JP2007324315A - Manufacturing device of printed circuit board - Google Patents

Manufacturing device of printed circuit board Download PDF

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JP2007324315A
JP2007324315A JP2006151794A JP2006151794A JP2007324315A JP 2007324315 A JP2007324315 A JP 2007324315A JP 2006151794 A JP2006151794 A JP 2006151794A JP 2006151794 A JP2006151794 A JP 2006151794A JP 2007324315 A JP2007324315 A JP 2007324315A
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solder
hole
circuit board
printed circuit
wiring board
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JP5109292B2 (en
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Shigeru Sugino
成 杉野
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Fujitsu Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To surely prevent the occurrence of connection failures or the like in a manufacturing device of a printed circuit board. <P>SOLUTION: The manufacturing device of the printed circuit board solders a packaged component 2 on a printed wiring board 1. The printed circuit board is constituted of a preparatory treatment device 6 for supplying high density unmelted solder 5 to a gap between a through-hole 3 of the printed wiring board 1 and a lead 4 of a through-hole packaged component 2A, and a solder melting device 7 for melting and hardening the solder 5. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

本発明は、プリント回路板の製造装置に関するものである。   The present invention relates to a printed circuit board manufacturing apparatus.

プリント配線板上に所定の実装部品を実装したプリント回路板を製造する際に、該実装部品をプリント配線板上にはんだ付けする必要があり、プリント回路板の製造装置には実装部品のはんだ付け装置が含まれる。そして、実装部品がスルーホール実装部品である場合には、溶融状態のはんだをスルーホール内に供給してスルーホール内で固化させるフローはんだ付け法と、予めプリント配線板上に供給されたはんだをリフロー炉等により溶融させた後、固化させるリフローはんだ付け法のいずれかを実施するためのはんだ付け装置が使用される。   When manufacturing a printed circuit board in which a predetermined mounting component is mounted on the printed wiring board, it is necessary to solder the mounting component on the printed wiring board. Device included. When the mounting component is a through-hole mounting component, a flow soldering method in which molten solder is supplied into the through-hole and solidified in the through-hole, and solder previously supplied on the printed wiring board is used. A soldering apparatus for carrying out any of the reflow soldering methods for melting and solidifying by a reflow furnace or the like is used.

しかし、これらいずれのはんだ付け装置においても、小径のスルーホール内にはんだを完全に充填するのは難しいために、接続不良等が発生しやすいという問題があり、この問題を解決可能なはんだ付け装置としては、特許文献１、２に記載のものが知られている。   However, in any of these soldering apparatuses, it is difficult to completely fill the small-diameter through hole with solder, so there is a problem that connection failure or the like is likely to occur, and the soldering apparatus that can solve this problem For example, those described in Patent Documents 1 and 2 are known.

特許文献１に記載の従来例は、フローはんだ付け法による問題解決を目的としたもので、スルーホールをヒータにより加熱することによって、スルーホール内に侵入した溶融はんだの固化、あるいは粘度上昇を防止し、スルーホール内への溶融はんだの供給を保障する。また、特許文献２に記載のものは、ペースト状の未溶融はんだをスルーホールランド上に塗布し、実装部品のリードをスルーホール内に押し込む時に、スルーホール内に未溶融はんだを押し込み、スルーホール内でのはんだ容積不足を防止する。
特開２００５-２８５９６１号公報 特開平１０-２２４０２４号公報 The conventional example described in Patent Document 1 is intended to solve the problem by the flow soldering method. By heating the through hole with a heater, solidification of molten solder that has entered the through hole or an increase in viscosity is prevented. And ensure the supply of molten solder into the through hole. Also, the one described in Patent Document 2 applies paste-like unmelted solder onto the through-hole land, and pushes the unmelted solder into the through-hole when the lead of the mounting component is pushed into the through-hole. To prevent solder volume shortage.
JP 2005-285916 A JP-A-10-224024

