JPH06168753A - Seal structure - Google Patents

Abstract

PURPOSE:To enable a seal to be applied at low temperature by using one of nickel, deposited nickel and nickel alloy as first and second metals, and lead glass for sealing the metal, regarding a seal structure where the first and second metals are sealed with sealing glass. CONSTITUTION:A base plate (a first metal) 1 is an SPC steel plate to which nickel plating is applied according to an electroless deposition method, and a pin (a second metal) 2 is a 50 Ni-Fe alloy to which nickel plating is applied according to the same method. Also, sealing glass 3 is lead series glass having a fusion point equal to or lower than 700 deg.C. The pin 2 and glass 3 are set on the base plate 1, and a sealing process is continued for 20 minutes at 500 deg.C.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing structure for sealing between metals with glass for sealing, and more particularly to a sealing structure suitable for hermetic sealing.

[0002]

2. Description of the Related Art For example, as described in Japanese Patent Application Laid-Open No. 3-106077, a sealing glass is used when performing a hermetic seal. Examples of the sealing glass include soda lime type and soda barium. It is a high melting point glass that is made by adding a small amount of a binder to a glass powder of borosilicate, borosilicate, etc. to make a granular powder, press-molding the binder, removing the binder, and heat-treating it into a tablet. The melting point is 800 ~
It is about 1200 ℃.

[0003]

When carrying out a hermetic seal between metals, which is a member to be sealed, using the glass for sealing, the temperature of the seal must be raised to the melting point or higher. Is susceptible to chemical changes (especially oxidation), and it was necessary to perform chemical treatment to remove scale (heat rust) after sealing.

In addition, after performing hermetic sealing on the member to be sealed, if welding (laser welding, resistance welding, etc.) is performed between a part of the member to be sealed and another metal, the member to be sealed is Nickel (Ni) plating is usually applied in advance in order to improve the corrosion resistance (rust resistance) depending on the temperature of the hermetically sealed member, but in general, electroplating is performed.
After the sealing, the scale was removed by acid treatment, then electroless plating was performed, and the welding was performed. That is, since electroplating is resistant to high temperatures, uniform plating is difficult, and electroless plating is capable of uniform plating but weak to high temperatures. Therefore, desired plating was performed twice. If this plating is not performed uniformly, the above welding (especially in the case of resistance welding) may not be performed sufficiently.

[0005]

In order to solve the above-mentioned problems, the present invention provides a sealing structure for sealing a first metal and a second metal with a sealing glass, wherein both metals are nickel and nickel-plated. ， Any of nickel alloys,
As the glass for sealing, a lead (PbO 3) glass having a melting point of 700 ° C. or less was used.

[0006]

[Function] It becomes possible to seal at a low temperature.

[0007]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of carrying out the hermetic seal of the present invention will be described with reference to the embodiments shown in the accompanying drawings. In the following, an example of sealing the base plate (first metal) and the pin (second metal) in the pressure sensor or the acceleration sensor is shown.

The base plate 1, which is the member to be sealed, is formed by plating nickel on a metal such as SPC steel plate or SUS304. This nickel plating may be electroless plating as described later. The base plate 1 is a hole 1a for sealing a pin which is another sealing target member described later with a sealing glass described later.
Have a plurality of.

The pin 2 is made of a metal such as 50Ni-Fe alloy, 42Ni-Fe alloy or nickel-plated Kovar, and is set in the hole 1a of the base plate 1 through a sealing glass described later.

The glass 3 for sealing is made of lead-based glass,
In a donut-shaped molded body having a hole 3a, the sealing glass 3 is set in the hole 1a of the base 1, and the pin 2 is further set in the hole 3a of the sealing glass 3.

With this structure, the base plate 1 and the pin 2 can be sealed with the glass 3 for sealing. In this case, the temperature of the seal is much lower than in the conventional case, and it is possible to seal at a low temperature. Therefore, electroless plating which is weak to high temperature is sufficient as the nickel plating of the base plate 1, and the sealing at low temperature is also possible. Therefore, almost no scale is generated on the base plate 1 and the pins 2. Accordingly, the electroplating and the acid treatment for scale removal, which are conventionally required, are not required, and the manufacturing process can be remarkably simplified.

Further, since the temperature of the seal may be low, other components (not shown) arranged inside the base plate 1
(Au) used to make electrical connection between pin and pin 2
For wire bonding, etc., aluminum (Al) can be preliminarily provided on the upper surface of the pin 2 as a bonding pad before performing the sealing, and the manufacturing process as a whole can be simplified.

Next, a specific embodiment actually manufactured by the present inventor will be described.

Examples in which good results have been obtained include an SPC steel plate having a thickness of 5 to 10 microns nickel plated on the base plate 1 by electroless plating, and a pin 5 having a thickness of 5 to 10 microns plated by electroless plating. 50Ni-F with nickel plating
e Alloy, as a glass for sealing, a lead-based glass powder is press-molded into a cylindrical shape and then the organic binder such as nitrocellulose or aromatic organic compound added for press-molding is removed to increase strength. Glass tablets sintered near the melting point were used, respectively. The sealing was performed in a nitrogen atmosphere containing oxygen of 1.0 ppm or less at a temperature of 500 ° C for 20 minutes.

For comparison with this embodiment, the base plate 1 and the pin 2 are made of the same material as in the above embodiment, and only the sealing glass 3 is replaced with soda barium (SiO-BaO-Na ₂ O) type glass and the above-mentioned embodiment is carried out. Seal temperature 1000 ℃, time in the same atmosphere as the example
A comparative example was made in 10 minutes.

As a result of examining the seal states of the manufactured example and the comparative example, the pull-out strength of the pin 2 is
Even at 13 kg, the pin 2 was not pulled out and the seal part was broken, whereas in the latter, the pin 2 was pulled out at 4 to 5 kg, and it was confirmed that the former had no problem in actual use. In the former case, when the joint cross section of the base plate 1 and the pin 2 and the sealing glass 3 was investigated, the corrosiveness of the sealing glass 3 with respect to nickel plating was severe, and the sealing glass 3 was found inside the base plate 1 and the pin 2. It is considered that the material penetrated deeply to enhance the strength. In addition,
If the temperature of the seal is 700 ° C or less, almost no scale is generated on the base plate 1 and the pins 2.

The present invention can be variously modified within the scope of the invention. For example, if the member to be sealed is any one of nickel, nickel plating, and nickel alloy, the lead glass 3 is used as the sealing glass 3. Can be used to seal at low temperature. Of course, one metal may be nickel-plated and the other metal may be a nickel alloy.

[0018]

According to the present invention, in a seal structure for sealing a first metal and a second metal with a sealing glass, both the metals are nickel, nickel plating or nickel alloy, The wearable glass uses lead-based glass with a melting point of 700 ° C or less, and it is possible to seal at a lower temperature than before, which makes the sealed material less susceptible to chemical changes and simplifies the entire manufacturing process. In addition, it is possible to achieve good sealing.

[Brief description of drawings]

FIG. 1 is an exploded sectional view of an embodiment of the present invention.

[Explanation of symbols]

 1 base plate (first metal) 2 pins (second metal) 3 glass for sealing

Claims (1)

[Claims] 1. A sealing structure for sealing a first metal and a second metal with a sealing glass, wherein the both metals are nickel (Ni), nickel plating, or nickel alloy, and the sealing is performed. Glass has lead (Pb
O) Glass type seal structure.