JPS6057944B2 - Jet solder bath - Google Patents
Jet solder bathInfo
- Publication number
- JPS6057944B2 JPS6057944B2 JP7515382A JP7515382A JPS6057944B2 JP S6057944 B2 JPS6057944 B2 JP S6057944B2 JP 7515382 A JP7515382 A JP 7515382A JP 7515382 A JP7515382 A JP 7515382A JP S6057944 B2 JPS6057944 B2 JP S6057944B2
- Authority
- JP
- Japan
- Prior art keywords
- tank
- solder
- flux
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
Description
【発明の詳細な説明】
この発明は、はんだ槽本体をプリント基板の走行方向に
対して順次配列した１次槽と２次槽の２槽に形成し、こ
の１次槽と２次槽との間にフラックス処理装置を設けた
噴流式はんだ槽に関するものである。DETAILED DESCRIPTION OF THE INVENTION According to the present invention, the solder tank main body is formed into two tanks, a primary tank and a secondary tank, which are arranged sequentially in the running direction of the printed circuit board, and the The present invention relates to a jet solder bath with a flux treatment device installed therebetween.
従来、抵抗器、コンデンサ等のチップ部品をプリント基
板にはんだ付けする場合は、まず、チップ部品をプリン
ト基板に接着剤等で仮付けした後、このプリント基板を
フラックス処理装置でフラックス処理を行い、予備加熱
装置ではんだ付け温度近くまで比較的多くの時間をかけ
て徐々に加熱を行い、次いでプリント基板の走行方向に
対してはんだ槽本体を１次槽と２次槽の２槽に順次配列
して形成した噴流式はんだ槽においてはんだ融液に接触
させて行つていた。Conventionally, when soldering chip components such as resistors and capacitors to a printed circuit board, the chip components are first temporarily attached to the printed circuit board with adhesive, and then the printed circuit board is fluxed using a flux processing device. The preheating device gradually heats the solder over a relatively long period of time to near the soldering temperature, and then the solder baths are sequentially arranged into two tanks, a primary tank and a secondary tank, in the running direction of the printed circuit board. The process was carried out by contacting the solder melt in a jet-type soldering bath formed by the process.
ところで、上記のプリント基板を１次槽ではんだ付けを
行つた後は、あらかじめフラックス処理装置で付着され
たフラックスが蒸発、飛散して、２次槽におけるはんだ
付けにおいてフラックスが不足したり、付着がなかつた
りするため、完全なはんだ付けがなされない欠点があつ
た。By the way, after the above-mentioned printed circuit board is soldered in the primary tank, the flux that was previously applied in the flux treatment device evaporates and scatters, resulting in insufficient flux or poor adhesion during soldering in the secondary tank. There was a drawback that complete soldering could not be done because the soldering was not complete.
この発明は、上記の欠点を除去するためになされたもの
で、１次槽と２次槽との間でプリント基板にフラックス
を補充するためのフラックス処理装置を設けた噴流式は
んだ装置を提供するものである。The present invention was made to eliminate the above-mentioned drawbacks, and provides a jet soldering device that is provided with a flux treatment device for replenishing flux to a printed circuit board between a primary tank and a secondary tank. It is something.
以下この発明について説明する。図面はこの発明の一実
施例を示すもので、１はプリント基板で、図示しないは
んだ付け装置のキャリアに装置されている。This invention will be explained below. The drawings show one embodiment of the present invention, and numeral 1 denotes a printed circuit board, which is mounted on a carrier of a soldering device (not shown).
２は前記プリント基板１は接着剤等で仮付けされた抵抗
器またはコンデンサ等のチップ部品、３ははんだ槽本体
で、仕切壁３ａ、３ｂにより２槽に形成されている。2 is a chip component such as a resistor or a capacitor which is temporarily attached to the printed circuit board 1 with an adhesive or the like, and 3 is a solder tank main body, which is formed into two tanks by partition walls 3a and 3b.
４、５は前記はんだ槽１の１次槽と２次槽で、プリント
基板１の走行方向（矢印Ａ方向）に対して順次配列され
ている。Reference numerals 4 and 5 denote a primary tank and a secondary tank of the solder tank 1, which are arranged in sequence in the running direction of the printed circuit board 1 (direction of arrow A).
６、７は前記１次槽４、２次槽５内のはんだ融液で、２
次槽５内のはんだ融液７の方が第１次槽４内のはんだ融
液６よりも高温にＪ保持されている。6 and 7 are solder melts in the primary tank 4 and secondary tank 5;
The solder melt 7 in the secondary tank 5 is maintained at a higher temperature than the solder melt 6 in the primary tank 4.
