GB2181084B - Soldering apparatus - Google Patents
Soldering apparatusInfo
- Publication number
- GB2181084B GB2181084B GB8622861A GB8622861A GB2181084B GB 2181084 B GB2181084 B GB 2181084B GB 8622861 A GB8622861 A GB 8622861A GB 8622861 A GB8622861 A GB 8622861A GB 2181084 B GB2181084 B GB 2181084B
- Authority
- GB
- United Kingdom
- Prior art keywords
- soldering apparatus
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3489—Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Molten Solder (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60219956A JPS6281264A (en) | 1985-10-02 | 1985-10-02 | Soldering device |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8622861D0 GB8622861D0 (en) | 1986-10-29 |
GB2181084A GB2181084A (en) | 1987-04-15 |
GB2181084B true GB2181084B (en) | 1989-09-13 |
Family
ID=16743668
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8622861A Expired GB2181084B (en) | 1985-10-02 | 1986-09-23 | Soldering apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS6281264A (en) |
KR (1) | KR870004649A (en) |
GB (1) | GB2181084B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04258370A (en) * | 1991-02-06 | 1992-09-14 | Matsushita Electric Ind Co Ltd | Device and method for dip soldering |
US5876499A (en) * | 1991-05-08 | 1999-03-02 | Lymn; Peter P. | Solder spray leveller |
GB9109899D0 (en) * | 1991-05-08 | 1991-07-03 | Lymn Peter P A | Solder leveller |
JPH0734989B2 (en) * | 1992-09-04 | 1995-04-19 | 大阪アサヒ化学株式会社 | No-clean method for jet soldering |
JPH06296074A (en) * | 1993-04-09 | 1994-10-21 | Tamura Seisakusho Co Ltd | Wave soldering device |
US5507882A (en) * | 1994-02-28 | 1996-04-16 | Delco Electronics Corporation | Low residue water-based soldering flux and process for soldering with same |
EP0753989B1 (en) * | 1995-07-11 | 2005-09-21 | Delphi Technologies, Inc. | Coatings and methods, especially for circuit boards |
US5685475A (en) * | 1995-09-08 | 1997-11-11 | Ford Motor Company | Apparatus for cooling printed circuit boards in wave soldering |
JP3420917B2 (en) * | 1997-09-08 | 2003-06-30 | 富士通株式会社 | Semiconductor device |
JP2000244108A (en) * | 1999-02-22 | 2000-09-08 | Senju Metal Ind Co Ltd | Soldering of printed board, soldering equipment for printed board, and cooling equipment therefor |
CN100425382C (en) * | 2005-06-17 | 2008-10-15 | 杨国金 | Jetting flow welding method and its apparatus |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6057944B2 (en) * | 1982-05-07 | 1985-12-17 | 権士 近藤 | Jet solder bath |
-
1985
- 1985-10-02 JP JP60219956A patent/JPS6281264A/en active Pending
-
1986
- 1986-05-01 KR KR1019860003424A patent/KR870004649A/en not_active Application Discontinuation
- 1986-09-23 GB GB8622861A patent/GB2181084B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
KR870004649A (en) | 1987-05-11 |
JPS6281264A (en) | 1987-04-14 |
GB8622861D0 (en) | 1986-10-29 |
GB2181084A (en) | 1987-04-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |