JPH06224260A - Method for partially plating tab tape, jig used for partial plating and manufacture of jig used for partial plating - Google Patents

Abstract

PURPOSE:To deal with the needs of very fine and high accurate circuit patterns and also perform electrical inspection for every lead in the succeeding inspection processes by forming a solder film for connecting the outer lead part of a tab tape to the predetermined place of a printed substrate with necessary and sufficient film thickness only on the necessary place of the outer lead part. CONSTITUTION:For a tab tape 1 is used one in which the backward end of each outer lead part 4 is separated from that of the adjacent one and a part to be supplied with electric power is formed in a slightly large width, and for a fixture used for partial plating to hold the tab tape 1 therebetween is one in which a very fine and continuous line-like electric supplying pattern part 6 abuttable to the part to be supplied with electric power of each outer lead part is formed in the upper surface of a receiving member 2 or the bottom surface of a pressing-down member, and the place to need plating of the outer lead part is partially solder-electroplated with a jet of solder plating liquid from the opening 7 used for plating of the receiving member 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to a tab (TAB = Tape Automated) used in a tape carrier system.
Bonding, tape automatic bonding) A method of partially plating solder or tin (hereinafter simply referred to as solder) for bonding to a predetermined portion of a printed circuit board on the outer lead part of the tape, and for partial plating used in the implementation of the method The present invention relates to a jig and a method for manufacturing the jig.

[0002]

2. Description of the Related Art A tape carrier method for mounting elements such as ICs using a tab tape is characterized by widespread applicability and easy automation, and is increasingly used in recent years to meet the demand for tab tapes. It tends to increase further. The tab tape is generally made of a polyimide resin film base material with sprocket wheels on both sides, and a circuit pattern of many leads is formed of copper foil on the tape. The inner lead portion to be joined to the element is formed to project, and the outer lead portion to be joined to the printed board is formed to project to the outer lead hole.

The outer lead portion of the tab tape is
It is necessary to form a solder film for bonding on the rear end portion of the outer lead portion in order to bond the solder film to a predetermined place on the printed circuit board. Means are taken.

(A) A cream solder is printed on a predetermined portion of the outer lead portion (or printed circuit board) of the tab tape by a printing machine and then reflowed to form a solder film. B) A solder film is formed by chemical plating on the entire circuit pattern including the outer lead portion of the tab tape. C) A solder film is formed by electroplating on the entire circuit pattern including the outer lead portion of the tab tape.

D) A solder film is partially formed by electroplating on a portion of the outer lead portion of the tab tape where the solder film is required. As shown in FIG. 7, this is the one in which the outer lead portions 4a of the tab tape 1a are still connected (see FIG. 7), and the unnecessary portions of the solder film are covered with resist or Shinkon rubber and electroplated. Is.

[0006]

However, the above-mentioned conventional means have the following problems. In the case where cream-like solder is printed on the outer lead part of the above b) with a printing machine, the tape for tabs these days makes the circuit pattern finer.
In spite of higher precision, the printing technology is not yet in a situation where it is possible to produce a satisfactory fine and highly precise plate. The solder or flux of the cream-like solder leaks between the fine outer lead parts, which may cause a touch or bridge of the leads.

Further, although it is necessary to wash and remove the rosin from the flux, the use of a washing solvent such as Freon or a chlorine-based solvent is prohibited as a causative agent of the global environment deterioration such as ozone layer destruction. There is a direction.

Further, since the particle diameter of the solder powder of the cream-like solder is still about 10 μm, it is difficult to form a uniform thickness with a printing thickness of 10 μm or less.

In the case where the solder film is formed by the chemical plating of the above (2), the plating adheres to the entire surface of the circuit pattern including the outer lead portions, so that the solder plating also adheres to unnecessary portions of the solder film.

Further, in the case of using the displacement plating type as the chemical plating liquid, uniform solder plating adheres to the entire surface,
Since the plating film thickness is only about 1 μm, it is not useful as a solder film for joining outer lead parts.

Further, in the case of using the reducing agent type as the chemical plating solution, the plating film thickness can be set to 10 μm or more, but the deposition amount changes depending on the change in the bath water reducing agent or metal concentration, the immersion time, and the like. Therefore, adjustment is difficult, and it is not easy to obtain a solder plating having a uniform film thickness. Moreover, if the required plating film thickness is secured in the solder film required portion of the outer lead part, the plating film thickness at the tip of the inner lead part becomes too thick, and the leads are likely to be touched, causing a leak. .

In the case where the solder film is formed by the electroplating (c), the solder plating is electrodeposited not only on the solder film required portion 11a of the outer lead portion 4a but also on the entire surface of the circuit pattern as in the case of the chemical plating. However, solder plating is also formed on unnecessary portions of the solder film.

When the required plating film thickness is secured in the solder film required portion 11a of the outer lead portion 4a, the inner lead portion 1 is formed as in the case of the chemical plating.
Since the plating film thickness at the tip of 9a becomes too thick, the touch of the lead is likely to occur.