８、９は前記１次槽４、２次槽５内に設置された噴流槽
で、それぞれ噴流口Ｂａ、９ａを有し、はんだ融液６、
７を加圧して強制的に循環させる羽根車とモータ（いず
れも図示せず）があり、一定方向に回転している。8 and 9 are jet tanks installed in the primary tank 4 and secondary tank 5, each having jet ports Ba and 9a, and containing solder melt 6,
There is an impeller and a motor (both not shown) that pressurize and forcefully circulate the air 7, which rotates in a fixed direction.
１０は；この発明の要部であるはんだ槽本体３の仕切壁
３ａ、３ｂの間に設けたフラックス処理装置で、１次槽
４と２次槽５との間に形成されている。Reference numeral 10 denotes a flux processing device provided between the partition walls 3a and 3b of the solder tank main body 3, which is an important part of the present invention, and is formed between the primary tank 4 and the secondary tank 5.
１１はフラックス槽、１２はフラックス、１３は前記フ
ラックス１２を吸い上げて含浸させるブラシで、プリン
ト基板１にフラックス１２を塗布させるものである。11 is a flux tank, 12 is a flux, and 13 is a brush for sucking up and impregnating the flux 12, which applies the flux 12 to the printed circuit board 1.
次に動作について説明する。Next, the operation will be explained.
１次槽４、２次槽５内のはんだ融液６，７は図示しない
モータの駆動により羽根車が回転し、加圧されれて噴流
口８ａ，ｇａから噴流される。The solder melts 6 and 7 in the primary tank 4 and the secondary tank 5 are pressurized by rotation of an impeller driven by a motor (not shown) and are jetted from the jet ports 8a, ga.
一方、プリント基板１にチップ部品２を接着剤で仮付け
した後、乾燥し、図示しないフラックス処理装置でフラ
ックス塗布してから予備加熱装置て加熱し、はんだ槽本
体３に搬送する。はんだ槽本体３において、プリント基
板１は水平線に対して上昇角度θ度て矢印Ａ方向に走行
する。そして１次槽４ではんだ融液６によりはんだ付け
が行われる。はじめのはんだ付けが終了したプリント基
板１はさらに走行してフラックス処理装置１０のブラシ
１３に接触してフラックス塗布がなされてから次の２次
槽５に達し、はんだ融液７によりはんだｌ付けされる。On the other hand, after the chip component 2 is temporarily attached to the printed circuit board 1 with an adhesive, it is dried, coated with flux using a flux processing device (not shown), heated using a preheating device, and transported to the solder tank main body 3. In the solder bath main body 3, the printed circuit board 1 travels in the direction of arrow A at an upward angle of θ degrees with respect to the horizontal line. Then, soldering is performed in the primary tank 4 using the solder melt 6. The printed circuit board 1, which has been soldered for the first time, further travels and comes into contact with the brush 13 of the flux treatment device 10, where it is coated with flux, and then reaches the next secondary tank 5, where it is soldered with the solder melt 7. Ru.
この２次槽５では１次槽４で付着されたはんだに気泡が
生じていればこの気泡を取り除き、また、はんだが付着
されていない部分があればこの部品にも完全にはんだ付
が行われる。なお、ブラシ１３としては上記のように固
定し２たブラシの下部をフラックスの液中に浸漬させて
毛細管現象により吸い上げる装置、ノズルにより霧状の
フラックスを固定したブラシに吹き付ける装置、固定さ
れたブラシに沿つて設けたバイブの孔からフラックスを
吹き付ける装置、モータ駆動によりフラックスを吸み上
げてブラシに含浸させる装置等が使用される。以上説明
したようにこの発明は、はんだ槽本体をプリント基板の
走行方向に対して順次配列した１次槽と２次槽との間に
フラックスを補充するフラックス処理装置を設けたので
、１次槽のはんだ付けにおいてプリント基板のフラック
スが蒸発または飛散することによリプリント基板にフラ
ックスが不足したり付着のない状態であつても直ちにフ
ラックスを補充することができ、２次槽において完全な
はんだ付けができる利点がある。In this secondary tank 5, if air bubbles are generated in the solder adhered in the primary tank 4, these air bubbles are removed, and if there are any parts to which no solder is attached, these parts are also completely soldered. . The brush 13 includes a device that immerses the lower part of the two fixed brushes in the flux liquid and sucks it up by capillary action, a device that sprays atomized flux onto the fixed brush using a nozzle, and a device that sprays the fixed brush with a nozzle. A device that sprays flux through a vibrator hole provided along the brush, and a device that uses a motor to suck up flux and impregnate the brush are used. As explained above, the present invention provides a flux treatment device for replenishing flux between the primary tank and the secondary tank in which the solder tank bodies are arranged sequentially in the running direction of the printed circuit board. Even if the flux on the printed circuit board evaporates or scatters during soldering, even if there is insufficient flux on the reprinted circuit board or there is no adhesion, flux can be immediately replenished, and complete soldering can be completed in the secondary bath. There are advantages that can be achieved.