しかし、上記特許文献１、２に記載のはんだ付け装置を含むプリント回路板の製造装置には以下の欠点がある。まず、前者のものは、プリント配線板上にヒータを配置する必要があるために、装置が複雑になる。また、ヒータを配置することはプリント配線板の温度低下を防止し、スルーホール内に進入したはんだの固化を防止するためであり、スルーホール導体の内壁へのはんだの濡れ拡がり性が必要となる。また、後者の未溶融はんだは、リードとの接触界面での抵抗によりリードに追随してスルーホール内に導かれるために、実装部品のリードをスルーホール内に押し込む際にスルーホール内に押し込まれるはんだ侵入量も少ない上に、その押し込み量は不安定である。よって前者と同様にスルーホール導体の内壁へのはんだの濡れ拡がり性が必要となる方法である。   However, the printed circuit board manufacturing apparatus including the soldering apparatus described in Patent Documents 1 and 2 has the following drawbacks. First, since the former needs to arrange | position a heater on a printed wiring board, an apparatus becomes complicated. In addition, the heater is disposed in order to prevent the temperature of the printed wiring board from lowering and to prevent the solder that has entered the through hole from solidifying, and it is necessary to spread the solder on the inner wall of the through hole conductor. . Further, since the latter unmelted solder follows the lead by the resistance at the contact interface with the lead and is guided into the through hole, the lead of the mounting component is pushed into the through hole when the lead of the mounting component is pushed into the through hole. The amount of solder penetration is small, and the amount of push-in is unstable. Therefore, similar to the former, solder wettability to the inner wall of the through-hole conductor is required.

本発明は、以上の欠点を解消すべくなされたものであって、スルーホール内に十分なはんだを供給することにより接続不良等の発生を確実に防止することのできるプリント回路板の製造装置の提供を目的とする。   The present invention has been made to eliminate the above drawbacks, and is a printed circuit board manufacturing apparatus that can reliably prevent the occurrence of poor connection by supplying sufficient solder into the through hole. For the purpose of provision.

プリント回路板製造装置によるプリント回路板の製造は、プリント配線板１上に所定の実装部品２をはんだ付けすることにより行われ、スルーホール実装部品２Ａのはんだ付けは、予備処理装置６を使用して予めスルーホール３内に供給された未溶融はんだをはんだ溶融装置７により溶融し、さらに固化することにより行われる。   The printed circuit board is manufactured by the printed circuit board manufacturing apparatus by soldering a predetermined mounting component 2 on the printed wiring board 1, and the through-hole mounting component 2A is soldered by using the pretreatment device 6. The unmelted solder previously supplied into the through hole 3 is melted by the solder melting device 7 and further solidified.

予備処理装置６は、溶融時にリード４とスルーホール３との間隙が十分な量のはんだにより充填されるように、高密度状態でスルーホール３内に供給される。この結果、上述した特許文献１に記載されるような溶融はんだの進入不足、あるいは、特許文献２に記載のような、スルーホール３内へのはんだペースト供給不足によるはんだの不完全充填、さらにはこれに伴う接続不良を確実に防止することが可能になる。   The pretreatment device 6 is supplied into the through hole 3 in a high density state so that the gap between the lead 4 and the through hole 3 is filled with a sufficient amount of solder at the time of melting. As a result, inadequate filling of solder due to insufficient penetration of molten solder as described in Patent Document 1 described above, or insufficient supply of solder paste into the through hole 3 as described in Patent Document 2, and It is possible to reliably prevent the connection failure accompanying this.

未溶融はんだを高密度状態でスルーホール３内に供給するための予備処理装置６は、未溶融はんだとしてはんだペースト、あるいはクリームはんだが使用される場合には、はんだペーストの圧入装置として形成される。また、未溶融はんだは固体の状態で供給することも可能であり、この場合、予備処理装置６は、実装部品２のリード４にパイプ状のはんだを外嵌させるはんだ装着装置として形成され、未溶融はんだ５が外嵌されたリード４をスルーホール３に挿入することにより、結果、スルーホール３とリード４との間隙部に未溶融はんだが供給される。   The pretreatment device 6 for supplying unmelted solder in a high density state into the through-hole 3 is formed as a solder paste press-in device when solder paste or cream solder is used as unmelted solder. . In addition, the unmelted solder can be supplied in a solid state. In this case, the pretreatment device 6 is formed as a solder mounting device that externally fits pipe-like solder to the leads 4 of the mounting component 2, By inserting the lead 4 fitted with the molten solder 5 into the through hole 3, as a result, unmelted solder is supplied to the gap between the through hole 3 and the lead 4.

