JPH06268029A - Manufacture of heating tool for thermocompression bonding - Google Patents

Manufacture of heating tool for thermocompression bonding

Info

Publication number
JPH06268029A
JPH06268029A JP4894593A JP4894593A JPH06268029A JP H06268029 A JPH06268029 A JP H06268029A JP 4894593 A JP4894593 A JP 4894593A JP 4894593 A JP4894593 A JP 4894593A JP H06268029 A JPH06268029 A JP H06268029A
Authority
JP
Japan
Prior art keywords
head
tool
ceramics
bonding
heating tool
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4894593A
Other languages
Japanese (ja)
Inventor
Kazuma Miura
一真 三浦
Ichiro Miyano
一郎 宮野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP4894593A priority Critical patent/JPH06268029A/en
Publication of JPH06268029A publication Critical patent/JPH06268029A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To eliminate adhesion of melted material and contamination on the surface of tool, which are to be the troubles at the time of bonding. CONSTITUTION:Head holding parts 4 are arranged on the both sides of a ceramic head 6, namely, the bonding part of a heating tool main body is formed in a recessed shape. Alloy foil to be used as soldering material is arranged in the groove of the main body bonding part and is used for the bonding with the head. Melted material adhesion on the bonding plane and the reaction of the bonding plane are eliminated by replacing the head to ceramics.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】熱圧着法とは、加熱と加圧を同時
に行う接続方法であり、半導体チップのリードとリード
フレームとの接続、半導体装置の基板への接続等に用い
られている方法である。本発明は、ヘッドの部分がセラ
ミックスで構成される熱圧着用加熱ツールの製造方法に
関する。
[Industrial application] The thermocompression bonding method is a connection method in which heating and pressurization are performed at the same time, and is used for connecting semiconductor chip leads and lead frames, connecting semiconductor devices to a substrate, etc. Is. The present invention relates to a method for manufacturing a heating tool for thermocompression bonding in which a head portion is made of ceramics.

【0002】[0002]

【従来の技術】熱圧着法は、2種の金属を融点以下の温
度に加熱・加圧しながら接続させるいわゆる固相接続、
あるいは共晶接続・はんだ接続といった液相接続に利用
されている。
2. Description of the Related Art Thermocompression bonding is a so-called solid phase connection in which two kinds of metals are connected to each other while being heated and pressurized to a temperature below their melting points.
Alternatively, it is used for liquid phase connection such as eutectic connection and solder connection.

【0003】液相接続の場合、ツールのヘッド部分の接
続面と融体との濡れ性、反応性が問題になる。つまり、
融体との濡れ性・反応性が高い場合、融体とヘッド部分
とが反応し、ツールの接続面が融体で汚染される。その
ため、接続位置によりツールヘッド接続面の温度や加圧
力が不均一になるなどの弊害が生ずる。また、これは接
続強度のばらつきや接続不良の原因となる。したがっ
て、ツールのヘッド部分を定期的に研磨する必要があ
る。
In the case of liquid phase connection, the wettability and the reactivity between the connection surface of the head portion of the tool and the melt become problems. That is,
When the wettability and reactivity with the melt are high, the melt reacts with the head portion, and the connecting surface of the tool is contaminated with the melt. Therefore, depending on the connecting position, the temperature of the tool head connecting surface and the applied pressure may be non-uniform. In addition, this causes variation in connection strength and connection failure. Therefore, it is necessary to periodically grind the head portion of the tool.

【0004】現状では、融体との濡れ・反応性の低い金
属材料を用いたり、ヘッド接続面に蒸着法(PVD,CVD)
などにより薄膜を形成させたものが熱圧着用加熱ツール
として用いられている。
At present, a metal material having low wettability and reactivity with the melt is used, or a vapor deposition method (PVD, CVD) is used for the head connection surface.
A thin film formed by the above method is used as a heating tool for thermocompression bonding.

