JPH0629423A - Sealing glass molded substrate - Google Patents

Sealing glass molded substrate

Info

Publication number
JPH0629423A
JPH0629423A JP20297892A JP20297892A JPH0629423A JP H0629423 A JPH0629423 A JP H0629423A JP 20297892 A JP20297892 A JP 20297892A JP 20297892 A JP20297892 A JP 20297892A JP H0629423 A JPH0629423 A JP H0629423A
Authority
JP
Japan
Prior art keywords
sealing
glass
jig
sealing glass
insulating member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP20297892A
Other languages
Japanese (ja)
Other versions
JP2745983B2 (en
Inventor
Hiroshi Seki
宏志 関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Seiki Co Ltd
Original Assignee
Nippon Seiki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Seiki Co Ltd filed Critical Nippon Seiki Co Ltd
Priority to JP4202978A priority Critical patent/JP2745983B2/en
Publication of JPH0629423A publication Critical patent/JPH0629423A/en
Application granted granted Critical
Publication of JP2745983B2 publication Critical patent/JP2745983B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Joining Of Glass To Other Materials (AREA)

Abstract

PURPOSE:To ensure sealing with good accuracy at a low temperature by previously preventing sealing glass and a jig from being joinned with each other by disposing an insulating member not softened and melted upon a sealing heating processing at a location where the sealing glass makes contact with the jig. CONSTITUTION:Sealing glass is disposed and an insulating member 2 not softened and melted upon a sealing/heating processing is disposed on the lower portion of the sealing glass 1 to form a cylindrical sealing glass molded structure 3. The sealing glass 1 is prevented from being brought into contact with a jig 5 through the insulating member 2 by performing the sealing/heating processing using such a sealing molded structure 3, so that a pedestal 4 and the jig 5 may be constructed with the same material and highly accurate sealing may be ensured, keeping a set position. Further, even if low-melting point glass, which is impossible to be used convenationally when graphite is used for the jig 5, is employed at the sealing glass 1, the sealing glass 1 is prevented from making contact with the jig 5 through the insulating material 2, so that a sealing/heating processing at a low temperature is ensured to restrict any chemical change in the jig 5.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えばハーメチックシ
ール(気密封着)の際に使用される封着用ガラス成型体
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a glass molding for sealing which is used, for example, in hermetic sealing.

【0002】[0002]

【従来の技術】例えば、特開平3-106077号公報に記載さ
れているように、ハーメチックシールを行う際に封着用
ガラスが用いられており、かかる封着用ガラスとして
は、ソーダライム系,ソーダバリウム系,硼珪酸系等の
ガラス粉末に若干のバインダを加えて顆粒粉末としたも
のをプレス成型後バインダを除去し、焼結熱処理してタ
ブレットとした高融点ガラスであり、その軟化点は800
〜1200℃程度である。
2. Description of the Related Art For example, as described in Japanese Patent Laid-Open No. 3-106077, a sealing glass is used when performing a hermetic seal. Examples of the sealing glass include soda lime type and soda barium. It is a high melting point glass that is made by adding a small amount of a binder to glass powder of borosilicate, borosilicate, etc. to make a granular powder, press-molding the binder, then heat-treating it to form a tablet, and its softening point is 800.
It is about 1200 ℃.

【0003】[0003]

【発明が解決しようとする課題】前記封着用ガラスを用
いてハーメチックシールを行う場合、封着治具に被封着
部材と封着用ガラスとをセットして全体を前記軟化点ま
で封着加熱処理するが、各材料の熱膨張による伸びの差
を考慮して治具を設計する必要があり、実際精密に位置
精度を合わせるよう治具を設計することは困難である。
すなわち、最も位置精度を精密に合わせるためには、被
封着部材と同材料にて治具を製作することが望ましい
が、当然この治具と封着用ガラスとも接合してしまい用
いることはできない。このため、現在治具の材料とし
て、通常の酸化物ガラスと他の材料との接合が酸素の拡
散により引き起こされることに着目し、還元性の材料や
酸素と接合し難い材料のうち、加工しやすさや価格等の
観点からカーボンが広く利用されている。
When a hermetic seal is performed using the sealing glass, the member to be sealed and the sealing glass are set on a sealing jig and the whole is heat treated for sealing up to the softening point. However, it is necessary to design the jig in consideration of the difference in elongation due to the thermal expansion of each material, and it is difficult to design the jig so that the positional accuracy is actually adjusted accurately.
That is, it is desirable to manufacture a jig with the same material as the material to be sealed in order to adjust the positional precision most accurately, but naturally this jig and the sealing glass cannot be used because they are also joined. Therefore, as a material for jigs, we have focused on the fact that the bonding between normal oxide glass and other materials is caused by the diffusion of oxygen. Carbon is widely used from the viewpoint of ease and price.

