JPH01133736U - - Google Patents
Info
- Publication number
- JPH01133736U JPH01133736U JP1988030140U JP3014088U JPH01133736U JP H01133736 U JPH01133736 U JP H01133736U JP 1988030140 U JP1988030140 U JP 1988030140U JP 3014088 U JP3014088 U JP 3014088U JP H01133736 U JPH01133736 U JP H01133736U
- Authority
- JP
- Japan
- Prior art keywords
- bonding tool
- approximately
- insulating film
- semiconductor element
- item
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 229910052742 iron Inorganic materials 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988030140U JPH0625960Y2 (ja) | 1988-03-07 | 1988-03-07 | ボンディングツール |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988030140U JPH0625960Y2 (ja) | 1988-03-07 | 1988-03-07 | ボンディングツール |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01133736U true JPH01133736U (enrdf_load_stackoverflow) | 1989-09-12 |
| JPH0625960Y2 JPH0625960Y2 (ja) | 1994-07-06 |
Family
ID=31254939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988030140U Expired - Lifetime JPH0625960Y2 (ja) | 1988-03-07 | 1988-03-07 | ボンディングツール |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0625960Y2 (enrdf_load_stackoverflow) |
-
1988
- 1988-03-07 JP JP1988030140U patent/JPH0625960Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0625960Y2 (ja) | 1994-07-06 |