JPH06232585A - Shielding apparatus - Google Patents

Shielding apparatus

Info

Publication number
JPH06232585A
JPH06232585A JP35009093A JP35009093A JPH06232585A JP H06232585 A JPH06232585 A JP H06232585A JP 35009093 A JP35009093 A JP 35009093A JP 35009093 A JP35009093 A JP 35009093A JP H06232585 A JPH06232585 A JP H06232585A
Authority
JP
Japan
Prior art keywords
shield
side wall
circuit board
electronic components
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP35009093A
Other languages
Japanese (ja)
Inventor
Masato Tanaka
正人 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP35009093A priority Critical patent/JPH06232585A/en
Publication of JPH06232585A publication Critical patent/JPH06232585A/en
Pending legal-status Critical Current

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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

PURPOSE:To obtain a sufficient shielding effect for electronic components, by a light and thin shielding apparatus. CONSTITUTION:Certain sections of a flexible board 10 mounted with electronic components 12 are extended respectively to predetermined places. On the extended sections of the flexible board 10, predetermined shielding patterns 14A-14D, 15 are so formed that a mounting section 13 for the electronic components 12 can be covered therewith. Thereby, a sufficient shielding effect for the electronic components can be obtained with a simple configuration.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明はシールド装置に関し、特
にフレキシブル基板を用いた回路基板の所望の部分をシ
ールドするものに適用して好適なものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a shield device, and is particularly suitable for application to shield a desired portion of a circuit board using a flexible board.

【0002】[0002]

【従来の技術】従来、電子部品が実装された回路基板を
シールドするため、いわゆるシールドボツクスが用いら
れている。すなわち、図3に示すように回路基板1上に
は、例えば集積回路やチツプ部品でなる抵抗及びコンデ
ンサ等の電子部品2が表面実装されて、さらにこの電子
部品2を覆うようにシールドボツクス3が取り付けられ
ている。なおこのシールドボツクス3は、図4に示すよ
うに、箱状の側壁部3Aとその側壁部3Aを覆う形状に
選定された蓋部3Bがそれぞれ導電性の金属板で形成さ
れている。
2. Description of the Related Art Conventionally, a so-called shield box has been used to shield a circuit board on which electronic components are mounted. That is, as shown in FIG. 3, an electronic component 2 such as a resistor and a capacitor which is an integrated circuit or a chip component is surface-mounted on the circuit board 1, and a shield box 3 is provided so as to cover the electronic component 2. It is installed. As shown in FIG. 4, the shield box 3 has a box-shaped side wall 3A and a lid 3B selected to cover the side wall 3A made of a conductive metal plate.

【0003】このシールドボツクス3の場合、側壁部3
Aの4つの下辺の中央部には、回路基板1の表面上にシ
ールドボツクス3を載置する取付け部4A、4B、4
C、4Dと、その取付け部4A〜4Dの先端に棒状の半
田止め足5A、5B、5C、5Dとが、それぞれ側壁部
3Aと一体成形で形成されている。これにより、このシ
ールドボツクス3の側壁部3Aは回路基板1に穿設され
た取り付け用透孔に、半田止め足5A、5B、5C、5
Dを挿入して半田付けすることにより、電気的及び機械
的に回路基板1上に取り付けるようになされている。
In the case of this shield box 3, the side wall portion 3
At the central portions of the four lower sides of A, mounting portions 4A, 4B, 4 for mounting the shield box 3 on the surface of the circuit board 1 are mounted.
C and 4D, and rod-shaped soldering feet 5A, 5B, 5C and 5D are formed integrally with the side wall portion 3A at the tips of the mounting portions 4A to 4D. As a result, the side wall portion 3A of the shield box 3 is attached to the mounting through hole formed in the circuit board 1, and the solder stopper feet 5A, 5B, 5C, 5
By inserting D and soldering it, it is electrically and mechanically mounted on the circuit board 1.

【0004】またこの側壁部3Aの各側面中央には貫通
孔6A、6B、6C、6Dが穿設されており、蓋部3B
を側壁部3Aに取り付けた状態で、蓋部3Bの各内側面
中央に形成された半球状の突起部7A、7B、7C、7
Dが貫通孔6A〜6Dに係合し、これにより蓋部3Bを
側壁部3Aに被せた状態で係止し得るようになされてい
る。
Further, through holes 6A, 6B, 6C and 6D are formed at the center of each side surface of the side wall portion 3A, and the lid portion 3B is formed.
Attached to the side wall 3A, hemispherical projections 7A, 7B, 7C, 7 formed at the center of each inner surface of the lid 3B.
D engages with the through holes 6A to 6D so that the lid 3B can be locked with the side wall 3A covered.