筒状のはんだを未溶融はんだとして使用する場合、未溶融はんだ５の外径をスルーホール３内径とほぼ同一に形成し、スルーホール３内に圧入することも可能であるが、スルーホール３壁面との間に挿入のためのクリアランスを設定すると、マウンタによる挿入操作も容易で、かつ、スルーホール３の被傷を防止することができる。この場合であっても、固体状態の未溶融はんだの密度がはんだペーストに比して十分に高いために、接続性を損なうようなスルーホール３内でのはんだ量不足が生じることはない。   When a cylindrical solder is used as the unmelted solder, it is possible to form the outer diameter of the unmelted solder 5 substantially the same as the inner diameter of the through hole 3 and press-fit into the through hole 3. If the clearance for insertion is set between the two, the insertion operation by the mounter is easy, and the through hole 3 can be prevented from being damaged. Even in this case, since the density of the solid unmelted solder is sufficiently higher than that of the solder paste, there is no shortage of solder in the through-hole 3 that impairs the connectivity.

本発明によれば、スルーホール内に十分なはんだを供給することができるために、接続不良等の発生を確実に防止することができる。   According to the present invention, since sufficient solder can be supplied into the through hole, it is possible to reliably prevent the occurrence of connection failure or the like.

図１（ａ）に表面実装部品２Ｂとスルーホール実装部品２Ａとが混在したプリント回路板を製造する際に使用するプリント回路板製造装置を、図１（ｂ）にプリント配線板１を示す。   FIG. 1A shows a printed circuit board manufacturing apparatus used when manufacturing a printed circuit board in which surface-mounted components 2B and through-hole mounted components 2A are mixed, and FIG. 1B shows a printed wiring board 1. FIG.

この実施の形態におけるプリント配線板１は、複数の配線層を積層した多層プリント配線板であり、必要に応じて層間にはグランド層１ａが形成される。内層の配線層１ｂ、あるいはグランド層１ａと表層に形成される配線層とは、スルーホール３、あるいは図外のビアにより層間接続され、表層には、表面実装部品２Ｂを接続するための接続パッド１ｃと、スルーホールランド３ａが形成される。   The printed wiring board 1 in this embodiment is a multilayer printed wiring board in which a plurality of wiring layers are laminated, and a ground layer 1a is formed between the layers as necessary. The inner wiring layer 1b or the ground layer 1a and the wiring layer formed on the surface layer are connected to each other by through holes 3 or vias (not shown), and the surface layer has connection pads for connecting the surface mount component 2B. 1c and a through-hole land 3a are formed.

図１（ａ）に示すように、プリント回路板製造装置は、はんだペースト印刷機８、ＳＭＤ（Surface Mount Device）搭載機９およびリフロー装置１０からなる表面実装部品実装部１１と、スルーホール部品搭載機１２、予備処理装置６およびフロー装置（はんだ溶融装置）７からなるスルーホール部品実装部１３とから構成される。   As shown in FIG. 1 (a), a printed circuit board manufacturing apparatus includes a surface mount component mounting portion 11 including a solder paste printer 8, a SMD (Surface Mount Device) mounting device 9, and a reflow device 10, and a through-hole component mounting. And a through-hole component mounting portion 13 including a pretreatment device 6 and a flow device (solder melting device) 7.

上記はんだペースト印刷機８は、図２（ａ）に示すように、表面実装部品２Ｂ用の接続パッド１ｃ上にはんだペースト１４をシルク印刷するように構成され、はんだペースト印刷機８によりはんだペースト１４が供給されたプリント配線板１は、装置間を走行する図外の搬送装置によりＳＭＤ搭載機９に搬送される。   2A, the solder paste printer 8 is configured to silk-print the solder paste 14 on the connection pads 1c for the surface mount component 2B. Is supplied to the SMD mounting machine 9 by a transfer device (not shown) that travels between the devices.

ＳＭＤ搭載機９においては、図２（ｂ）に示すように、所定の表面実装部品２Ｂを図外のハンドリング手段により予め定められた位置に載置する。また、ＳＭＤ搭載機９は、必要に応じて実装部品２のパッケージをプリント配線板１に接着する接着装置を含む。   In the SMD mounting machine 9, as shown in FIG. 2 (b), a predetermined surface mounting component 2B is placed at a predetermined position by handling means outside the drawing. Further, the SMD mounting machine 9 includes an adhesion device that adheres the package of the mounting component 2 to the printed wiring board 1 as necessary.