【0005】[0005]

【発明が解決しようとする課題】融体付着によるツール
ヘッドの接続面の汚れを防止するためには、融体との濡
れ性の悪い接続面にすればよい。例えば、モリブデン合
金は、ろう材との濡れ性・反応性の低い材料であり、ツ
ール材料として利用されている。また、焼結助材を含ん
だダイヤモンドを接続面に蒸着させた加熱ツールも使用
されている。しかしながら、モリブデン合金は濡れの悪
い材料ではあるけれども、金属材料であるため、多少の
融体との反応について考慮する必要がある。焼結ダイヤ
モンドの場合は含まれる助材が融体と反応することが考
えられる。したがって、接続回数が多くなった場合、こ
れらの加熱ツールの接続面は、融体付着物あるいは反応
物による汚染が進行するため、研磨等により定期的にヘ
ッド部接続面の汚れを除去する必要があった。このた
め、最近では金属との反応性・濡れ性の悪いセラミック
スの薄膜をヘッド接続面の形成させた加熱ヘッドが考え
られ実際に採用されている。さらには、加熱ツール全体
をセラミックス化する方法も考えられる。しかし、これ
らの方法ではコストの面で問題があるように思われる。
In order to prevent the tool head connection surface from being contaminated due to the adhesion of the melt, the connection surface having poor wettability with the melt may be used. For example, molybdenum alloy is a material having low wettability / reactivity with a brazing material and is used as a tool material. A heating tool in which diamond containing a sintering aid is vapor-deposited on the connection surface is also used. However, although molybdenum alloy is a material having poor wettability, since it is a metallic material, it is necessary to consider some reaction with the melt. In the case of sintered diamond, the auxiliary material contained may react with the melt. Therefore, when the number of times of connection increases, the connection surfaces of these heating tools are contaminated by the melt deposits or the reaction products, so it is necessary to regularly remove the dirt on the head connection surface by polishing or the like. there were. Therefore, recently, a heating head in which a head connection surface is formed of a ceramic thin film having poor reactivity and wettability with a metal has been considered and actually used. Furthermore, a method of converting the entire heating tool into ceramics is also conceivable. However, these methods appear to be costly.

【0006】以上の問題を解決するために、発明者は加
熱ツールの本体は金属とし、ヘッドの部分にろう材との
濡れ性・反応性の悪いセラミックスを用い、このヘッド
の部分と本体とを接合させる手法(図1〜3参照)によ
る加熱ツールの製造方法について発明した。
In order to solve the above problems, the inventor of the present invention made the main body of the heating tool a metal, and used a ceramic having poor wettability / reactivity with the brazing material in the head portion, and the head portion and the main body were connected to each other. The inventor has invented a method for manufacturing a heating tool by a joining method (see FIGS. 1 to 3).

【0007】[0007]

【課題を解決するための手段】本発明では、金属である
ツール本体とセラミックスであるヘッド部分を接合する
ための手段として、真空加熱装置並びに図4に示すよう
な固定治具を用い、銀ろう(Ag-Cu-Ti),銅ろう(Cu-T
i)合金箔を用いてツール本体とヘッドを接合させる手
法を採用した。
In the present invention, as a means for joining a tool body made of metal and a head portion made of ceramics, a vacuum heating device and a fixing jig as shown in FIG. (Ag-Cu-Ti), Copper braze (Cu-T
i) We adopted a method of joining the tool body and head using alloy foil.

【0008】[0008]

【作用】ろう付用合金箔による接合法は、平衡状態図に
おける共晶点、すなわち、合金が固相から液相になるの
を利用して接合する方法である(共晶接合法)。なお、
共晶温度はそれぞれの金属の温度よりも低いため、比較
的低い温度での接合が可能であり、しかも、簡便法で信
頼性の高い接合法である。この方法を用いることによ
り、金属製の加熱ツールの一部(ヘッドの部分)をセラ
ミックスに置き換えることができる。
The joining method using the brazing alloy foil is a method of joining by utilizing the eutectic point in the equilibrium diagram, that is, the alloy changes from the solid phase to the liquid phase (eutectic joining method). In addition,
Since the eutectic temperature is lower than the temperature of each metal, it is possible to join at a relatively low temperature, and the joining method is simple and highly reliable. By using this method, a part of the metal heating tool (head part) can be replaced with ceramics.

