JPH0622993Y2 - トランジスタ放熱器構造 - Google Patents

トランジスタ放熱器構造

Info

Publication number
JPH0622993Y2
JPH0622993Y2 JP1989020790U JP2079089U JPH0622993Y2 JP H0622993 Y2 JPH0622993 Y2 JP H0622993Y2 JP 1989020790 U JP1989020790 U JP 1989020790U JP 2079089 U JP2079089 U JP 2079089U JP H0622993 Y2 JPH0622993 Y2 JP H0622993Y2
Authority
JP
Japan
Prior art keywords
transistor
radiator
terminal
emitter
collector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1989020790U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02113340U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
英司 島田
稔也 古沢
宏 久米
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Onkyo Corp
Original Assignee
Onkyo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Onkyo Corp filed Critical Onkyo Corp
Priority to JP1989020790U priority Critical patent/JPH0622993Y2/ja
Publication of JPH02113340U publication Critical patent/JPH02113340U/ja
Application granted granted Critical
Publication of JPH0622993Y2 publication Critical patent/JPH0622993Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
JP1989020790U 1989-02-23 1989-02-23 トランジスタ放熱器構造 Expired - Lifetime JPH0622993Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989020790U JPH0622993Y2 (ja) 1989-02-23 1989-02-23 トランジスタ放熱器構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989020790U JPH0622993Y2 (ja) 1989-02-23 1989-02-23 トランジスタ放熱器構造

Publications (2)

Publication Number Publication Date
JPH02113340U JPH02113340U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-09-11
JPH0622993Y2 true JPH0622993Y2 (ja) 1994-06-15

Family

ID=31237452

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989020790U Expired - Lifetime JPH0622993Y2 (ja) 1989-02-23 1989-02-23 トランジスタ放熱器構造

Country Status (1)

Country Link
JP (1) JPH0622993Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0817551B2 (ja) * 1993-02-09 1996-02-21 超電導発電関連機器・材料技術研究組合 超電導回転電機の固定子

Also Published As

Publication number Publication date
JPH02113340U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-09-11

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