ＳＭＤ搭載機９により実装部品２が載置されたプリント配線板１はリフロー装置１０に搬送される。リフロー装置１０は、不活性雰囲気下ではんだペースト１４を溶解させ、溶融したはんだは、図２（ｃ）に示されるように、気相界面との境界にフィレットを形成し、その後の冷却工程において固化し、実装部品２はプリント配線板１上に脱離不能に固定される。   The printed wiring board 1 on which the mounting component 2 is mounted by the SMD mounting machine 9 is conveyed to the reflow device 10. The reflow apparatus 10 dissolves the solder paste 14 under an inert atmosphere, and the melted solder forms a fillet at the boundary with the gas phase interface as shown in FIG. The mounting component 2 is fixed on the printed wiring board 1 so as not to be detached.

以上のようにして表面実装部において表面実装部品２Ｂの実装が完了したプリント配線板１は、スルーホール部品実装部１３に搬送され、スルーホール実装部品２Ａの実装操作が行われる。まず、スルーホール部品実装部１３のスルーホール部品搭載機１２は、図３（ａ）に示すように、スルーホール実装部品２Ａをハンドリングしてリード４を所定のスルーホール３に挿入する動作を行い、この後、予備処理装置６を使用してスルーホール３とリード４との間隙にペースト状の未溶融はんだが供給される。   The printed wiring board 1 in which the mounting of the surface mounting component 2B is completed in the surface mounting portion as described above is conveyed to the through hole component mounting portion 13, and the mounting operation of the through hole mounting component 2A is performed. First, the through-hole component mounting machine 12 of the through-hole component mounting portion 13 performs an operation of handling the through-hole mounting component 2A and inserting the lead 4 into a predetermined through-hole 3 as shown in FIG. Thereafter, paste-like unmelted solder is supplied to the gap between the through hole 3 and the lead 4 using the pretreatment device 6.

この実施の形態における予備処理装置６は、図４（ａ）に示すように、はんだ圧入装置として構成されており、ペースト状のはんだを収容するはんだ収容部６ａと、はんだ収容部６ａ内のはんだを押し出すポンプ部６ｂと、ヘッド部６ｃとを有する。ヘッド部６ｃの先端には弾性部材６ｄが固定されており、ポンプ部６ｂにより押し出された未溶融はんだは、可撓性を有するチューブ６ｅを経由してヘッド部６ｃに圧送される。   As shown in FIG. 4A, the pretreatment device 6 in this embodiment is configured as a solder press-fitting device, and includes a solder accommodating portion 6a for accommodating paste-like solder, and solder in the solder accommodating portion 6a. Has a pump part 6b for extruding and a head part 6c. An elastic member 6d is fixed to the tip of the head portion 6c, and the unmelted solder pushed out by the pump portion 6b is pressure-fed to the head portion 6c through a flexible tube 6e.

図４（ｂ）に示すように、この予備処理装置６は、リード４が挿入されたスルーホール３の裏面側スルーホールランド３ａにヘッド部６ｃを押し当てた状態でポンプ部６ｂを駆動して使用される。ポンプ部６ｂを駆動すると、チューブ６ｅ内に押し出されたはんだペーストは、弾性部材６ｄによりプリント配線板１外への漏出が防止されてスルーホール３内に押し込まれ、高密度未溶融はんだ５としてスルーホール３内に留まる。   As shown in FIG. 4B, the pretreatment device 6 drives the pump unit 6b in a state where the head unit 6c is pressed against the back side through-hole land 3a of the through-hole 3 in which the lead 4 is inserted. used. When the pump unit 6b is driven, the solder paste extruded into the tube 6e is prevented from leaking out of the printed wiring board 1 by the elastic member 6d and is pushed into the through hole 3 to pass through as the high-density unmelted solder 5. Stay in Hall 3.

