GB2181084B - Soldering apparatus - Google Patents

Soldering apparatus

Info

Publication number
GB2181084B
GB2181084B GB8622861A GB8622861A GB2181084B GB 2181084 B GB2181084 B GB 2181084B GB 8622861 A GB8622861 A GB 8622861A GB 8622861 A GB8622861 A GB 8622861A GB 2181084 B GB2181084 B GB 2181084B
Authority
GB
United Kingdom
Prior art keywords
soldering apparatus
soldering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8622861A
Other versions
GB8622861D0 (en
GB2181084A (en
Inventor
Tsyhoshi Mori
Toshiaki Terabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of GB8622861D0 publication Critical patent/GB8622861D0/en
Publication of GB2181084A publication Critical patent/GB2181084A/en
Application granted granted Critical
Publication of GB2181084B publication Critical patent/GB2181084B/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3468—Applying molten solder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)
GB8622861A 1985-10-02 1986-09-23 Soldering apparatus Expired GB2181084B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60219956A JPS6281264A (en) 1985-10-02 1985-10-02 Soldering device

Publications (3)

Publication Number Publication Date
GB8622861D0 GB8622861D0 (en) 1986-10-29
GB2181084A GB2181084A (en) 1987-04-15
GB2181084B true GB2181084B (en) 1989-09-13

Family

ID=16743668

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8622861A Expired GB2181084B (en) 1985-10-02 1986-09-23 Soldering apparatus

Country Status (3)

Country Link
JP (1) JPS6281264A (en)
KR (1) KR870004649A (en)
GB (1) GB2181084B (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04258370A (en) * 1991-02-06 1992-09-14 Matsushita Electric Ind Co Ltd Device and method for dip soldering
US5876499A (en) * 1991-05-08 1999-03-02 Lymn; Peter P. Solder spray leveller
GB9109899D0 (en) * 1991-05-08 1991-07-03 Lymn Peter P A Solder leveller
JPH0734989B2 (en) * 1992-09-04 1995-04-19 大阪アサヒ化学株式会社 No-clean method for jet soldering
JPH06296074A (en) * 1993-04-09 1994-10-21 Tamura Seisakusho Co Ltd Wave soldering device
US5507882A (en) * 1994-02-28 1996-04-16 Delco Electronics Corporation Low residue water-based soldering flux and process for soldering with same
EP0753989B1 (en) * 1995-07-11 2005-09-21 Delphi Technologies, Inc. Coatings and methods, especially for circuit boards
US5685475A (en) * 1995-09-08 1997-11-11 Ford Motor Company Apparatus for cooling printed circuit boards in wave soldering
JP3420917B2 (en) * 1997-09-08 2003-06-30 富士通株式会社 Semiconductor device
JP2000244108A (en) * 1999-02-22 2000-09-08 Senju Metal Ind Co Ltd Soldering of printed board, soldering equipment for printed board, and cooling equipment therefor
CN100425382C (en) * 2005-06-17 2008-10-15 杨国金 Jetting flow welding method and its apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6057944B2 (en) * 1982-05-07 1985-12-17 権士 近藤 Jet solder bath

Also Published As

Publication number Publication date
KR870004649A (en) 1987-05-11
JPS6281264A (en) 1987-04-14
GB8622861D0 (en) 1986-10-29
GB2181084A (en) 1987-04-15

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee