JPH06296074A - Wave soldering device - Google Patents

Abstract

PURPOSE:To provide a zero-defect soldering apparatus which is high in reliability and wherein a soldering repair work is for soldering defect almost not required after a soldering operation is carried out. CONSTITUTION:A foaming type fluxer 12, a pre-heater 13, a wave-soldering primary solder tank 14, a spray type auxiliary fluxer 15, an auxiliary pre-heater 16, a wave-soldering secondary solder tank 17, and a cooling fan 18 are arranged along a work transfer line 11 which transfers a part mounting board or the like. The foaming type fluxer 12 applies foaming flux to a work W, and the pre-heater 13 pre-heats the work W up to a prescribed temperature. The primary solder tank 14 carries out soldering with an unstable primary wave of solder Sa jetted out from a primary nozzle 14a. The spray type auxiliary fluxer 15 sprays flux 15a on the work W so as to control coating flux in amount again. The auxiliary pre-heater 16 reheats the work W to its initial temperature. The wave-soldering secondary solder tank 17 carries out a finishing soldering operation with an even secondary wave of solder Sb jetted from a finishing secondary nozzle 17a.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet soldering device.

[0002]

2. Description of the Related Art As shown in FIG. 2, a conventional jet-type soldering apparatus is provided with a fluxer 2 for applying a flux to a work W such as a substrate along a work transfer line 1 and preheating the work. A preheater 3, a jet-type solder bath 4 for supplying molten solder to the work from a turbulent wave primary nozzle 4a and a finishing secondary nozzle 4b, and a cooling fan 5 for supplying cooling air to the work are arranged. .

Primary nozzle for turbulent waves in the jet type solder bath 4
4a is capable of a primary dip that eliminates gas accumulation between components mounted on a work due to a large number of unstable primary jet waves Sa that are ejected in a projection form through a perforated plate. The secondary nozzle 4b is capable of finishing dipping to finish the primary soldering portion cleanly by the stable secondary jet wave Sb which jets smoothly on this nozzle.

[0004]

SUMMARY OF THE INVENTION Primary nozzle for turbulent waves
In the primary dip according to 4a, the desired work can be performed because the work W to which the flux has been applied is soldered, but at this time, the flux is washed away from the work by the high temperature primary jet wave Sa, and so-called "flux Withering occurs.

In such a case, the following secondary nozzle for finishing is used.
In the secondary dip by 4b, soldering may be performed on the part where flux is not sufficiently applied, and it may not be possible to perform the desired finishing dip. Soldering failure such as

Therefore, conventionally, these "bridges" and "non-wetting" are manually corrected after soldering, but there is a problem that the correction work is not easy.

The present invention has been made in view of the above circumstances, and an object thereof is to provide an uncorrected soldering apparatus which is highly reliable and does not require correction of a defective soldering portion after soldering. To do.

[0008]

According to a first aspect of the present invention, a fluxer that applies flux to a work, a preheater that preheats the work, and a molten solder are supplied from the nozzle to the work along a work transfer line. In a jet-type soldering device in which a jet-type solder bath and
As the jet type solder bath, a jet type primary solder bath for supplying molten solder to a work from a turbulent primary nozzle and a jet type secondary solder bath for supplying molten solder to a work from a finishing secondary nozzle are separated. And a spray type auxiliary fluxer for spraying flux and applying it to a work is disposed between the jet type primary solder bath and the jet type secondary solder bath.

According to a second aspect of the present invention, an auxiliary preheater for reheating the work to recover its temperature is arranged between the spray type auxiliary fluxer of the first aspect and the jet type secondary solder bath. It is a jet-type soldering device having a configuration.

[0010]

According to the invention described in claim 1, even if so-called "flux withdrawal" occurs in the work due to the primary dip in the jet type primary solder bath, the flux sprayed from the spray type auxiliary fluxer to the work eliminates it. Finish soldering by secondary dip in a jet secondary solder bath.

According to the second aspect of the present invention, the auxiliary preheater recovers the work temperature lowered by the flux application by the spray type auxiliary fluxer.

[0012]

The present invention will be described in detail below with reference to the embodiment shown in FIG.

A foaming fluxer 12, a preheater 13, a jet primary solder bath 14, a spray type auxiliary fluxer 15, and an auxiliary preheater 16 are provided along a work transfer line 11 for transferring a work W such as a component mounting board. , Jet type secondary solder bath
17 and a cooling fan 18 are sequentially arranged.

The foaming type fluxer 12 is for applying flux foamed from a foaming nozzle to a work.
The preheater 13 preheats the work to be soldered to a predetermined temperature.

The jet-type primary solder bath 14 jets molten solder pressure-fed from a built-in pump (not shown) from a turbulent wave primary nozzle 14a. The primary nozzle 14a projects through a perforated jet of punching metal or the like. The large number of unstable primary jet waves Sa that are ejected in a uniform manner ensures primary soldering to every corner of the work.