【0005】[0005]

【発明が解決しようとする課題】ところでかかる構成の
シールドボツクス3は大型部材で形成されているため、
重量が増加することを避け得ず、また電子部品2のよう
に表面実装することが困難であり、その分実装するため
の工程が必要になる問題があつた。またシールドボツク
ス3自体を、回路基板1上に半田付けで取り付けるよう
になされているため、蓋部3Bを取り外しても回路基板
1上の測定や電子部品の交換が困難であり、使い勝手の
点で未だ不十分であつた。
By the way, since the shield box 3 having such a structure is formed of a large member,
It is unavoidable that the weight is increased, and it is difficult to perform surface mounting like the electronic component 2, and there is a problem that a step for mounting is required accordingly. Further, since the shield box 3 itself is mounted on the circuit board 1 by soldering, it is difficult to measure the circuit board 1 or replace the electronic components even if the lid 3B is removed, which is convenient. It was still inadequate.

【0006】また特に電子部品2をフレキシブル基板で
なる回路基板に実装するような場合において、上述のよ
うなシールドボツクス3を用いると、軽量かつ薄型で柔
軟性を有するフレキシブル基板の利点が全て損なわれる
結果となり、実用上未だ不十分であつた。
Further, when the electronic component 2 is mounted on a circuit board made of a flexible substrate, use of the shield box 3 as described above impairs all advantages of the flexible substrate which is lightweight, thin and flexible. As a result, it was still insufficient for practical use.

【0007】本発明は以上の点を考慮してなされたもの
で、軽量かつ薄型で十分なシールド効果を得るシールド
装置を提案しようとするものである。
The present invention has been made in consideration of the above points, and it is an object of the present invention to propose a shield device which is lightweight and thin and has a sufficient shield effect.

【0008】[0008]

【課題を解決するための手段】かかる課題を解決するた
め本発明においては、所定の電子部品12が実装された
フレキシブル基板でなる回路基板10と、その回路基板
10のフレキシブル基板の一部を延長し、その延長部分
のフレキシブル基板に所定のシールドパターンを形成し
たシールド部材14A〜14D、15とを設け、シール
ド部材14A〜14D、15で回路基板10の所望の部
分13を覆うようにした。
In order to solve such a problem, in the present invention, a circuit board 10 made of a flexible board on which a predetermined electronic component 12 is mounted, and a part of the flexible board of the circuit board 10 are extended. Then, the extended flexible substrate is provided with shield members 14A to 14D, 15 each having a predetermined shield pattern formed thereon, and the desired portions 13 of the circuit board 10 are covered with the shield members 14A to 14D, 15.

【0009】[0009]

【作用】電子部品12が実装されたフレキシブル基板の
一部を延長すると共に、その延長部分のフレキシブル基
板に所定のシールドパターンを形成して、電子部品12
の実装部13を覆うようにしたことにより、簡易な構成
で十分なシールド効果を得ることができる。
The electronic component 12 is formed by extending a part of the flexible substrate on which the electronic component 12 is mounted and forming a predetermined shield pattern on the extended flexible substrate.
By covering the mounting portion 13 of, the sufficient shield effect can be obtained with a simple configuration.

【0010】[0010]

【実施例】以下図面について、本発明の一実施例を詳述
する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

【0011】図1において、10は全体として本発明に
よるシールド装置11が設けられたフレキシブル基板構
成の回路基板を示し、所定の電子部品12が表面実装さ
れている部品実装部13が3方向に延長されている。こ
のフレキシブル基板の延長部分は、図1(A)に示すよ
うに、それぞれ部品実装部13の短辺に接続され所定の
長方形形状の第1及び第2の側壁部14A及び14B
と、部品実装部13の長辺に接続されると共にそれぞれ
接続された第3の側壁部14C、蓋部15及び第4の側
壁部14Dから形成されている。
In FIG. 1, reference numeral 10 generally indicates a circuit board having a flexible board structure provided with a shield device 11 according to the present invention, and a component mounting portion 13 on which a predetermined electronic component 12 is surface-mounted extends in three directions. Has been done. As shown in FIG. 1 (A), the extended portions of the flexible substrate are connected to the short sides of the component mounting portion 13, respectively, and have first and second side wall portions 14A and 14B having a predetermined rectangular shape.
And a third side wall portion 14C, a lid portion 15 and a fourth side wall portion 14D which are connected to the long sides of the component mounting portion 13 and are also connected to each other.

