GB2181084A - Soldering apparatus - Google Patents

Soldering apparatus Download PDF

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Publication number
GB2181084A
GB2181084A GB08622861A GB8622861A GB2181084A GB 2181084 A GB2181084 A GB 2181084A GB 08622861 A GB08622861 A GB 08622861A GB 8622861 A GB8622861 A GB 8622861A GB 2181084 A GB2181084 A GB 2181084A
Authority
GB
United Kingdom
Prior art keywords
solder
flux
primary
bath
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB08622861A
Other versions
GB2181084B (en
GB8622861D0 (en
Inventor
Tsyhoshi Mori
Toshiaki Terabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of GB8622861D0 publication Critical patent/GB8622861D0/en
Publication of GB2181084A publication Critical patent/GB2181084A/en
Application granted granted Critical
Publication of GB2181084B publication Critical patent/GB2181084B/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Abstract

Soldering apparatus for soldering a printed circuit board (3) carrying electronic parts (2) has a primary fluxer (5), a preheater (6), a primary solder bath (8), a secondary fluxer (13) and a secondary solder bath (10) all arranged in line such that the secondary fluxer (13) lies between the primary and secondary solder baths (8 and 10). The provision of the secondary fluxer (13) and the secondary solder bath (10) is to remove undesirable solder stalactites and solder bridges. <IMAGE>

Description

SPECIFICATION Soldering apparatus The present invention relates to soldering apparatus.
Such soldering apparatus may be used for soldering a printed circuit board and, may take the form of a continuous soldering apparatus which is suitable for continuously soldering a printed circuit board having chip parts or the like packaged therein in a high density.
It is an object of the present invention to provide a improved soldering apparatus.
According to the present invention, there is provided an apparatus for soldering a printed circuit board having electronic parts packaged therein, comprising: a primary fluxer for applying post-flux to said printed circuit board; a preparatory heater arranged downstream of said primary fluxer for evaporating the solvent of said post-flux and for preheating said printed circuit board to soften the heat shocks; a primary solder bath arranged downstream of said preparatory heater and having a primary sprayer for spraying solder to said printed circuit board; and a secondary solder bath arranged downstream of said primary solder bath and having a secondary sprayer for spraying solder to said printed circuit board once soldered, wherein the improvement comprises a secondary fluxer interposed between said primary and secondary solder baths for applying mist of flux to the lower side of said printed circuit board once soldered.
The secoridary fluxer is arranged upstream of the secondary solder bath again the flux to the printed circuit board, which has been subjected to the primary soldering in the primary solder bath and then heated, so that the printed circuit board is finished in the secondary solder bath after it has been preheated to have its solvent evaporated by the upstream and downstream solder baths. As a result, the slug left on the surface of the secondary solder bath is removed by the effect of the flux applied again, and the activation by the flux continues while the board is being dipped in the secondary solder bath. The flux thus applied is gasified by the heat of the solder to clear the board of the ambient air so that the board surface wetted with the solder is kept non-oxidized to form clear fillets.
Soldering apparatus embodying the present invention, will now be described by way of example with reference to the accompanying diagrammatic drawing, in which: Figure 1 is a longitudinal section through the soldering apparatus embodying the present invention; and Figure 2 is a longitudinal section through a previously proposed soldering apparatus.
Fig. 2 shows a previously proposed printedcircuit board soldering apparatus. A printed circuit board 3 carrying electronic parts 1 with leads and chip parts 2, as shown in longitudinal section, is wetted with post-flux 5 by a primary fluxer 4 of the foaming type and is preheated by a pre-heater 6 to evaporate the solvent in the flux and to soften the heat shocks.
Next, a high-wave solder is sprayed from a primary wave sprayer 9 in a primary solder bath 8 of a solder bath body 7 such that it may not fail to wet the part by preventing air from being stagnant on the part. However, the solder application by the primary wave sprayer 9 forms high waves on the surface of the molten solder so that solder stalactites and/or solder bridges frequently develop from the high waves. In order to eliminate the stalactites and bridges of the solder, therefore, a secondary soldering is performed in a secondary solder bath 10 by a secondary wave sprayer 11, and the molten solder surface having less waves is pulled up to reduce the developments of the stalactites and bridges.
During the primary soldering, however, the flux is removed by the high-wave solder, or its active agent is damaged by the heat to reduce the fluxing effect. The part thus soldered is complete after it has been cooled by a blower 12. The soldering steps thus far described are conducted in a continuous manner.
The following problems arise if a printed circuit board having a higher package density is to be soldered by this soldering apparatus.
(1) Insufficient soldering is caused frequently by the solder stalactites and bridges and is difficult and inefficient to repair because the printed circuit board is small-sized and package density is high.
(2) The repairer has to resort to a soldering iron to extend the heating time period thereby to cause secondary problems in that the parts are thermally damaged or in that the printed pattern and/or chip parts have some of their silver electrodes melted away.
In the apparatus shown in Fig. 1 parts similar to those in Fig. 2 are similarly referenced.
The apparatus of Fig. 1 is similar to the apparatus of Fig. 2 except that a secondary fluxer 13 is interposed between the primary solder bath 8 and the secondary solder bath 10. A solder bath body 14 incorporates the primary solder bath 8, the secondary solder bath 10 and the secondary fluxer 13. This fluxer 13 is arranged centrally of the solder bath body 14 and has an opening 15, which is formed in a lower portion of the solder bath body 14, and a blower 16 which is positioned above the opening 15. Air is blown around a doubleboxed flux bath formed by inner and outer boxes 17 and 18 partly to reduce the temperature of the molten flux and partly to prevent heat transfer by convection of the heat liberated from the primary and secondary solder baths 8 and 10. The secondary flux bath 13 is equipped therein with a spray mist genera tor 19, which operates to spray a mist 20 of the flux onto the underside of the printed circuit board when a detector (not shown) detects the approach of the printed circuit board.
The following effects can be achieved by the described apparatus.
(1) A high dense package can be soldered with less solder stalactite and bridge defects.
(2) Because of the resulting reduction in the number of parts to be repaired, the risk of a secondary defective is accordingly reduced, and the silver electrodes of the printed patterns and chip parts are less molten away.
(3) It is possible to provide a soldering apparatus having an excellent production efficiency.