【0009】[0009]

【実施例】加熱ツール本体の材料としてはインコネル,
モネル等のニッケル基耐熱合金やインバー,コバール等
の450℃まで熱膨張係数の低い金属、熱伝導のすぐれた
アルミニウム,銅基合金が考えられる。一方、ヘッド材
料はアルミナ(Al2O3),ジルコニア(ZrO2)といった
酸化物系セラミックス、あるいは窒化アルミニウム(Al
N),窒化珪素(Si3N4),炭化珪素(SiC)といった非
酸化物系セラミックスが考えられる。
[Example] As a material of the heating tool body, Inconel,
A nickel-based heat-resistant alloy such as Monel, a metal with a low coefficient of thermal expansion up to 450 ° C such as Invar or Kovar, an aluminum with excellent thermal conductivity, or a copper-based alloy is considered. On the other hand, the head material is oxide ceramics such as alumina (Al 2 O 3 ), zirconia (ZrO 2 ), or aluminum nitride (Al
Non-oxide ceramics such as N), silicon nitride (Si 3 N 4 ) and silicon carbide (SiC) are considered.

【0010】金属をセラミックスとの接合強度は、両者
の熱膨張係数差により冷却中に生ずる残留熱応力並びに
ろう材とセラミックスとの濡れ性で決まる。酸化物系セ
ラミックスと非酸化物系セラミックスを比較した場合酸
化物系セラミックスの方が熱膨張係数が高く、ろう材と
の濡れ性も優れている。したがって、ヘッド材料は酸化
物系セラミックスの方が適当であり、汎用性を考慮する
と、アルミナが妥当である。本体に用いる金属材料につ
いては、ツールの実際の使用状況を考慮し選定すればよ
い。
The bonding strength between metal and ceramics is determined by the residual thermal stress generated during cooling due to the difference in thermal expansion coefficient between the two and the wettability between the brazing material and the ceramics. When oxide-based ceramics and non-oxide-based ceramics are compared, oxide-based ceramics have a higher coefficient of thermal expansion and better wettability with brazing filler metal. Therefore, oxide-based ceramics is more suitable as the head material, and alumina is more appropriate in consideration of versatility. The metal material used for the main body may be selected in consideration of the actual usage status of the tool.

【0011】加熱ツール本体とヘッドとの接合は以下の
手順で行う。まず、加熱ツールの本体,ろう材(合金
箔),ヘッド4を有機溶媒で洗浄する。次に図4に示す
治具の底板9に設けたツール本体と同型状の溝を利用し
て本体を固定する。それから、ヘッド支持用板9を通す
ためのアルミナ保護管10を治具の底板11の4カ所に
設けた穴に挿入する。次に凹形の接合部の溝部分にろう
材である合金箔を入れ、その上にヘッドを入れ、さらに
アルミナ保護管10にヘッド支持用板を通し、支持用板
に設けたヘッド位置合わせ用の溝にセラミックスヘッド
を入れて固定させる。最後にツール固定済みの治具を真
空加熱装置内にセットし、真空雰囲気で所定の条件で接
合させる。本発明では、金属側の接合形状を凹、すなわ
ち、セラミックスヘッドの両側にヘッド支持部4を設け
ることにより、本体とセラミックスヘッドとの位置ずれ
を防止できた。また、接合時に生ずる過剰の融体が、ヘ
ッドと本体の側面とのわずかな隙間をはい上がるため、
側面部分も接合に寄与している。さらに、接合後の冷却
による金属の収縮により、ヘッドは両側から圧力を受
け、締め付けられることにより機械的な接合にも寄与す
るものと思われる。したがって、図1の太線で示した部
分5が接合領域となる。
The heating tool main body and the head are joined by the following procedure. First, the main body of the heating tool, the brazing material (alloy foil), and the head 4 are washed with an organic solvent. Next, the main body is fixed using a groove having the same shape as the tool main body provided on the bottom plate 9 of the jig shown in FIG. Then, an alumina protective tube 10 for passing the head supporting plate 9 is inserted into the holes provided at four positions of the bottom plate 11 of the jig. Next, put an alloy foil, which is a brazing material, in the groove portion of the concave joint, put a head on it, and further pass a head support plate through the alumina protection tube 10 for head alignment provided on the support plate. Insert the ceramics head into the groove and fix it. Finally, the jig to which the tool has been fixed is set in a vacuum heating device and bonded in a vacuum atmosphere under predetermined conditions. In the present invention, the metal-side joining shape is concave, that is, the head supporting portions 4 are provided on both sides of the ceramics head, so that the displacement between the main body and the ceramics head can be prevented. In addition, since the excessive melt generated at the time of joining rises up the slight gap between the head and the side surface of the main body,
The side surface also contributes to the joining. Furthermore, it is considered that the head receives pressure from both sides due to the contraction of the metal due to cooling after joining, and the head is also tightened to contribute to mechanical joining. Therefore, the portion 5 shown by the thick line in FIG. 1 becomes the joining region.

