JPH06260364A - Chip component - Google Patents

Abstract

PURPOSE:To obtain chip components with low residual inductance by making folded construction so as to shorten the current path in a chip element, allowing pick-up terminals to be closer, divided, multipled, and arranged alternately, and adopting a cross penetration construction. CONSTITUTION:Insulation sheets 1 are bonded on both surfaces of a string of inductor sheets 2 and 3 with internal electrodes. Then, the upper both surfaces of T-shaped internal electrodes 4 and 5 are made to expose on its side faces, and they are piled to obtain a complete chip capacitor. Two pairs of external electrodes 7, 8 and 9, 10 communicating with internal electrodes 3 and 4 are close to each other, thereby shortening the current path in the inside thereof. Thus, since the current flows in the inside of element, swiftly, folding, in an AC state, and symmetrically while being divided and dispersed alternately, residual inductance can be reduced 1/2 to 1/5 than that of the conventional chip components and be also complexed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip component having a low residual inkance and a composite structure.

[0002]

2. Description of the Related Art The structure of chip parts such as capacitors and varistors is basically one in which dielectrics with internal electrodes exposed on one side face are alternately led out to the opposite side face and stacked on top of each other. Has become. FIG. 8A shows the internal structure of a conventional chip capacitor or the like.
Reference numeral 1 denotes an insulating sheet for stacking the dielectric sheets 2 and 3 with internal electrodes and arranging them on both sides, and 74 and 75 are internal electrodes exposed at one end of each. 76, 7
Reference numeral 7 is an external electrode derived from each internal electrode.
FIG. 8 (b) is a perspective view of the finished product (73).
(C) is an equivalent circuit. The main use of these was electronic equipment, and their main purpose was to make them smaller, so they rapidly spread.
Compared to conventional leaded parts, it is leadless, compact, and has a residual inductance of 1/2 to 1/1 compared to conventional leaded parts.
The value was as small as 5, the usable frequency range was expanded at the same time, and the value was sufficient for practical use.

However, due to the expansion of applications and the spread of chips, relatively large-sized components are required to be surface mounted (SMD). However, in large parts, the residual inductance remains in proportion to the size, so naturally expansion of the usable frequency range is also limited, and leadless is the main effect, which is not sufficient. There is a new problem that the resulting residual inductance is too large.

On the other hand, although the conventional high frequency can be used satisfactorily, in order to cope with the higher frequency, it is required to expand the usable frequency also in the small chip parts. In particular, in most of the conventional shapes shown in FIG. 8, the internal electrodes are led out to the opposite short sides of the rectangular chip, and the residual inductance is large. Even if the lead-out of the internal electrode is moved to the opposite long side, it is reduced by about 1/2, and the problem that it cannot be said to be sufficient is becoming apparent. It is known that these are equivalent to the inductance of a single conductor of rectangular cross section.

As digitalization progresses with higher frequencies, noise countermeasures and surge countermeasures are becoming important. Although conventional chip parts such as capacitors, inductors, varistors, etc. have been combined and devised and used, the problem that the conventional structure is not sufficient to cope with surges and the spread of noise levels has also emerged. It is becoming more common.

[0006]

The problem to be solved is that the conventional structure and dimensions are insufficient to reduce the residual inductance.

[0007]

SUMMARY OF THE INVENTION According to the present invention, in addition to shortening a current path flowing in a chip element and providing a folded structure, lead terminals are arranged close to each other, divided into a plurality, and arranged alternately. Another purpose is to realize a low residual inductance chip component by adopting a cross-through structure. In addition to providing another internal electrode, a composite chip component in which the internal electrode is divided at the same time is realized. Further, two kinds of internal electrodes are made orthogonal to each other and penetrated on both sides to be taken out to obtain an interpenetrating chip component and a composite interpenetrating chip component with reduced residual inductance.
Its main feature is the realization of multi-functional chip components that employ distributed inductance shapes, resistors, etc.

[0008]

1 (a) is an exploded perspective view of a multilayer chip capacitor according to one embodiment of the present invention, in which an insulating sheet 1 is attached to both sides of a series of a plurality of dielectric sheet with internal electrodes. . Numerals 4 and 5 are the T-shaped internal electrodes having a structure in which both upper ends of the T-shaped electrode are exposed at the side surfaces. Figure 1
(B) is a perspective view of a completed chip capacitor (6) in which these are stacked. Reference numerals 7, 8 and 9, 10 denote two sets of external electrodes that are electrically connected by the internal electrodes. As a result, as compared with the conventional structure, the two pairs of external electrodes are close to each other, and the current path flowing through the internal electrodes is shortened, so that the residual inductance is reduced. Although not shown, it is also possible to expose the upper portion of the T-shaped internal electrode and share it with the conventional type.
FIG. 1C is an equivalent circuit diagram, and C is a capacitor. FIG. 2 shows another embodiment in which another capacitor element is added to FIG. 1 to form a composite, and 11 and 12 are added internal electrodes. FIG. 2B is a perspective view of the finished product (13). Reference numerals 20 and 21 are external electrodes of the additional capacitor element. FIG. 2C is an equivalent circuit diagram, in which Co
Is a composite capacitor. Others are the same as in FIG.