Claims (7)

1. Apparatus for soldering a printed circuit board carrying electronic components, the apparatus, comprising: a primary fluxer for applying post-flux to said printed circuit board; a preheater arranged downstream of said primary fluxer for evaporating the solvent of said post-flux and for preheating said printed circuit board to soften the heat shocks; a primary solder bath arranged downstream of said preparatory heater and having a primary sprayer for spraying solder onto said printed circuit board; and a secondary solder bath arranged downstream of said primary solder bath and having a secondary sprayer for spraying solder to said printed circuit board once soldered, and a secondary fluxer interposed between said primary and secondary solder baths for applying a mist of flux onto the solder deposited on the printed circuit board by the primary solder bath.
2. Apparatus according to Claim 1, wherein said primary solder bath, said secondary fluxer and said secondary solder bath are accommodated in a common solder bath body.
3. An apparatus according to Claim 1 or to Claim 2, wherein said secondary fluxer includes: a flux bath containing flux therein and positioned in an upper portion of said solder bath body; an opening formed in a lower portion of said solder bath body below said flux bath and a blower positioned above said opening for directing a stream of air upwardly around said flux bath to reduce the temperature of the molten flux and to reduce heat transfer to the flux bath from said primary and second solder baths by convection.
4. Apparatus according to any one of Claims 1 to 3, wherein said secondary fluxer further includes a spray mist generator for spraying the flux in the form of mist from said flux bath onto the underside of said printed circuit board.
5. Apparatus according to Claim 3, wherein said flux bath has an inner and outer spaced walls.
6. Apparatus according to any preceeding Claim further comprising a blower arranged downstream of said secondary solder bath for cooling said printed circuit board.
7. Apparatus for soldering a printed circuit board substantially as hereinbefore described, with reference to Fig. 1 of the accompanying drawings.
GB8622861A 1985-10-02 1986-09-23 Soldering apparatus Expired GB2181084B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60219956A JPS6281264A (en) 1985-10-02 1985-10-02 Soldering device

