JPH0625960Y2 - ボンディングツール - Google Patents

ボンディングツール

Info

Publication number
JPH0625960Y2
JPH0625960Y2 JP1988030140U JP3014088U JPH0625960Y2 JP H0625960 Y2 JPH0625960 Y2 JP H0625960Y2 JP 1988030140 U JP1988030140 U JP 1988030140U JP 3014088 U JP3014088 U JP 3014088U JP H0625960 Y2 JPH0625960 Y2 JP H0625960Y2
Authority
JP
Japan
Prior art keywords
bonding tool
semiconductor element
bonding
insulating film
flexible insulating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988030140U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01133736U (enrdf_load_stackoverflow
Inventor
甲午 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP1988030140U priority Critical patent/JPH0625960Y2/ja
Publication of JPH01133736U publication Critical patent/JPH01133736U/ja
Application granted granted Critical
Publication of JPH0625960Y2 publication Critical patent/JPH0625960Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
JP1988030140U 1988-03-07 1988-03-07 ボンディングツール Expired - Lifetime JPH0625960Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988030140U JPH0625960Y2 (ja) 1988-03-07 1988-03-07 ボンディングツール

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988030140U JPH0625960Y2 (ja) 1988-03-07 1988-03-07 ボンディングツール

Publications (2)

Publication Number Publication Date
JPH01133736U JPH01133736U (enrdf_load_stackoverflow) 1989-09-12
JPH0625960Y2 true JPH0625960Y2 (ja) 1994-07-06

Family

ID=31254939

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988030140U Expired - Lifetime JPH0625960Y2 (ja) 1988-03-07 1988-03-07 ボンディングツール

Country Status (1)

Country Link
JP (1) JPH0625960Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPH01133736U (enrdf_load_stackoverflow) 1989-09-12

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