JPS62269399A - Shielding device - Google Patents
Shielding deviceInfo
- Publication number
- JPS62269399A JPS62269399A JP11393886A JP11393886A JPS62269399A JP S62269399 A JPS62269399 A JP S62269399A JP 11393886 A JP11393886 A JP 11393886A JP 11393886 A JP11393886 A JP 11393886A JP S62269399 A JPS62269399 A JP S62269399A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- shielding device
- shielding
- protrusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005452 bending Methods 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 description 5
- 230000005684 electric field Effects 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、プリント配線基板上に配置された電気回路部
を他の電界より遮断するシールド装置に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a shielding device for shielding an electric circuit section disposed on a printed wiring board from other electric fields.
従来の技術
従来よりプリント配線基板上に配置された電気回路部を
周囲の電界より遮断するシールド装置としては、スズメ
ッキ鋼板やアルミニウム板を樹脂でコーティングした板
材等により箱状体を形成し、その箱状体でプリント基板
の所定の電気回路部を覆い、かつその箱状体を接地する
ようにしている。Conventional technology Traditionally, shielding devices that isolate electrical circuits arranged on printed wiring boards from surrounding electric fields have been made by forming a box-shaped body from a plate material such as a tin-plated steel plate or an aluminum plate coated with resin. The box-shaped body covers a predetermined electric circuit section of the printed circuit board, and the box-shaped body is grounded.
第３図は従来の電気回路部のシールド装置を示す斜視図
であり、第３図において、１は箱状のシールドケースで
あり、２はプリント基板３上に配置された電子部品であ
る。すなわち、プリント基板３に電子部品２を挿入しノ
・ンダ付けした状態において、シールドを必要とする回
路の電子部品２を箱状のシールドケース１で覆い回路の
グランドであるプリント基板３のパターンにハンダ付け
により固定し、シールドケース１の機械的な固定の電気
的な接続を行なっている。FIG. 3 is a perspective view showing a conventional shielding device for an electric circuit. In FIG. 3, 1 is a box-shaped shielding case, and 2 is an electronic component arranged on a printed circuit board 3. In FIG. That is, with the electronic component 2 inserted into the printed circuit board 3 and soldered, the electronic component 2 of the circuit that requires shielding is covered with a box-shaped shield case 1 and placed in the pattern of the printed circuit board 3, which is the ground of the circuit. The shield case 1 is fixed by soldering, and electrical connections for mechanical fixation of the shield case 1 are performed.
発明が解決しようとする問題点
しかしながら、この構成ではシールドケースとして箱状
体のケースを必要とし、またそのシールドケースをハン
ダ付けによりプリント配線基板に取付ける作業が必要で
あり、さらに補修する場合にはこの半田の接続を取除く
にも手間がかかるものであった。Problems to be Solved by the Invention However, this configuration requires a box-shaped case as a shield case, and also requires work to attach the shield case to a printed wiring board by soldering. It was also time consuming to remove this solder connection.
本発明は、上記問題点に鑑みシールドケースになる導電
層とプリント基板を一体化し、取付は時に特にハンダ付
けを必要としないシールド装置を提供するものである。In view of the above-mentioned problems, the present invention provides a shield device in which a conductive layer serving as a shield case and a printed circuit board are integrated, and installation does not require soldering in particular.
問題点を解決するための手段
この目的を達成するために本発明のシールド装置は、折
り曲げ可能なプリント基板の一部の面の全面に導電層を
形成し、前記プリント基板の他の部分に配置された電子
部品を含む電子回路部を前記プリント基板を折曲げする
ことにより前記導電層で覆うとともに、前記導電層を接
地することにより構成されている。Means for Solving the Problems In order to achieve this object, the shield device of the present invention forms a conductive layer on the entire surface of a part of a bendable printed circuit board, and arranges it on other parts of the printed circuit board. The printed circuit board is bent to cover an electronic circuit section including electronic components, and the conductive layer is grounded.
作用
この構成によれば、プリント基板の１部を折曲げて７−
ルドケースとして代用するため、特にハンダ付けは必要
なく組立てが容易であり、かつ半田付けの必要がないた
めにシールドケースをはずすのも簡単で容易に補修が行
なえるものである。Function: According to this configuration, a part of the printed circuit board is bent and the 7-
Since the shield case can be used as a substitute for a shield case, it is easy to assemble without particularly requiring soldering, and since there is no need for soldering, the shield case can be easily removed and repaired easily.