Publications (3)

Publication Number Publication Date
GB8622861D0 GB8622861D0 (en) 1986-10-29
GB2181084A true GB2181084A (en) 1987-04-15
GB2181084B GB2181084B (en) 1989-09-13

Family

ID=16743668

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8622861A Expired GB2181084B (en) 1985-10-02 1986-09-23 Soldering apparatus

Country Status (3)

Country Link
JP (1) JPS6281264A (en)
KR (1) KR870004649A (en)
GB (1) GB2181084B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992019416A1 (en) * 1991-05-08 1992-11-12 Peter Philip Andrew Lymn Solder leveller
US5507882A (en) * 1994-02-28 1996-04-16 Delco Electronics Corporation Low residue water-based soldering flux and process for soldering with same
EP0761361A1 (en) * 1995-09-08 1997-03-12 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering
EP0827800A1 (en) * 1996-09-09 1998-03-11 LYMN, Peter Philip Andrew Solder leveller
US6066197A (en) * 1995-07-11 2000-05-23 Delphi Technologies, Inc. Coatings and methods, especially for circuit boards
EP1033197A2 (en) * 1999-02-22 2000-09-06 Senju Metal Industry Co., Ltd. Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus
US6786385B1 (en) * 1997-09-08 2004-09-07 Fujitsu Limited Semiconductor device with gold bumps, and method and apparatus of producing the same
CN100425382C (en) * 2005-06-17 2008-10-15 杨国金 Jetting flow welding method and its apparatus

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04258370A (en) * 1991-02-06 1992-09-14 Matsushita Electric Ind Co Ltd Device and method for dip soldering
JPH0734989B2 (en) * 1992-09-04 1995-04-19 大阪アサヒ化学株式会社 No-clean method for jet soldering
JPH06296074A (en) * 1993-04-09 1994-10-21 Tamura Seisakusho Co Ltd Wave soldering device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057944B2 (en) * 1982-05-07 1985-12-17 権士 近藤 Jet solder bath

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992019416A1 (en) * 1991-05-08 1992-11-12 Peter Philip Andrew Lymn Solder leveller
US5507882A (en) * 1994-02-28 1996-04-16 Delco Electronics Corporation Low residue water-based soldering flux and process for soldering with same
US6066197A (en) * 1995-07-11 2000-05-23 Delphi Technologies, Inc. Coatings and methods, especially for circuit boards
EP0761361A1 (en) * 1995-09-08 1997-03-12 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering
US5685475A (en) * 1995-09-08 1997-11-11 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering
EP0827800A1 (en) * 1996-09-09 1998-03-11 LYMN, Peter Philip Andrew Solder leveller
US6786385B1 (en) * 1997-09-08 2004-09-07 Fujitsu Limited Semiconductor device with gold bumps, and method and apparatus of producing the same
EP1033197A2 (en) * 1999-02-22 2000-09-06 Senju Metal Industry Co., Ltd. Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus
EP1033197A3 (en) * 1999-02-22 2002-01-23 Senju Metal Industry Co., Ltd. Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus
EP1439020A2 (en) * 1999-02-22 2004-07-21 Senju Metal Industry Co., Ltd. Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus
EP1439020A3 (en) * 1999-02-22 2004-08-04 Senju Metal Industry Co., Ltd. Method and apparatus for soldering printed circuit boards and cooling mechanism for a soldering apparatus
CN100425382C (en) * 2005-06-17 2008-10-15 杨国金 Jetting flow welding method and its apparatus

Also Published As

Publication number Publication date
GB2181084B (en) 1989-09-13
GB8622861D0 (en) 1986-10-29
KR870004649A (en) 1987-05-11
JPS6281264A (en) 1987-04-14

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Legal Events

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PCNP Patent ceased through non-payment of renewal fee