【0004】また、高融点ガラスから成る封着用ガラス
では、高温の封着熱加熱処理を必要とするため、封装着
部材は化学変化(特に酸化)を受けやすく、封着後にス
ケール(熱サビ)落しのための化学処理を行うか、封着
加熱処理の雰囲気を著しく還元性にする必要があり、作
業が煩雑であった。なお、前記化学変化を抑える手段と
して、ブラウン管のパネルとファンネルの接合やアルミ
ナ質のICパッケージの封止等に利用されている低融点
ガラスを用いることも考えられるが、かかるガラスはPb
O を主成分とするため、還元されやすく、前記化学変化
を考慮した還元性雰囲気ではPbO が還元されてPbとな
り、前記カーボンの治具と容易に接合してしまうため利
用できなかった。
Further, since the sealing glass made of high melting point glass requires high-temperature sealing heat treatment, the sealing member is susceptible to chemical change (especially oxidation), and scale (heat rust) is generated after sealing. The work was complicated because it was necessary to perform a chemical treatment for dropping or to make the atmosphere of the sealing heat treatment remarkably reducing. As a means for suppressing the chemical change, it is conceivable to use a low melting point glass used for joining a cathode ray tube panel and a funnel, sealing an alumina IC package, or the like.
Since it contains O 2 as a main component, it is easily reduced, and PbO 2 is reduced to Pb in a reducing atmosphere considering the above-mentioned chemical change, and it cannot be used because it is easily bonded to the carbon jig.

【0005】[0005]

【課題を解決するための手段】本発明は、治具に用いる
材料の選択幅を広げ、更に、低融点ガラスの使用を可能
とするべく、封着用ガラスの少なくとも一部に封着加熱
処理時に軟化溶融しない絶縁部材を配置したものであ
る。
According to the present invention, in order to widen the selection range of materials used for jigs and to enable the use of low melting point glass, at least a part of the sealing glass is subjected to sealing heat treatment. An insulating member that does not soften and melt is arranged.

【0006】[0006]

【作用】封着用ガラスの治具と接する部分に封着加熱処
理時に軟化溶融しない絶縁部材を配置した封着用ガラス
成型体により、封着用ガラスと治具との接合を防止する
ことができる。
By the molded glass for sealing in which an insulating member that does not soften and melt during the heat treatment for sealing is arranged in a portion of the glass for sealing that is in contact with the jig, the bonding of the glass for sealing and the jig can be prevented.

【0007】[0007]

【実施例】本発明を添付図面に記載した実施例を用いて
ハーメチックシールする場合の例を説明する。なお、以
下においては、圧力センサや加速度センサにおける台座
(被封着部材)とピンとの接合の例を示している。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of hermetically sealing the present invention will be described with reference to the embodiments shown in the accompanying drawings. In the following, an example of joining a pedestal (sealed member) and a pin in a pressure sensor or an acceleration sensor is shown.

【0008】封着用ガラス1とその下部に配置した絶縁
部材2とから成る封着用ガラス成型体3を外径2.9 mm,
内径1.4 mm,厚さ2.2 mmの円筒状に作る。
A sealed glass molding 3 comprising a sealing glass 1 and an insulating member 2 arranged below the sealing glass 1 has an outer diameter of 2.9 mm,
It is made into a cylinder with an inner diameter of 1.4 mm and a thickness of 2.2 mm.

【0009】台座4は厚さ2.0 mmで、ピン(後述する)
を封着用ガラス1で封着するための孔径3.0 mmの孔4a
を有し、前記ピンを挿入位置決めする孔径1.4 mm,深さ
7mmの孔5aを有する治具5に夫々の孔4a,5aの中
心を合わせてセットする。
The pedestal 4 has a thickness of 2.0 mm and a pin (described later).
4a with a hole diameter of 3.0 mm for sealing the glass with sealing glass 1
And the center of each of the holes 4a, 5a is set in a jig 5 having a hole 5a having a hole diameter of 1.4 mm and a depth of 7 mm for inserting and positioning the pin.

