JPH0628665Y2 - 半導体圧力センサの温度補償回路 - Google Patents
半導体圧力センサの温度補償回路Info
- Publication number
- JPH0628665Y2 JPH0628665Y2 JP353288U JP353288U JPH0628665Y2 JP H0628665 Y2 JPH0628665 Y2 JP H0628665Y2 JP 353288 U JP353288 U JP 353288U JP 353288 U JP353288 U JP 353288U JP H0628665 Y2 JPH0628665 Y2 JP H0628665Y2
- Authority
- JP
- Japan
- Prior art keywords
- signal
- temperature
- output
- pressure
- pressure sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 238000010586 diagram Methods 0.000 description 8
- 239000013078 crystal Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000009499 grossing Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Measuring Fluid Pressure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP353288U JPH0628665Y2 (ja) | 1988-01-14 | 1988-01-14 | 半導体圧力センサの温度補償回路 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP353288U JPH0628665Y2 (ja) | 1988-01-14 | 1988-01-14 | 半導体圧力センサの温度補償回路 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01107945U JPH01107945U (enrdf_load_stackoverflow) | 1989-07-20 |
JPH0628665Y2 true JPH0628665Y2 (ja) | 1994-08-03 |
Family
ID=31205248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP353288U Expired - Lifetime JPH0628665Y2 (ja) | 1988-01-14 | 1988-01-14 | 半導体圧力センサの温度補償回路 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0628665Y2 (enrdf_load_stackoverflow) |
-
1988
- 1988-01-14 JP JP353288U patent/JPH0628665Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH01107945U (enrdf_load_stackoverflow) | 1989-07-20 |
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