【0012】この第3の側壁部14Cは所定の長方形形
状を有し、また蓋部15は部品実装部13に等しい長方
形形状を有し、さらに第4の側壁部14Dは第3の側壁
部14Cに等しい長方形形状を有するようになされてい
る。なおこの第1〜第4の側壁部14A〜14D及び蓋
部15は、それぞれべた状でなるグランドパターンが形
成されて接続されている。
The third side wall portion 14C has a predetermined rectangular shape, the lid portion 15 has a rectangular shape equal to the component mounting portion 13, and the fourth side wall portion 14D has a third side wall portion 14C. It has a rectangular shape equal to. The first to fourth side wall portions 14A to 14D and the lid portion 15 are connected by forming a solid ground pattern.

【0013】この実施例の場合、第1及び第2の側壁部
14A及び14Bはそれぞれ折り曲げ線a及びbで部品
実装部13側に折り曲げられ、また第3の側壁部14
C、蓋部15及び第4の側壁部14Dはそれぞれ折り曲
げ線c、d及びeで順次部品実装部13側に折り曲げら
れる。
In the case of this embodiment, the first and second side wall portions 14A and 14B are bent toward the component mounting portion 13 side at the bending lines a and b, respectively, and the third side wall portion 14 is bent.
C, the lid portion 15, and the fourth side wall portion 14D are sequentially bent toward the component mounting portion 13 side along bending lines c, d, and e, respectively.

【0014】かくして電子部品12が表面実装されてい
る部品実装部13がグランドパターンが形成された第1
〜第4の側壁部14A〜14D及び蓋部15で覆われ、
全体としてシールド効果を有するシールド装置11が形
成されている。
Thus, the component mounting portion 13 on which the electronic component 12 is surface-mounted has the first pattern on which the ground pattern is formed.
~ Covered by the fourth side wall portions 14A to 14D and the lid portion 15,
A shield device 11 having a shield effect as a whole is formed.

【0015】以上の構成によれば、電子部品12が実装
されたフレキシブル基板の部品実装部13を延長すると
共に、その延長部分のフレキシブル基板にべた状でなる
グランドパターンを形成し、部品実装部13を覆うよう
にしたことにより、軽量かつ部品の高さのみの薄型形状
で十分なシールド効果を得ることができるシールド装置
11を実現できる。
According to the above configuration, the component mounting portion 13 of the flexible substrate on which the electronic component 12 is mounted is extended, and a solid ground pattern is formed on the extended flexible substrate to form the component mounting portion 13. By covering the above, it is possible to realize the shield device 11 which is lightweight and has a thin shape with only the height of the components and which can obtain a sufficient shield effect.

【0016】さらに上述の構成によれば、フレキシブル
基板と一体成形で形成し、折り曲げ加工のみでシールド
装置11を得ることができ、かくして製造工程を格段的
に簡略化し得、また展開すれば部品実装部13を容易に
測定すると共に、部品交換を容易に実行し得るシールド
装置11を実現できる。
Further, according to the above-mentioned structure, the shield device 11 can be obtained by integrally molding with the flexible substrate and only by bending, and thus the manufacturing process can be remarkably simplified, and if it is developed, component mounting can be achieved. It is possible to realize the shield device 11 that can easily measure the portion 13 and easily execute the component replacement.

【0017】なお上述の実施例においては、部品実装部
13の全体を覆いシールドするようにした場合について
述べたが、これに代え図1との対応部分に同一符号を付
した図2に示すように、シールドしたい電子部品12
が、回路基板10の隅部に存在する場合それに応じた形
状で、側壁16A〜16D及び蓋17を形成するように
すれば、上述の実施例と同様の効果を実現できる。
In the above-described embodiment, the case where the whole of the component mounting portion 13 is covered and shielded has been described, but instead of this, as shown in FIG. 2 in which parts corresponding to those in FIG. , The electronic components that you want to shield 12
However, if the side walls 16A to 16D and the lid 17 are formed in a shape corresponding to the corner portion of the circuit board 10 if it exists, the same effect as that of the above-described embodiment can be realized.