実施例
以下本発明の一実施例について、図面を参照しながら説
明する。第１図は本発明の一実施例におけるシールド装
置の組立前の状態を示す斜視図、第２図は組立状態を示
す斜視図である。４は折曲げ可能なプリント基板であり
、その上には必要な電子部品６が配置され所定の電気回
路を構成している。４ａ、４ｂ、４ｃは、それぞれ前記
プリント基板４の側縁より突出した状態で一体形成され
た突出部であり、この各突出部ａａ、 ４ｂ、４０には
全面に導電層が形成されるとともに、その導電層の上に
は絶縁層が一面に形成されている。また、前記導電層は
プリント基板４のグランド線と電気的に接続されている
。シールドを施す際には、第２図に示すように前記突出
部４ａ、４ｂ、４ｃをそれぞれ内方に折曲げ前記突出部
４ａ、４ｂ、４ｃにより、シールドの必要な電子部品５
を含む電子回路部を覆うものである。この際、突出部４
ａの端部に形成された保合突起６を対向する突出部４Ｃ
に設けられた切溝部７に係合せしめ、また、突出部４ｂ
Ｖｃ設けられた保合突起８をプリント基板４に形成され
た切溝部９に係合せしめて各突出部４ａ、４ｂ、４ｃが
折曲げ状態を保持するよう６ ・ −
構成されｔいる。EXAMPLE An example of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a state before assembly of a shield device according to an embodiment of the present invention, and FIG. 2 is a perspective view showing an assembled state. Reference numeral 4 denotes a bendable printed circuit board, on which necessary electronic components 6 are arranged to form a predetermined electric circuit. 4a, 4b, and 4c are protrusions that are integrally formed to protrude from the side edges of the printed circuit board 4, respectively, and a conductive layer is formed on the entire surface of each of the protrusions aa, 4b, and 40, and An insulating layer is formed all over the conductive layer. Further, the conductive layer is electrically connected to the ground line of the printed circuit board 4. When applying shielding, as shown in FIG.
It covers the electronic circuit section including the At this time, the protrusion 4
A protrusion 4C facing the retaining protrusion 6 formed at the end of a.
The protrusion 4b is engaged with the cut groove 7 provided in the protrusion 4b.
The retaining protrusion 8 provided with the Vc is engaged with the cut groove 9 formed on the printed circuit board 4 to maintain the bent state of each of the protrusions 4a, 4b, and 4c.
発明の効果
以上のように本発明のシールド装置は、プリント基板と
一体的に作成された突出部、すなわちプリント基板自体
の一部を折曲げすることにより、このプリント基板上の
電子回路を覆うことにより、シールドを行なうものであ
るため、従来のようにプリント基板と別体に箱状のシー
ルドケースを必要とせず、また、その組立も折曲げられ
たプリント基板の一部をその折曲げ状態で保持する程度
の保合手段を必要とするのみで良いものであるため、組
立ておよび補修時の取外し作業も容易になるものである
。Effects of the Invention As described above, the shielding device of the present invention covers the electronic circuit on the printed circuit board by bending a protrusion formed integrally with the printed circuit board, that is, a part of the printed circuit board itself. Since this is a shielding device, there is no need for a separate box-shaped shield case from the printed circuit board as in the past, and the assembly requires only a part of the printed circuit board to be folded in its folded state. Since only a retaining means is required to hold it, assembly and removal work for repair are also facilitated.
第１図は本発明のシールド装置の一実施例の組立前の状
態を示す斜視図、第２図は同シールド装置の組立状態を
示す斜視図、第３図は従来のシールド装置の一例を示す
斜視図である。
４・・・・・・プリント基板、４ａ、４ｂ、４ｃ・・・
・・・突出部、５・・・・・・電子部品、６．８・・・
・・・保合突起、６ ・、−７
７，９・・・・・・切溝部。FIG. 1 is a perspective view showing an embodiment of the shield device of the present invention in an unassembled state, FIG. 2 is a perspective view showing the same shield device in an assembled state, and FIG. 3 is an example of a conventional shield device. FIG. 4...Printed circuit board, 4a, 4b, 4c...
...Protrusion, 5...Electronic component, 6.8...
... Retaining protrusion, 6 ・, -7 7, 9 ... Cut groove part.
Claims (1)
プリント基板の他の部分に配置された電子部品を含む電
子回路部の接地用導電箔と接続された前記電子回路部を
プリント基板を折曲げすることにより前記導電層で覆っ
たことを特徴とするシールド装置。bending the printed circuit board so that the electronic circuit section is connected to the grounding conductive foil of the electronic circuit section including electronic components arranged on the other part of the printed circuit board on the entire surface of one part of the bendable printed circuit board; A shielding device characterized in that the shielding device is covered with the conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11393886A JPS62269399A (en) | 1986-05-19 | 1986-05-19 | Shielding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11393886A JPS62269399A (en) | 1986-05-19 | 1986-05-19 | Shielding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62269399A true JPS62269399A (en) | 1987-11-21 |
Family
ID=14624964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11393886A Pending JPS62269399A (en) | 1986-05-19 | 1986-05-19 | Shielding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62269399A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232585A (en) * | 1993-12-30 | 1994-08-19 | Sony Corp | Shielding apparatus |
| WO2019069935A1 (en) * | 2017-10-06 | 2019-04-11 | シナプティクス・ジャパン合同会社 | Integrated circuit device and electronic equipment |
| JP2019071401A (en) * | 2017-10-06 | 2019-05-09 | シナプティクス・ジャパン合同会社 | Integrated circuit device and electronic device |
-
1986
- 1986-05-19 JP JP11393886A patent/JPS62269399A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06232585A (en) * | 1993-12-30 | 1994-08-19 | Sony Corp | Shielding apparatus |
| WO2019069935A1 (en) * | 2017-10-06 | 2019-04-11 | シナプティクス・ジャパン合同会社 | Integrated circuit device and electronic equipment |
| JP2019071401A (en) * | 2017-10-06 | 2019-05-09 | シナプティクス・ジャパン合同会社 | Integrated circuit device and electronic device |
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