への供給量を図２（ａ）の場合より広範囲に加減でき
る利点がある。In FIG. 2A, the suction 8 is performed by utilizing the suction 10. Since the suction device for the suction 10 is provided in the screen printing machine, there is the advantage that no separate suction device is required for the suction 8. On the other hand, FIG.
In (b), the suction 8 is made independent. Therefore, another air intake device is required, but there is an advantage that the supply amount of the solder paste 7 to the through hole 3 can be adjusted in a wider range than in the case of FIG.
【００１８】なお、スクリーン印刷で半田ペースト７が
スルーホール３上に達する前に、吸引８によりスルーホ
ール３を通り抜ける空気が多過ぎる場合は、吸引孔１２
の細い部分をスルーホール３より適宜に狭くして空気の
流量を制限すれば良い。半田ペースト７がスルーホール
３上に達するとその流量はほぼ０となるので、吸引８の
機能には悪影響を与えない。If too much air passes through the through hole 3 by the suction 8 before the solder paste 7 reaches the through hole 3 by screen printing, the suction hole 12
It is sufficient to narrow the narrow portion of the area as appropriate from the through hole 3 to limit the flow rate of air. When the solder paste 7 reaches the through holes 3, the flow rate of the solder paste 7 becomes almost 0, so that the function of the suction 8 is not adversely affected.
【００１９】[0019]
【発明の効果】以上説明したように本発明によれば、表
面実装部品とスルーホール実装部品の混載をリフロー半
田付けで行うための基板への半田ペースト供給方法に関
し、表面実装用のパッドとスルーホール実装用のスルー
ホールに、スクリーン印刷を適用してそれぞれで適量な
半田ペーストを供給できるようになり、然もそのスクリ
ーン印刷を１回で済ますことができて、半田ペーストの
供給に要する時間の大幅な短縮を可能にさせる効果があ
る。As described above, according to the present invention, a method for supplying solder paste to a substrate for carrying out mixed mounting of surface mount components and through-hole mount components by reflow soldering, a surface mount pad and a through mount are provided. Screen printing can be applied to the through-holes for hole mounting to supply an appropriate amount of solder paste, and the screen printing can be done only once, reducing the time required to supply solder paste. It has the effect of enabling a significant reduction.
【図１】 実施例の要部を示す断面図FIG. 1 is a cross-sectional view showing a main part of an embodiment.
【図２】 実施例におけるスルーホールの吸引機構を示
す断面図FIG. 2 is a sectional view showing a through-hole suction mechanism in the embodiment.
１ 基板 ２ 基板における表面実装用のパッド ３ 基板におけるスルーホール実装用のスルーホール ４ スクリーン印刷のマスク ５ スクリーン印刷のマスク開口部 ６ スクリーン印刷のスキージ ７ 半田ペースト ８ スルーホールの吸引 ９ 基板保持台 １０ 基板の吸引 １１，１２ 吸引孔 1 board 2 surface mounting pad on board 3 through hole on board through hole for mounting 4 mask for screen printing 5 mask opening for screen printing 6 squeegee for screen printing 7 solder paste 8 suction for through hole 9 board holder 10 Substrate suction 11, 12 suction holes
Claims (1)
用のスルーホールとを有する基板の該パッドと該スルー
ホールに半田ペーストを供給する方法であって、 供給条件を該パッドに合わせたスクリーン印刷により該
パッド及び該スルーホールに半田ペーストを供給し、そ
の際、該基板の裏面から該スルーホール内の空気を吸引
することを特徴とする半田ペースト供給方法。1. A method of supplying a solder paste to a pad having a surface mounting pad and a through hole for mounting a through hole, and a solder paste to the through hole, which is a screen printing method in which supply conditions are matched to the pad. The solder paste is supplied to the pads and the through holes by means of the method, and at that time, the air in the through holes is sucked from the back surface of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24240092A JPH0697641A (en) | 1992-09-11 | 1992-09-11 | Method of feeding solder paste |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24240092A JPH0697641A (en) | 1992-09-11 | 1992-09-11 | Method of feeding solder paste |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0697641A true JPH0697641A (en) | 1994-04-08 |
Family
ID=17088583
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24240092A Withdrawn JPH0697641A (en) | 1992-09-11 | 1992-09-11 | Method of feeding solder paste |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0697641A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007324315A (en) * | 2006-05-31 | 2007-12-13 | Fujitsu Ltd | Manufacturing device of printed circuit board |
| JP2011082498A (en) * | 2009-10-07 | 2011-04-21 | Samsung Electro-Mechanics Co Ltd | Mask for printing solder and method of manufacturing printed circuit board using the same |
| KR101425924B1 (en) * | 2012-07-23 | 2014-07-31 | 주식회사 이랜텍 | Solder supplying apparatus |
| JP2018205194A (en) * | 2017-06-07 | 2018-12-27 | 日本特殊陶業株式会社 | Manufacturing method for gas sensor element |
-
1992
- 1992-09-11 JP JP24240092A patent/JPH0697641A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007324315A (en) * | 2006-05-31 | 2007-12-13 | Fujitsu Ltd | Manufacturing device of printed circuit board |
| JP2011082498A (en) * | 2009-10-07 | 2011-04-21 | Samsung Electro-Mechanics Co Ltd | Mask for printing solder and method of manufacturing printed circuit board using the same |
| KR101425924B1 (en) * | 2012-07-23 | 2014-07-31 | 주식회사 이랜텍 | Solder supplying apparatus |
| JP2018205194A (en) * | 2017-06-07 | 2018-12-27 | 日本特殊陶業株式会社 | Manufacturing method for gas sensor element |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19991130 |