FIG. 3A shows another embodiment, which is shown in FIG.
The exposed portion of the internal electrode of is provided in a diagonal position.
2 and 3 are dielectric sheets, 24 and 25 are internal electrodes thereof, and FIG. 3B is a perspective view of the finished product (23). Two
Reference numerals 6, 27 and 28, 29 denote external electrodes that are electrically connected to the internal electrodes. This is because the current flows across the element so that the residual inductance is reduced. FIG. 3C is an equivalent circuit diagram thereof. Others are the same as those in FIGS. FIG. 4 is a development example in which another capacitor element is added to the embodiment of FIG. Reference numerals 31 and 32 are additional internal electrodes. Figure 4 (b) shows the finished product (2
3). Reference numerals 40 and 41 are external electrodes of the added capacitor element, and FIG. 4C is an equivalent circuit diagram thereof. Others are the same as those in FIGS.

FIG. 5A shows another embodiment of the present invention.
The internal electrode 44 of the dielectric 2 and the internal electrode 45 of the same 3 are exposed on the opposite side surfaces and led out by the external electrodes 46, 47 and 48, 49, respectively. Since the internal electrodes 44 and 45 are electrically connected at both ends facing each other, it is a major feature that they have a mutually penetrating structure, and the respective residual inductances can be reduced. FIG. 5B is a perspective view of a completed product (43) of the multilayer interpenetrating capacitor chip. FIG. 5C is an equivalent circuit diagram thereof, and C shows a capacitor penetrating each other. Further, a through-type LC distributed filter chip, a CR composite decoupling chip component or the like having the same characteristics can be obtained by using one of the internal electrodes 44 and 45 to have a distributed inductance shape or a resistor. Others are the same as those in FIGS. FIG. 6 is a development example of the embodiment of FIG. 5, which is an embodiment in which the internal electrode 44 of FIG. 54a,
54b are internal electrodes divided into two parts, respectively.
(B) is a perspective view of the finished product (53) of this laminated chip component. FIG. 6C is an equivalent circuit diagram thereof, and C shows two capacitors, which are mutually penetrating. Others are the same as those in FIGS.

FIG. 7A shows another embodiment of the present invention.
Each of the dielectric sheets 2 and 3 has four exposed internal electrodes. The opposing inner electrodes are alternately exposed and arranged on one side surface. Reference numerals 64 and 65 denote internal electrodes which are provided by exposing four portions respectively. FIG. 7B shows a finished product (63) of the chip part.
Reference numerals 66 to 73 are external electrodes, which are derived by alternately arranging opposing internal electrodes, and even-numbered and odd-numbered comers are conducted by the internal electrodes. Reducing the residual inductance by referring to the mounting wiring of the chip component. Is intended. Figure 7
(C) is the equivalent circuit diagram. Others are the same as those in FIGS.

[0012]

As described above, in the chip component of the present invention, the exposed portion of the internal electrode, (external electrode) is brought out to the side surface by bringing one or more sets close to each other, so that the current inside the element is short and the element is folded back. To reduce the residual inductance to 1/2 to 1/5 of that of the conventional chip component by flowing through, crossing, dividing and alternately distributing to the target, and combining them. Has a major feature. Further, the internal electrodes facing each other are led out to both side surfaces to form an interpenetrating chip component, and the residual inductance is 1/5 to 1/1 as compared with the conventional chip component.
Another feature is to reduce it to zero. In addition to dividing the internal electrodes, it is an additional feature that a composite chip component or the like can be obtained at the same time by forming one of the internal electrodes into a distributed inductance shape and a resistance element. In this way, the residual inductance of chip components such as capacitors and varistors can be significantly reduced, and the fact that they can be combined has the great advantage of increasing the frequency of electronic circuits and expanding the applications essential for noise suppression.

[Brief description of drawings]

1 and 2 are explanatory views showing one embodiment of the present invention and its combined development.

3 and 4 are explanatory views showing another embodiment of the present invention and its combined development.

5 and 6 are explanatory views showing another embodiment of the present invention and its combined development.

FIG. 7 is an explanatory view showing another embodiment of the present invention.

FIG. 8 is an explanatory diagram showing a structure of a conventional chip capacitor.

[Explanation of symbols]

1 Insulation sheet 2, 3 --- Dielectric sheet 4, 5, 14, 15, 24, 25, 34, 35, 44,
45, 54 (a), 54 (b), 55, 64, 65, 7
4, 75 ──── Internal electrodes 6, 13, 23, 33, 43, 53, 63, 73 ──
--- Chip parts finished products 7, 8, 9, 10, 16, 17, 18, 19, 20, 2
1, 26, 27, 28, 29, 36, 37, 38 3
9, 40, 41, 46, 47, 48, 49, 56, 5
7, 58, 59, 60, 61, 66, 67, 68, 6
9, 71 72, 73, 76, 77 ───── External electrodes

Claims (2)

[Claims] 1. In a chip component such as a capacitor or a varistor in which dielectrics with electrodes are laminated, one or more sets of internal electrodes are exposed close to at least one side surface, and external electrodes are provided to lead them out. A chip component with a short current path and a folded structure and another internal electrode separate from these main internal electrodes are provided, and one external electrode is provided on a side surface different from the external electrode surface described above. Composite type chip component that consists of the above capacitors 2. A capacitor, a varistor, etc., in which dielectrics with electrodes are stacked, an interpenetrating chip part in which internal electrodes are exposed on opposite side surfaces, a coil element in which one of the internal electrodes has a distributed inductance shape, or An interpenetrating composite chip part that integrates resistive elements such as resistive coatings. A composite interpenetrating chip component in which each of the interpenetrating internal electrodes and the external electrodes is divided into two or more.