【0010】台座4の孔4aに封着用ガラス成型体3を
挿入し、封着用ガラス成型体3の孔3aに長さ15mm,太
さ1.25mmの 50Ni-Fe合金材料から成るピン6をその先端
が治具5の孔5aで位置決めされるよう挿入し、これら
を所定の封着条件にて封着加熱処理を行い、封着用ガラ
ス1にて台座4とピン6とを封着する。
The glass molding 3 for sealing is inserted into the hole 4a of the pedestal 4, and the pin 6 made of 50Ni-Fe alloy material having a length of 15 mm and a thickness of 1.25 mm is inserted into the hole 3a of the glass molding for sealing 3 at its tip. Is inserted so as to be positioned by the hole 5a of the jig 5, and these are subjected to a sealing heat treatment under a predetermined sealing condition, and the pedestal 4 and the pin 6 are sealed with the sealing glass 1.

【0011】かかる封着用ガラス成型体3を用いること
により、封着用ガラス1が絶縁部材2によって治具5と
接触しないため、台座4と治具5とを同一材料にするこ
とができ、セットした位置を保ちながら精度の良い封着
を行うことができる。また、治具5にグラファイトを用
いた場合に従来使うことのできなかった低融点ガラスを
封着用ガラス1として用いても、絶縁材料2により封着
用ガラス1が治具5に接触しなくなることから使え、よ
って低い温度での封着熱処理を行うことができ、治具5
の化学変化(特に酸化)を抑えることができ、スケール
落し等の後処理を省けるため、工程全体の簡素化を図る
ことができる。
By using the sealing glass molding 3 as described above, the sealing glass 1 does not come into contact with the jig 5 by the insulating member 2, so that the base 4 and the jig 5 can be made of the same material and set. It is possible to perform accurate sealing while maintaining the position. Further, even if a low melting point glass which cannot be used conventionally when graphite is used for the jig 5 is used as the sealing glass 1, the insulating material 2 prevents the sealing glass 1 from coming into contact with the jig 5. It can be used and therefore can perform heat treatment for sealing at low temperature.
Since the chemical change (particularly oxidation) can be suppressed and post-treatment such as scale removal can be omitted, the whole process can be simplified.

【0012】次に、本発明者が実際に製作した具体的な
実施例について説明する。
Next, a concrete example actually manufactured by the present inventor will be described.

【0013】[0013]

【表1】 [Table 1]

【0014】表1は、従来例,本発明の幾つかの実施例
及びこれら実施例に対して絶縁部材2を用いない比較例
の結果を示している。各例において、封着用ガラス1
は、ガラス粉末を円筒状プレス成型した後、プレス成型
のために添加したニトロセルロースや芳香族有機化合物
等の有機バインダーを除去し、強度を持たせるため、封
着用ガラス1の軟化点付近で焼結したガラスタブレット
を使用した(従来例,実施例及び比較例)。また、絶縁
部材2は、セラミックスのチューブをスライスしたもの
(実施例1,6)や封着用ガラス1と同様にガラス粉末
を成型後焼結したもの(実施例2〜5)を用いた。
Table 1 shows the results of the conventional example, some examples of the present invention, and comparative examples in which the insulating member 2 is not used for these examples. Glass for sealing 1 in each example
Is formed by pressing glass powder into a cylindrical shape and then removing the organic binder such as nitrocellulose or aromatic organic compound added for press molding to give strength, so that the glass is baked near the softening point of the sealing glass 1. A bonded glass tablet was used (conventional example, example and comparative example). Further, as the insulating member 2, those obtained by slicing a ceramic tube (Examples 1 and 6) and those obtained by molding and sintering glass powder as in the sealing glass 1 (Examples 2 to 5) were used.

【0015】従来一般にハーメチックシールにおいて使
用されている高融点ガラスの封着用ガラス1で絶縁部材
2を用いない従来例では、台座4と治具5との位置精度
が悪く、台座4にスケールの発生が見られた。
In the conventional example in which the insulating member 2 is not used in the sealing glass 1 of high melting point glass that is generally used in the hermetic seal, the positional accuracy of the pedestal 4 and the jig 5 is poor, and scale is generated on the pedestal 4. It was observed.