【0012】合金箔は、セラミックスと比較的よく濡れ
る銀ろう(銀と銅との共晶合金、Ag-28wt%Cu)に濡れ
・反応性を促進させるために少量のチタンを添加したも
の(例えば、Ag-26wt%Cu-5wt%Ti)を用いる。箔の厚
さは100μm程度でよい。このときの接合温度はこのろう
材の融点は780℃であることを考慮し850℃とする。接合
は10~5torr以上の真空中で行うのが望ましいけれども、
不活性ガス雰囲気でも接合は可能である。
The alloy foil is a silver braze (eutectic alloy of silver and copper, Ag-28 wt% Cu) which is relatively well wetted with ceramics, to which a small amount of titanium is added in order to promote wetting and reactivity (for example, , Ag-26 wt% Cu-5 wt% Ti) is used. The thickness of the foil may be about 100 μm. The joining temperature at this time is set to 850 ° C. considering that the melting point of this brazing material is 780 ° C. Although it is desirable to perform bonding in a vacuum of 10 to 5 torr or more,
Bonding is possible even in an inert gas atmosphere.

【0013】銀ろう系合金箔を用いて接合させた場合、
接合界面にチタン濃度の高い反応層並びに銀と銅との共
晶組織がみられる。接合は主に界面に生成される反応層
により行われる。例えば、用いるセラミックスがアルミ
ナのような酸化物系セラミックスの場合は界面にチタン
酸化物が主に界面に形成され、窒化珪素のような非酸化
物系セラミックスの場合はチタン窒化物が主に形成され
る。
When joined by using a silver brazing alloy foil,
A reaction layer with a high titanium concentration and a eutectic structure of silver and copper are seen at the joint interface. Bonding is mainly performed by the reaction layer formed at the interface. For example, when the ceramic used is oxide-based ceramics such as alumina, titanium oxide is mainly formed at the interface, and when it is non-oxide-based ceramics such as silicon nitride, titanium nitride is mainly formed. It

【0014】本方式による接合は図4に示した固定用治
具と真空加熱装置があれば容易に行うことができる。ま
た、加熱スペースを拡充したり、複数個の接続用ツール
の搭載可能な固定用治具を用いることによって、生産性
を上げることもできる。
The joining according to this method can be easily performed by using the fixing jig and the vacuum heating device shown in FIG. In addition, productivity can be increased by expanding the heating space and using a fixing jig that can mount a plurality of connecting tools.

【0015】ろう材による接合の場合、接合部の耐熱性
はろう材の融点で決まる。一般的には融点の50〜60%の
温度までは使用可能であると考えられる。したがって、
銀系ろう材の場合では、450℃の温度域まで耐えられる
ものと思われる。しかし、熱伝導の関係より実際のヘッ
ド先端の温度は接合部の温度よりも低くなるため、ろう
材に用いる合金箔の選定に十分配慮する必要がある。接
続温度が400℃以上の場合には銅系のろう材(例えば、C
u-28wt%Ti,融点880℃)などにする必要がある。
In the case of joining with a brazing material, the heat resistance of the joint is determined by the melting point of the brazing material. Generally, it can be used up to a temperature of 50 to 60% of the melting point. Therefore,
In the case of silver brazing material, it seems that it can withstand temperatures up to 450 ° C. However, since the actual temperature at the tip of the head is lower than the temperature at the joint due to heat conduction, it is necessary to give due consideration to the selection of the alloy foil used for the brazing material. If the connection temperature is 400 ° C or higher, copper brazing material (for example, C
u-28wt% Ti, melting point 880 ℃).