The above-mentioned spray type auxiliary fluxer 15 sprays the flux 15a onto a work from a spray nozzle and applies it. The auxiliary preheater 16 reheats the work to recover its temperature.

The jet type secondary solder tank 17 jets molten solder, which is pressure-fed by a built-in pump (not shown), from a finishing secondary nozzle 17a. The secondary nozzle 17a is a stable secondary jet. The primary jetting wave Sb cleans the primary soldering part of the work.

The work transfer line 11 is for transferring and mounting a substrate between a pair of endless chains arranged in parallel, and includes a work loading section 22 provided at one side opening of the apparatus body cover 21 and other parts. The secondary line from the spray type auxiliary fluxer 15 to the cooling fan 18 is in the transport direction with respect to the primary line from the foam type fluxer 12 to the jet type primary solder bath 14 between the workpiece unloading part 23 provided in the side opening. It is arranged in an inclined manner so as to rise.

Next, the operation of this embodiment will be described. First, the foam type fluxer 12 applies flux to the room temperature work before heating, the preheater 13 preheats the work, and the jet type primary solder bath 14 ejects a large number of protrusions from the turbulent wave primary nozzle 14a. The unstable primary jet wave Sa of (1) primary-solders the electrode leads of electronic parts, etc. to the board land surface of the work.

Although so-called "flux withdrawal" may occur due to the primary dip in the primary solder bath 14, "flux withdrawal" occurs by re-applying the flux to the work piece with the next spray type auxiliary flux 15 To eliminate.

Since this auxiliary fluxer 15 is a spray type which sprays a mist-like flux onto the work continuously or intermittently, the auxiliary fluxer 15 and the foaming fluxer 12 can be controlled by controlling the flux supply amount and the spray pulse waveform. In comparison with being able to control the flux film thickness with high accuracy,
Flux can be reliably applied even to a work that has passed through the primary solder bath 14 and has a high temperature. The foam-type fluxer 12
When is used for a high-temperature work, the defoaming action works before the foaming flux contacts the high-temperature work, and the flux is not applied to the work.

Since the work temperature is lowered by applying the flux of the spray type auxiliary fluxer 15, the work is reheated by the auxiliary preheater 16 to recover the work temperature in preparation for the next secondary soldering. Then, in the jet type secondary soldering tank 17, the work is finish-dipped in the secondary jet wave Sb which jets smoothly on the secondary nozzle 17a, and the primary soldering part is finished cleanly. Finally, the cooling fan 18 cools and solidifies the soldered portion of the work.

The foam-type fluxer 12 may be a spray-type fluxer.

[0024]

According to the invention described in claim 1, the jet type primary solder bath and the jet type secondary solder bath are separated, and the spray type auxiliary fluxer is arranged between them.
Even if so-called “flux withdrawal” occurs due to the primary dip in the primary solder bath, the spray type auxiliary flux can apply flux of an appropriate film thickness to the work to eliminate “flux withdrawal”, and bridge or non-wetting after soldering. It is possible to provide a highly reliable jet-type soldering device that does not require correction, and achieve no correction after soldering.
Since the auxiliary flux is a spray type, the flux film thickness can be controlled with higher accuracy compared to the normally used foam type fluxers, and like the foam type fluxers, the flux adheres to the work that has become hot due to the primary dip. There is no problem of not doing.

According to the second aspect of the invention, the work temperature lowered by the flux application of the spray type auxiliary flux can be recovered by reheating the auxiliary preheater, and the effect of the spray type auxiliary fluxer can be secured. be able to.

[Brief description of drawings]

FIG. 1 is a schematic view showing an embodiment of a jet type soldering device of the present invention.

FIG. 2 is a schematic view showing a conventional jet soldering device.

[Explanation of symbols]

 W Work 11 Work transfer line 12 Fluxer 13 Preheater 14 Jet type primary solder bath 14a Turbulent wave primary nozzle 15 Spray type auxiliary fluxer 16 Auxiliary preheater 17 Jet type secondary solder bath 17a Finishing secondary nozzle

Claims (2)

[Claims] 1. A jet-type solder in which a fluxer for applying a flux to the work, a preheater for preheating the work, and a jet-type solder bath for supplying molten solder from a nozzle to the work are arranged along the work transfer line. In the attaching device, as the jet type solder bath, a jet type primary solder bath for supplying molten solder to a work from a turbulent primary nozzle, and a jet type secondary solder bath for supplying molten solder to a work from a finishing secondary nozzle Is provided separately, and between the jet-type primary solder bath and the jet-type secondary solder bath, a spray-type auxiliary fluxer for spraying flux and applying it to a work is arranged. Type soldering equipment. 2. The jet type according to claim 1, further comprising an auxiliary preheater disposed between the spray type auxiliary fluxer and the jet type secondary solder bath to reheat the work to recover its temperature. Soldering equipment.