【0016】実施例1〜6は、絶縁部材2を用いること
により、封着用ガラス1が治具5に接合することなく、
台座4とピン6とを封着することができた。特に、台座
4と治具5とを同一材料にて用いた場合(実施例1,3
〜6)、熱膨張係数が同じため位置精度が良好となっ
た。なお、実施例2は、台座4と治具5との材料が異な
るが、封着用ガラス1として低融点ガラスを用いて封着
加熱処理の際の温度が低温であることから、他の実施例
と殆ど変わらない位置精度を得ることができた。絶縁部
材2を用いない比較例1では、封着用ガラス1が治具5
に接合した。
In Examples 1 to 6, by using the insulating member 2, the sealing glass 1 was not joined to the jig 5,
The pedestal 4 and the pin 6 could be sealed. Particularly, when the base 4 and the jig 5 are made of the same material (Examples 1 and 3)
6), the thermal expansion coefficient is the same, so that the positional accuracy is good. In the second embodiment, the pedestal 4 and the jig 5 are different in material, but a low melting point glass is used as the sealing glass 1 and the temperature during the sealing heat treatment is low. It was possible to obtain the position accuracy almost the same as the above. In Comparative Example 1 in which the insulating member 2 is not used, the sealing glass 1 is the jig 5
Joined to.

【0017】また、従来用いることのできなかった低融
点ガラスを封着用ガラス1として用いることができ(実
施例2〜6)、スケールの殆ど発生しない封着が可能と
なり、封着後の化学処理を省略することができた。しか
も、低融点ガラスを用いた場合には、高融点ガラスを用
いる場合(実施例1)よりも封着後のピン6の引き抜き
強度が高まったことが分かった。封着用ガラス1とピン
6との接合断面を調査した結果、後者ではピン6のNiメ
ッキ表面と封着用ガラス1とが接合していたのに対し、
前者ではピン6のNiメッキに対する封着用ガラス1の侵
食性が激しくピン6内部に侵入して50Ni合金と直接封着
用ガラス1が接合していることが分かり、これにより前
記強度の増強が図られたものと考えられる。絶縁部材2
を用いない比較例2,3では、封着用ガラス1が治具5
に接合した。
Further, a low melting point glass which could not be used conventionally can be used as the glass 1 for sealing (Examples 2 to 6), and sealing with almost no generation of scale is possible, and chemical treatment after sealing is possible. Could be omitted. Moreover, it was found that when the low melting point glass was used, the pull-out strength of the pin 6 after sealing was higher than when the high melting point glass was used (Example 1). As a result of investigating the joint cross-section between the sealing glass 1 and the pin 6, in the latter case, the Ni-plated surface of the pin 6 and the sealing glass 1 were bonded.
In the former, it was found that the sealing glass 1 was highly corrosive to the Ni plating of the pin 6 and penetrated into the inside of the pin 6 to directly bond the 50Ni alloy and the sealing glass 1 to each other, thereby enhancing the strength. It is believed that Insulation member 2
In Comparative Examples 2 and 3 in which no glass is used, the sealing glass 1 is the jig 5
Joined to.

【0018】本発明は、その要旨の範囲内で種々の変形
が可能であり、例えば絶縁部材2の形状は、円筒状のみ
ならず封着用ガラス1や治具5と一部で当接する凹形状
や凸形状等の各種が可能であり、絶縁部材2の下端で台
座4とピン6とを支持する構成とすれば、治具5を廃止
することができる。
The present invention can be variously modified within the scope of the invention. For example, the shape of the insulating member 2 is not limited to a cylindrical shape, but is a concave shape that partially abuts the sealing glass 1 and the jig 5. The jig 5 can be eliminated by adopting a configuration in which the pedestal 4 and the pin 6 are supported by the lower end of the insulating member 2 as well as various shapes such as a convex shape.

【0019】また、封着用ガラス1,絶縁部材2,台座
4,治具5及びピン6の材料は前記実施例に限定されず
使用状況に適した種々の組合せが可能であり、例えば位
置精度を重視する場合には封着用ガラス1に硼珪酸系ガ
ラス,絶縁部材2にムライト系セラミックス,台座4,
治具5及びピン6にコバール金属を用いたり、封着後の
化学処理を除いて工程全体の簡素化を重視する場合には
封着用ガラス成型体3として、低融点ガラスに低膨張セ
ラミックスを添加した封着用ガラス1と硼珪酸ガラスを
用いた絶縁部材2で構成し、450〜500℃程度の低温封着
加熱処理を行うことも可能である。
Further, the materials for the sealing glass 1, the insulating member 2, the pedestal 4, the jig 5 and the pin 6 are not limited to those in the above-mentioned embodiment, and various combinations suitable for the use situation are possible. When giving priority, the borosilicate glass as the sealing glass 1, the mullite ceramics as the insulating member 2, the base 4,
When Kovar metal is used for the jig 5 and the pin 6, or when importance is placed on simplification of the entire process except chemical treatment after sealing, as the glass molded body 3 for sealing, low expansion glass and low expansion ceramics are added. It is also possible to configure the sealing glass 1 and the insulating member 2 using borosilicate glass, and perform low-temperature sealing heat treatment at about 450 to 500 ° C.