図面はこの発明の一実施例を示す要部を破断した側面図
である。
図中、１はプリント基板、２はチップ部品、３ははんだ
槽本体、３ａ，３ｂは仕切壁、４は１次槽、５は２次槽
、６，７ははんだ融液、８，９は噴流槽、１０はフラッ
クス処理装置、１１はフラックス槽、１２はフラックス
、１３はブラシである。The drawing is a side view showing an embodiment of the present invention, with main parts cut away. In the figure, 1 is a printed circuit board, 2 is a chip component, 3 is a solder tank body, 3a, 3b are partition walls, 4 is a primary tank, 5 is a secondary tank, 6 and 7 are solder melt, and 8 and 9 are 10 is a flux treatment device, 11 is a flux tank, 12 is a flux, and 13 is a brush.
Claims (1)
次配列した１次槽と２次槽の２槽に形成し、前記１次槽
と２次槽内にそれぞれはんだ融液を噴流させる噴流槽を
収容配置したはんだ槽において、前記１次槽と２次槽と
の間にフラックス処理装置を設けたことを特徴とする噴
流式はんだ槽。1 The solder tank body is formed into two tanks, a primary tank and a secondary tank, which are arranged sequentially in the running direction of the printed circuit board, and a jet tank is provided in which the solder melt is jetted into the primary tank and the secondary tank, respectively. A jet-flow type solder bath, characterized in that a flux treatment device is provided between the primary bath and the secondary bath in the solder bath housed in the solder bath.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7515382A JPS6057944B2 (en) | 1982-05-07 | 1982-05-07 | Jet solder bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7515382A JPS6057944B2 (en) | 1982-05-07 | 1982-05-07 | Jet solder bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58192674A JPS58192674A (en) | 1983-11-10 |
| JPS6057944B2 true JPS6057944B2 (en) | 1985-12-17 |
Family
ID=13567970
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7515382A Expired JPS6057944B2 (en) | 1982-05-07 | 1982-05-07 | Jet solder bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6057944B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6281264A (en) * | 1985-10-02 | 1987-04-14 | Alps Electric Co Ltd | Soldering device |
| JPH01238096A (en) * | 1988-03-18 | 1989-09-22 | Senju Metal Ind Co Ltd | Soldering method of printed board |
-
1982
- 1982-05-07 JP JP7515382A patent/JPS6057944B2/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58192674A (en) | 1983-11-10 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0336659B1 (en) | Method and apparatus for applying flux to a substrate | |
| US5328085A (en) | Apparatus for applying flux | |
| US4871105A (en) | Method and apparatus for applying flux to a substrate | |
| JPS6057944B2 (en) | Jet solder bath | |
| US3710759A (en) | Wiper means for liquid flux applying apparatus | |
| WO2002026006A1 (en) | Flux applying method, flow soldering method and devices therefor and electronic circuit board | |
| JPH03300Y2 (en) | ||
| JPH0216858Y2 (en) | ||
| JPS6031016Y2 (en) | soldering equipment | |
| JPS6056588B2 (en) | Jet solder bath | |
| JPS59153570A (en) | Solder tank | |
| JP2580843Y2 (en) | Horizontal dip type solder coating equipment for printed circuit boards | |
| JPS6366078B2 (en) | ||
| JP2715400B2 (en) | Flux coating device | |
| JPH03187291A (en) | Soldering method | |
| JPS5884673A (en) | Soldering method | |
| JPS59163070A (en) | Soldering device | |
| JPS6214687Y2 (en) | ||
| JPH0214859Y2 (en) | ||
| JPS6216876A (en) | Soldering method | |
| JPS57190767A (en) | Soldering method for chip parts | |
| JPS6245375A (en) | Apparatus for applying liquid | |
| JPH0592263A (en) | Spray type flux applying device | |
| JPS5884672A (en) | Soldering method | |
| JPH02155567A (en) | Jet type soldering tank |