【0018】また上述の実施例においては、側壁14A
〜14D及び蓋15をフレキシブル基板で形成し、部品
実装部13の全体を覆う場合について述べたが、これに
代え特にノイズの発生方向が決まつている場合には、そ
の方向についてのみシールドする形状にしても上述の実
施例と同様の効果を実現できる。
Further, in the above-described embodiment, the side wall 14A
14D and the lid 15 are formed of a flexible substrate and cover the entire component mounting portion 13, but instead, in the case where the noise generation direction is determined in particular, a shape that shields only that direction However, the same effect as that of the above-described embodiment can be realized.

【0019】さらに上述の実施例においては、側壁14
A〜14D及び蓋15をべた状のグランドパターンで形
成したが、これに代えメツシユ状のグランドパターンを
用い、全体として軽量化するようにしても良い。
Further, in the above-described embodiment, the side wall 14
Although A to 14D and the lid 15 are formed by the solid ground pattern, a mesh-shaped ground pattern may be used instead of the solid ground pattern to reduce the weight as a whole.

【0020】[0020]

【発明の効果】上述のように本発明によれば、電子部品
が実装されたフレキシブル基板の一部を延長すると共
に、その延長部分のフレキシブル基板に所定のシールド
パターンを形成して、電子部品の実装部を覆うようにし
たことにより、簡易な構成で十分なシールド効果を得る
シールド装置を実現できる。
As described above, according to the present invention, a part of a flexible board on which an electronic component is mounted is extended, and a predetermined shield pattern is formed on the flexible board in the extended portion, so that the electronic component By covering the mounting portion, it is possible to realize a shield device having a simple configuration and a sufficient shield effect.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明によるシールド装置の一実施例を示す略
線図である。
FIG. 1 is a schematic diagram showing an embodiment of a shield device according to the present invention.

【図2】他の実施例によるシールド装置を示す略線図で
ある。
FIG. 2 is a schematic diagram showing a shield device according to another embodiment.

【図3】従来の回路基板のシールド方法の説明に供する
略線図である。
FIG. 3 is a schematic diagram used for explaining a conventional shield method for a circuit board.

【図4】そのシールドボツクスを示す略線的斜視図であ
る。
FIG. 4 is a schematic perspective view showing the shield box.

【符号の説明】[Explanation of symbols]

1、10……回路基板、2、12……電子部品、3……
シールドボツクス、11……シールド装置、14A〜1
4D、16A〜16D……側壁部、15、17……蓋
部。
1, 10 ... Circuit board, 2, 12 ... Electronic parts, 3 ...
Shield box, 11 ... Shield device, 14A-1
4D, 16A to 16D ... Side wall part, 15, 17 ... Lid part.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】所定の電子部品が実装されたフレキシブル
基板でなる回路基板と、 当該回路基板の上記フレキシブル基板の一部を延長し、
当該延長部分の上記フレキシブル基板に所定のシールド
パターンを形成したシールド部材とを具え、上記シール
ド部材で上記回路基板の所望の部分を覆うようにしたこ
とを特徴とするシールド装置。
1. A circuit board comprising a flexible board on which predetermined electronic parts are mounted, and a part of the flexible board of the circuit board is extended.
A shield device, comprising: a shield member having a predetermined shield pattern formed on the flexible substrate of the extension portion, and a desired portion of the circuit board is covered with the shield member.
JP35009093A 1993-12-30 1993-12-30 Shielding apparatus Pending JPH06232585A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP35009093A JPH06232585A (en) 1993-12-30 1993-12-30 Shielding apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35009093A JPH06232585A (en) 1993-12-30 1993-12-30 Shielding apparatus

Publications (1)

Publication Number Publication Date
JPH06232585A true JPH06232585A (en) 1994-08-19

Family

ID=18408171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP35009093A Pending JPH06232585A (en) 1993-12-30 1993-12-30 Shielding apparatus

Country Status (1)

Country Link
JP (1) JPH06232585A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7639513B2 (en) 2004-09-28 2009-12-29 Sharp Kabushiki Kaisha Radio frequency module and manufacturing method thereof
WO2021065459A1 (en) * 2019-09-30 2021-04-08 Agc株式会社 High-frequency shield structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62269399A (en) * 1986-05-19 1987-11-21 松下電器産業株式会社 Shielding device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62269399A (en) * 1986-05-19 1987-11-21 松下電器産業株式会社 Shielding device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7639513B2 (en) 2004-09-28 2009-12-29 Sharp Kabushiki Kaisha Radio frequency module and manufacturing method thereof
WO2021065459A1 (en) * 2019-09-30 2021-04-08 Agc株式会社 High-frequency shield structure

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