【0020】[0020]

【発明の効果】本発明は、封着用ガラスの少なくとも一
部に封着加熱処理時に軟化溶融しない絶縁部材を配置し
たものであり、封着加熱処理時に封着用ガラスと治具と
の接合を防止することができるため、被封着部材と同一
材料にて治具をつくることができ、治具に被封着部材を
セットした位置を保ちながら精度の良い封着を行うこと
ができる。
INDUSTRIAL APPLICABILITY According to the present invention, at least a part of the sealing glass is provided with an insulating member which is not softened and melted during the sealing heat treatment, and prevents the sealing glass and the jig from being joined during the sealing heat treatment. Therefore, the jig can be made of the same material as the member to be sealed, and accurate sealing can be performed while maintaining the position where the member to be sealed is set on the jig.

【0021】また、封着ガラスと治具とが接しないた
め、従来使用することが困難であった低融点ガラスを使
用することができ、従来よりも低温での封着が可能とな
ることから、被封着部材は化学変化を受けにくくなり、
封着加熱処理の際の温度が550℃程度までなら殆どスケ
ールが発生せずに後処理を省けるため、工程全体の簡素
化を図ることができる。
Further, since the sealing glass and the jig are not in contact with each other, it is possible to use a low melting point glass which has been difficult to use in the past, and it is possible to perform sealing at a lower temperature than in the past. , The sealed members are less susceptible to chemical changes,
If the temperature at the time of heat treatment for sealing is up to about 550 ° C, almost no scale is generated and the post-treatment can be omitted, so that the whole process can be simplified.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例の斜視図。FIG. 1 is a perspective view of an embodiment of the present invention.

【図2】同上実施例を用いて封着を行う場合の要部断面
図。
FIG. 2 is a cross-sectional view of a main part when sealing is performed using the above embodiment.

【図3】図2の分解斜視図。FIG. 3 is an exploded perspective view of FIG.

【符号の説明】[Explanation of symbols]

1 封着用ガラス 2 絶縁部材 3 封着用ガラス成型体 4 台座 5 治具 6 ピン 1 Glass for sealing 2 Insulation member 3 Molded glass for sealing 4 Pedestal 5 Jig 6 pins

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 封着用ガラスの少なくとも一部に封着加
熱処理時に軟化溶融しない絶縁部材を配置したことを特
徴とする封着用ガラス成型体。
1. A molded glass body for sealing, wherein an insulating member which does not soften and melt during heat treatment for sealing is arranged on at least a part of the glass for sealing.
【請求項2】 前記封着用ガラスは、軟化点が550 ℃以
下の低融点ガラスであることを特徴とする請求項1に記
載の封着用ガラス成型体。
2. The molded glass for sealing according to claim 1, wherein the glass for sealing is a low melting point glass having a softening point of 550 ° C. or lower.
JP4202978A 1992-07-07 1992-07-07 Glass molding for sealing Expired - Lifetime JP2745983B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4202978A JP2745983B2 (en) 1992-07-07 1992-07-07 Glass molding for sealing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4202978A JP2745983B2 (en) 1992-07-07 1992-07-07 Glass molding for sealing

Publications (2)

Publication Number Publication Date
JPH0629423A true JPH0629423A (en) 1994-02-04
JP2745983B2 JP2745983B2 (en) 1998-04-28

Family

ID=16466306

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4202978A Expired - Lifetime JP2745983B2 (en) 1992-07-07 1992-07-07 Glass molding for sealing

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412496A (en) * 1977-06-30 1979-01-30 Toshiba Corp Electrically insulated terminal and method of manufacturing the same
JPS63114238A (en) * 1986-10-31 1988-05-19 Fujitsu Ltd Semiconductor package
JPS63177448A (en) * 1987-01-17 1988-07-21 Nippon Dempa Kogyo Co Ltd Metallic base and piezoelectric oscillator using this base

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5412496A (en) * 1977-06-30 1979-01-30 Toshiba Corp Electrically insulated terminal and method of manufacturing the same
JPS63114238A (en) * 1986-10-31 1988-05-19 Fujitsu Ltd Semiconductor package
JPS63177448A (en) * 1987-01-17 1988-07-21 Nippon Dempa Kogyo Co Ltd Metallic base and piezoelectric oscillator using this base

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