上記未溶融はんだ５を溶解するために、スルーホール部品実装部１３は、はんだ溶融装置７を有する。図３（ｂ）に示すように、この実施の形態においてはんだ溶融装置７は、はんだ漕内にはんだ噴流を発生させたフローはんだ付け装置が使用され、リード４の自由端部をはんだ噴流に触れさせると、リード４の温度が上昇して未溶融はんだが溶解する。同時に、噴流はんだは、表面張力によりリード４側壁を濡らしながらスルーホール３側に向けて上昇し、一部はスルーホール３内に侵入し、一部はスルーホールランド３ａとリード４との間にフィレットを形成する（図６（ｄ）参照）。   In order to melt the unmelted solder 5, the through-hole component mounting portion 13 has a solder melting device 7. As shown in FIG. 3 (b), in this embodiment, the solder melting device 7 uses a flow soldering device that generates a solder jet in the solder iron, and touches the free end of the lead 4 to the solder jet. If it does, the temperature of the lead 4 will rise and unmelted solder will melt | dissolve. At the same time, the jet solder rises toward the through hole 3 while wetting the side wall of the lead 4 due to surface tension, a part of the solder flows into the through hole 3, and a part of the solder flows between the through hole land 3a and the lead 4. A fillet is formed (see FIG. 6D).

なお、以上においては、表面実装部品２Ｂの実装を完了してからスルーホール実装部品２Ａを実装する場合を示したが、表面実装部品２Ｂに供給されるはんだペースト１４と、スルーホール実装部品２Ａのためにスルーホール３内に供給される高密度未溶融はんだ５を同時に溶融、固化することも可能であり、この場合、はんだ溶融装置７としては、リフロー装置が使用される。   In the above description, the case where the through-hole mounting component 2A is mounted after the mounting of the surface mounting component 2B is shown, but the solder paste 14 supplied to the surface mounting component 2B and the through-hole mounting component 2A Therefore, it is possible to simultaneously melt and solidify the high-density unmelted solder 5 supplied into the through hole 3. In this case, a reflow device is used as the solder melting device 7.

このように、スルーホール実装部品２Ａと表面実装部品２Ｂに供給されるはんだを同時にリフローさせるプリント回路板製造装置は、はんだペースト印刷機８-ＳＭＤ搭載機９-スルーホール部品搭載機１２-予備処理装置６-リフロー装置を順に配列して構成される。   Thus, the printed circuit board manufacturing apparatus for simultaneously reflowing the solder supplied to the through-hole mounting component 2A and the surface mounting component 2B is a solder paste printing machine 8-SMD mounting machine 9-through-hole component mounting machine 12-preliminary processing. The apparatus 6 is configured by arranging a reflow apparatus in order.

図５（ａ）に本発明の他の実施の形態を示す。なお、以下の実施の形態の説明において、上述した実施の形態と実質的に同一の構成要素は図中に同一符号を付して説明を省略する。   FIG. 5 (a) shows another embodiment of the present invention. In the following description of the embodiments, components that are substantially the same as those of the above-described embodiment are denoted by the same reference numerals in the drawings, and description thereof is omitted.

この実施の形態において、プリント回路板製造装置の表面実装部品実装部１１は、上述した実施の形態と同一に構成され、プリント配線板１上には、表面実装部品実装部１１により表面実装部品２Ｂが固定される。   In this embodiment, the surface mounting component mounting portion 11 of the printed circuit board manufacturing apparatus is configured in the same manner as the above-described embodiment, and the surface mounting component 2B is mounted on the printed wiring board 1 by the surface mounting component mounting portion 11. Is fixed.

これに対し、スルーホール部品実装部１３の予備処理装置６は、図６（ａ）に示すように、スルーホール３に挿入される前の段階でリード４に未溶融はんだ（高密度未溶融はんだ５）を供給するはんだ装着装置として構成される。はんだ装着装置は、予め筒形状に形成された未溶融はんだ５の中空部に実装部品２のリード４を圧入するように構成される。上記筒状の未溶融はんだ５はスルーホール３の全長にほぼ等しい長さ寸法を有し、外径寸法は、リード４が圧入した状態においてスルーホール３に挿入可能な寸法に形成される。   On the other hand, as shown in FIG. 6A, the pre-processing device 6 of the through-hole component mounting portion 13 has unmelted solder (high-density unmelted solder) on the leads 4 before being inserted into the through-hole 3. 5) It is configured as a solder mounting device for supplying. The solder mounting apparatus is configured to press-fit the lead 4 of the mounting component 2 into a hollow portion of the unmelted solder 5 formed in a cylindrical shape in advance. The cylindrical unmelted solder 5 has a length dimension substantially equal to the entire length of the through hole 3, and the outer diameter dimension is formed such that the lead 4 can be inserted into the through hole 3 in a press-fit state.

