JPS63114238A - Semiconductor package - Google Patents

Abstract

PURPOSE:To prevent electrical short circuits due to inflow of solder material for fixing electronic parts into outer leads, by forming insulators, which insulate a stem base and the outer leads, so that the insulators are protruded at least from the surface of a stem base in the inside of a package. CONSTITUTION:An insulator 3, which insulates a stem base 4 and each outer lead 2, is protruded at least from the surface of a stem base 4 in the inside of a package. Or an insulating ring 5 is provided at the upper part of the insulator 3, which insulates the stem base 4 and the outer lead 2 or at the outer surface of the insulator 3, which is protruded from the surface of the stem base 4. Thus inflow of a solder material for fixing electronic parts to the stem base 4 and connection with the outer lead 2 are prevented even when many electronic parts are mounted in a semiconductor package. Electrical short circuits between the stem base 4 and the outer leads can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION (The first semiconductor package of the Jll-required invention is characterized in that the insulator that insulates the stem base and the outer lead has a shape that protrudes from at least the surface of the stem base inside the package.

A second semiconductor package of the present invention is characterized in that an insulating ring is provided on the top of the insulator that insulates the stem base and the outer lead or on the outer periphery of the insulator that protrudes from the surface of the stem base.

In this way, by forming the insulator into a shape that protrudes from at least the stem base surface inside the package, or by providing an insulating ring on the top of the insulator or on the outer periphery of the insulator that protrudes from the stem base surface, a large number of Even when mounting an electronic component, it is possible to prevent the brazing material for fixing the electronic component to the stem base from flowing and connecting to the outer lead, thereby preventing an electrical short circuit between the stem base and the outer lead.

[Industrial application field]

The present invention relates to a semiconductor package, and more particularly to the shape of an insulator or an insulating link that insulates a stem base and an outer lead.

[Conventional technology]

The structure of a conventional semiconductor package is shown in Figure 3 (a
) is a bottom view, (b) is a front view, (C) is a side sectional view,
(d) is an enlarged view of the part indicated by A in (C). In Figure 0, l is the case body.

2 is an outer lead, 3 is an insulator that insulates the stem base 4 and the outer lead, and 4 is a stem base. The insulator is provided so as to be substantially flat with the stem base surface, as shown in an enlarged view in FIG. 3(C).

[Problem that the invention seeks to solve]

Incidentally, in recent years, semiconductor stems, like other electronic components, have been required to be smaller and more densely packaged, and the number of outer leads that make electrical connections from the stem base to the outside has also increased, leading to a tendency for lead spacing to become narrower. It is in. For this reason, the distance between the electronic components attached to the stem base is also narrower,
The brazing material used to bond electronic components to the stem base may flow and connect with the outer leads, causing an electrical short circuit.

The present invention was created in view of the above points, and an object of the present invention is to provide a semiconductor package with perfect insulation of the outer leads and excellent reliability.

[Means for solving problems]

FIG. 1 is a side sectional view ((a), (b), (c)) showing the principle structure of the semiconductor package of the present invention, and an enlarged view ((d), (e) of the insulator or insulator ring portion thereof). , (f
), where FIG. 1(d) is (a), and (e) is (
b) and (f) are (a), (b), and (c) respectively in (C).
In Fig. 0, which is an enlarged view of the part indicated by B, the same parts are indicated by the same reference numerals as in Fig. 3, and 5 is an insulating ring.

The semiconductor packages shown in FIGS. 1(a) and 1(d) correspond to the semiconductor package set forth in claim 1, in which the insulator has a shape protruding from the surface of the stem base.

In Fig. 1 (b) and (e), the shape of the insulator is the same as the conventional example, but an insulating ring is provided on the top of the insulator, and in Fig. 1 (CC) and (f) it protrudes from the stem base. An insulating ring is provided on the outer periphery of an insulator having a shape of 1, and these correspond to claim 2.

[Effect]

In the semiconductor package of the present invention, the electronic component is attached to the stem base by providing the insulator in a shape that protrudes from the stem base, or by providing an insulating ring on the top of the insulator or on the outer periphery of the insulator that protrudes from the stem base. This can prevent the brazing material used for bonding the outer leads from flowing into the outer leads and causing electrical short circuits.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings. FIGS. 2(a) and 2(b) are a side sectional view and a partially enlarged view of the semiconductor puff cage of the present invention. Note that the bottom view and front view are similar to those shown in FIGS. 3(a) and 3(b), respectively.

In the figures, the same reference numerals as in FIGS. 1 and 3 indicate the same elements. In this embodiment, a Peltier element 6 is mounted as an electronic component, 7 is a fiber, 8 is an LD element, and 9 is an LD element. is an FD element, and 10 is a thermistor. 11 is a brazing material that fixes the Peltier element 6 to the stem base;
The insulator 3 having a shape protruding from the stem base surface and the insulating ring 5 provided on the outer periphery of the insulator protruding from the stem base surface completely prevent the water from flowing into the outer lead 2.

Here, the material of the insulator is ordinary insulating glass, and the material of the insulating ring is ceramic. still.

Materials other than these can be used as long as they have sufficient insulation and moldability.

〔Effect of the invention〕

As described above, according to the present invention, even when a large number of electronic components are mounted on a semiconductor package, it is possible to prevent electrical short circuits caused by the flow of the brazing filler metal that fixes the electronic components into the outer leads, thereby improving reliability. can be improved.

[Brief explanation of the drawing]

FIGS. 1(a), (b), and (c) are cross-sectional views showing the basic configuration of the present invention, and FIGS. 1(d), (e), and (f) are respective partially enlarged views. FIG. 2 is a sectional view (a) and a partially enlarged view of the embodiment of the present invention. FIG. 3 is a sectional view showing a conventional example, and (a) is a rear view;
(b) is a front view, and (C) is a side sectional view. (d) is a partially enlarged view of (c). (Coding theory [J]) 1...Case body, 2...Outer lead, 3...Insulator. 4... Stem base, 5... Insulation ring, 6... Vertier element. 7...Fiber, 8...LD element. 9...FD element. 10... Thermistor, 11... Brazing material.

Claims (2)

[Claims] (1) A semiconductor package characterized in that an insulator that insulates a stem base and an outer lead has a shape that protrudes from at least the surface of the stem base inside the package. (2) A semiconductor package characterized in that an insulating ring is provided on the top of an insulator that insulates the stem base and the outer lead or on the outer periphery of the insulator that protrudes from the surface of the stem base.