【0016】[0016]

【発明の効果】セラミックスは金属材料との濡れの悪い
材料である。特に、低融点金属並びにその合金とはほと
んど濡れない。したがって、はんだなどのような液相接
続に本発明の加熱ツールを用いた場合、従来の加熱ツー
ルのような接続面の汚れの問題はほとんど解消され、接
続面の研磨等を行う必要がなくなり、加熱ツールの長期
間の連続使用が可能となる。
EFFECTS OF THE INVENTION Ceramics are materials that have poor wettability with metallic materials. In particular, it is hardly wet with the low melting point metal and its alloy. Therefore, when the heating tool of the present invention is used for liquid phase connection such as soldering, the problem of contamination of the connection surface like the conventional heating tool is almost solved, and it is not necessary to polish the connection surface. The heating tool can be used continuously for a long period of time.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の熱圧着用加熱ツールの斜視図である。FIG. 1 is a perspective view of a heating tool for thermocompression bonding according to the present invention.

【図2】熱圧着加熱ツールの正面図である。FIG. 2 is a front view of a thermocompression bonding heating tool.

【図3】熱圧着加熱ツールの側面図である。FIG. 3 is a side view of a thermocompression bonding heating tool.

【図4】ツール本体/ヘッド接合用治具の正面図であ
る。
FIG. 4 is a front view of a tool body / head joining jig.

【図5】ツール本体/ヘッド接合用治具の側面図であ
る。
FIG. 5 is a side view of a tool body / head joining jig.

【符号の説明】[Explanation of symbols]

1…熱圧着装置のプッシュロッド部の穴に装着するため
のシリンダー、2…カートリッジヒーター挿入穴、3…
カートリッジヒーター支持用ネジ穴、4…セラミックス
ヘッド支持部、5…本体とセラミックスヘッドとの接合
部分、6…セラミックスヘッド、7…温度調節計用熱電
対挿入穴、8…温度計測用熱電対挿入穴、9…ヘッド支
持用板、10…アルミナ保護管、11…ツール本体位置
決め用底板、12…アルミナ保護管を通すための穴。
1 ... Cylinder for mounting in the hole of the push rod part of the thermocompression bonding device, 2 ... Cartridge heater insertion hole, 3 ...
Cartridge heater supporting screw holes, 4 ... Ceramics head supporting portion, 5 ... Joining portion between main body and ceramics head, 6 ... Ceramics head, 7 ... Thermocouple insertion hole for temperature controller, 8 ... Thermocouple insertion hole for temperature measurement , 9 ... Head support plate, 10 ... Alumina protective tube, 11 ... Tool body positioning bottom plate, 12 ... Hole for passing alumina protective tube.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】加熱ツールの本体に相当する金属とヘッド
に相当するセラミックスを活性金属を含むろう材で接合
させることを特徴とする熱圧着用加熱ツールの製造方
法。
1. A method of manufacturing a heating tool for thermocompression bonding, comprising joining a metal corresponding to a main body of the heating tool and a ceramics corresponding to a head with a brazing material containing an active metal.
JP4894593A 1993-03-10 1993-03-10 Manufacture of heating tool for thermocompression bonding Pending JPH06268029A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4894593A JPH06268029A (en) 1993-03-10 1993-03-10 Manufacture of heating tool for thermocompression bonding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4894593A JPH06268029A (en) 1993-03-10 1993-03-10 Manufacture of heating tool for thermocompression bonding

Publications (1)

Publication Number Publication Date
JPH06268029A true JPH06268029A (en) 1994-09-22

Family

ID=12817418

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4894593A Pending JPH06268029A (en) 1993-03-10 1993-03-10 Manufacture of heating tool for thermocompression bonding

Country Status (1)

Country Link
JP (1) JPH06268029A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5958270A (en) * 1995-09-02 1999-09-28 Lg Semicon Co., Ltd. Wire bonding wedge tool with electric heater
WO2002041385A1 (en) * 1999-03-16 2002-05-23 Toray Engineering Co., Ltd. Tool for thermo-compression-bonding chips, and chip packaging device having the same
US6821381B1 (en) 1999-03-16 2004-11-23 Toray Engineering Co., Ltd. Tool for thermo-compression-bonding chips, and chip packaging device having the same
CN103506753A (en) * 2012-06-20 2014-01-15 苏州工业园区赫光科技有限公司 Automatic hot press

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5958270A (en) * 1995-09-02 1999-09-28 Lg Semicon Co., Ltd. Wire bonding wedge tool with electric heater
WO2002041385A1 (en) * 1999-03-16 2002-05-23 Toray Engineering Co., Ltd. Tool for thermo-compression-bonding chips, and chip packaging device having the same
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