予備処理装置６により未溶融はんだ５が装着された実装部品２のリード４は、スルーホール部品搭載機１２により所定のスルーホール３に挿入操作され、次いで、フロー装置（はんだ溶融装置）７に搬送される。フロー装置７の噴流はんだがリード４先端に接触すると、リード４が加熱されて未溶融はんだ５が溶融し、同時に噴流はんだがスルーホール３側に上昇し、図６（ｄ）に示すように、はんだ付けが完了する。   The lead 4 of the mounting component 2 on which the unmelted solder 5 is mounted by the pretreatment device 6 is inserted into a predetermined through hole 3 by the through hole component mounting machine 12 and then transferred to the flow device (solder melting device) 7. Is done. When the jet solder of the flow device 7 comes into contact with the tip of the lead 4, the lead 4 is heated to melt the unmelted solder 5, and at the same time, the jet solder rises to the through hole 3 side, as shown in FIG. Soldering is complete.

なお、以上においては、表面実装部品２Ｂのはんだ付け完了後にスルーホール実装部品２Ａのはんだ付けを行う場合を示したが、図５（ｂ）に示すように、最終工程に配置されたリフロー装置（はんだ溶融装置７）により表面実装部品２Ｂに対して供給されたはんだペースト１４と、スルーホール実装部品２Ａ用に供給された未溶融はんだ５とを同時に溶融、固化することもできる。なお、通常リフロー装置の前段にはフラクサは無いが、この
未溶融はんだがパイプ状のはんだのようにフラックスを含まないものの場合、リフロー装置７の前段にはフラクサ１５が配置され、スルーホールランド３ａにフラックスが供給される。 In the above description, the case where the through-hole mounting component 2A is soldered after the completion of the soldering of the surface mounting component 2B is shown. However, as shown in FIG. 5B, the reflow device ( The solder paste 14 supplied to the surface mounting component 2B by the solder melting apparatus 7) and the unmelted solder 5 supplied for the through-hole mounting component 2A can be simultaneously melted and solidified. Normally, there is no fluxer in the previous stage of the reflow device, but when this unmelted solder does not contain flux like pipe-shaped solder, the fluxer 15 is arranged in the previous stage of the reflow device 7 and the through-hole land 3a. Flux is supplied.

本発明を示す図で、（ａ）はプリント回路板製造装置を示すブロック図、（ｂ）はプリント配線板を示す断面図である。It is a figure which shows this invention, (a) is a block diagram which shows a printed circuit board manufacturing apparatus, (b) is sectional drawing which shows a printed wiring board. 表面実装部品実装部での動作を示す図である。It is a figure which shows the operation | movement in a surface mounting component mounting part. スルーホール部品実装部での動作を示す図である。It is a figure which shows the operation | movement in a through-hole component mounting part. 予備処理装置を示す図で、（ａ）は全体構造を示す図、（ｂ）は高密度未溶融はんだの供給状態を示す図である。It is a figure which shows a pretreatment apparatus, (a) is a figure which shows the whole structure, (b) is a figure which shows the supply state of a high-density unmelted solder. 本発明の他の実施の形態を示す図で、（ａ）はブロック図、（ｂ）は（ａ）の変形例を示す図である。It is a figure which shows other embodiment of this invention, (a) is a block diagram, (b) is a figure which shows the modification of (a). 予備処理装置による動作を示す図で、（ａ）はリードに高密度未溶融はんだを外嵌した状態を示す図、（ｂ）は（ａ）の６Ｂ-６Ｂ線断面図、（ｃ）は（ａ）による処理終了後のリードをスルーホールに挿入した状態を示す図、（ｄ）ははんだ付けが完了した状態を示す図である。It is a figure which shows the operation | movement by a preliminary processing apparatus, (a) is a figure which shows the state which carried out the high-density unmelted solder on the lead, (b) is the 6B-6B sectional view taken on the line of (a), (c) is ( The figure which shows the state which inserted the lead after completion | finish of the process by a) in the through hole, (d) is a figure which shows the state which soldering was completed.

符号の説明Explanation of symbols

１ プリント配線板
２ 実装部品
２Ａ スルーホール実装部品
３ スルーホール
４ リード
５ 高密度未溶融はんだ
６ 予備処理装置
７ はんだ溶融装置 DESCRIPTION OF SYMBOLS 1 Printed wiring board 2 Mounting component 2A Through-hole mounting component 3 Through hole 4 Lead 5 High-density unmelted solder 6 Pretreatment apparatus 7 Solder melting apparatus

Claims (5)

プリント配線板上に実装部品をはんだ付けしてプリント回路板を製造するプリント回路板の製造装置であって、
前記プリント配線板のスルーホールとスルーホール実装部品のリードとの間隙に高密度未溶融はんだを供給する予備処理装置と、
前記高密度未溶融はんだを溶融、固化するはんだ溶融装置とを有するプリント回路板の製造装置。 A printed circuit board manufacturing apparatus for manufacturing a printed circuit board by soldering a mounting component on a printed wiring board,
A pretreatment device for supplying high-density unmelted solder to the gap between the through hole of the printed wiring board and the lead of the through-hole mounting component;
A printed circuit board manufacturing apparatus comprising: a solder melting apparatus that melts and solidifies the high-density unmelted solder. 前記予備処理装置は、リードが挿入されたプリント配線板のスルーホール内にはんだペーストを圧入する圧入装置として形成される請求項１記載のプリント回路板の製造装置。   The printed circuit board manufacturing apparatus according to claim 1, wherein the pretreatment device is formed as a press-fitting device that press-fits a solder paste into a through hole of a printed wiring board in which leads are inserted. 前記予備処理装置は、プリント配線板のスルーホールへの挿入前にリードに筒状のはんだを外嵌させるはんだ装着装置として形成される請求項１記載のプリント回路板の製造装置。   The printed circuit board manufacturing apparatus according to claim 1, wherein the pretreatment device is formed as a solder mounting device for externally fitting a cylindrical solder to the lead before the printed wiring board is inserted into the through hole. 請求項１、２または３に記載の製造装置により製造されたプリント回路板。   A printed circuit board manufactured by the manufacturing apparatus according to claim 1, 2 or 3. 請求項４記載のプリント回路板を有する電子装置。



An electronic device comprising the printed circuit board according to claim 4.



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Cited By (1)

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Publication number Priority date Publication date Assignee Title
WO2015001938A1 (en) * 2013-07-03 2015-01-08 住友電装株式会社 Printed circuit board

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JPH0927678A (en) * 1995-07-11 1997-01-28 Nippon Avionics Co Ltd Method of mounting component on printed wiring board
JPH09162536A (en) * 1995-12-06 1997-06-20 Sony Corp Method for mounting parts on printed circuit board, parts to be mounted on printed circuit board, and printed circuit board
JP2000196231A (en) * 1998-12-24 2000-07-14 Toyota Motor Corp Lead insertion part with bump and bump mounting method
JP2002016350A (en) * 2000-06-28 2002-01-18 Canon Inc Soldering method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0697641A (en) * 1992-09-11 1994-04-08 Fujitsu Ltd Method of feeding solder paste
JPH08274457A (en) * 1995-03-27 1996-10-18 Robert Bosch Gmbh Smd coupling member for electronic controller of vehicle
JPH0927678A (en) * 1995-07-11 1997-01-28 Nippon Avionics Co Ltd Method of mounting component on printed wiring board
JPH09162536A (en) * 1995-12-06 1997-06-20 Sony Corp Method for mounting parts on printed circuit board, parts to be mounted on printed circuit board, and printed circuit board
JP2000196231A (en) * 1998-12-24 2000-07-14 Toyota Motor Corp Lead insertion part with bump and bump mounting method
JP2002016350A (en) * 2000-06-28 2002-01-18 Canon Inc Soldering method

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015001938A1 (en) * 2013-07-03 2015-01-08 住友電装株式会社 Printed circuit board

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