In the above-described method 2) in which the solder film is partially formed by electroplating, electroplating is performed in a state where the outer lead portions are connected, so that there is no leak or disconnection in the circuit pattern in the subsequent inspection process. When inspecting, it is impossible to perform electrical inspection for each lead as it is,
There is no choice but to use optical inspection. When conducting an electrical inspection, it is necessary to cut each outer lead portion with a press or the like after the plating and before the inspection.

According to the present invention, a means for forming a solder film for bonding to a printed circuit board on the outer lead portion of the tab tape,
In particular, the present invention solves the above-mentioned problems of the related art with respect to a means for forming a solder film for joining by electroplating.

That is, an object of the present invention is to form a solder film for joining tab tapes to one that is compatible with miniaturization and high precision of circuit patterns, and to form the solder film for joining on the outer lead portion. A partial plating method that can be formed only in a required place and can form the solder film in a required and uniform thickness,
The present invention provides a jig for partial plating used in the implementation of the method, and a method for manufacturing the jig for partial plating described above by a simple means.

[0017]

A method of partially plating a tab tape according to the present invention is such that a rear end portion of each outer lead portion 4 of the tab tape 1 is separated from an adjacent one and has a lateral width. It is formed on the power-supplied part 5 which is slightly larger (see FIGS. 2, 3 and 5),

The tab tape 1 can be brought into contact with the power-supplied portion 5 of each outer lead portion 4, and both the receiving member 2 or the pressing member 3 having the power feeding pattern portion 6 having a continuous shape in a thin line shape. By sandwiching it between the members 2 and 3 (see FIG. 6),

A plating solution 8 is jetted from the plating opening 7 corresponding to the plating required portion 11 of each outer lead portion 4 formed on the receiving member 2 so that the plating required portion 11 of each outer lead portion 4 is ejected. Partial plating of solder is applied (see FIG. 6).

B. The jig for partial plating on the tab tape according to the present invention is capable of mounting the tab tape 1 and having a plating opening 7 corresponding to a required plating portion of each outer lead portion 4. A member 2 and a holding member 3 capable of sealing the tab tape 1 from above (see FIG. 6),

An abutting surface of the receiving member 2 or the pressing member 3 to the tab tape 1 is adjacent to the rear end portion of each outer lead portion 4 corresponding to each of the plurality of patterns of the tab tape 1. The thin and continuous power feeding pattern portion 6 is formed so as to be able to come into contact with the power fed portion 5 which is separated and independent (see FIGS. 1, 4, and 6).

C In the method of manufacturing a jig for partial plating on a tab tape according to the present invention, the tab tape 1 can be placed and the upper surface of the receiving member 2 having the plating opening 7 or the sealing plate. Attach a conductive thin plate to the lower surface of the pressing member 3 having 9

Next, corresponding to each pattern of the tab tape 1, the power-supplied portion 5 at the rear end portion of each outer lead portion 4 is provided.
With a pattern that can be contacted with, apply a chemical resistant resist in a continuous thin line,

Next, the feeding pattern portion 6 is formed by removing the portion other than the portion coated with the resist by etching to dissolve and remove the resist.

In the above structure, the feeding pattern portion 6 formed on the receiving member 2 or the pressing member 3 is a cathode,
The anode 12 is provided in the plating opening 7 of the receiving member 2. The material of the power supply pattern portion 6 may be a metal having chemical resistance to the plating liquid 8. The width and the thickness are such that the electric current necessary for electroplating can be secured and the seal during partial plating is not adversely affected.

Further, an auxiliary power feeding pattern portion 13 may be further formed inside the power feeding pattern portion 6 without being connected to the power feeding pattern portion 6 (see FIG. 4).

In the figure, 9 is a sealing plate on the lower surface of the pressing member 3, 10 is a pattern mask portion on the upper surface of the receiving member 2, and 14 is a pattern mask portion.
Indicates an external power feeding section to the power feeding pattern section 6.

[0028]

Next, the function of the present invention will be described. In the method for partially plating a tab tape according to the present invention, the tab tape 1 is such that the rear end portion of each outer lead portion 4 is independent of the adjacent tape tape and has a slightly large width. The one formed on the portion 5 is used (see FIGS. 2, 3, and 5).

An outer lead portion 4 of the tab tape 1 has a feeding pattern portion 6 of a receiving member 2 or a pressing member 3.
And is clamped between the receiving member 2 and the pressing member 3 so that the plating process is performed. (In the illustrated embodiment, the tab tape 1 is placed on the receiving member 2 with its lead surface facing downward, and its upper surface is pressed by the pressing member 3 to be sandwiched).

On the upper surface of the receiving member 2 or the lower surface of the pressing member 3, there is formed a feeding pattern portion 6 which can be brought into contact with the fed portion 5 of each outer lead portion 4 in a continuous shape in a thin line shape. Therefore, each outer lead portion 4 of the tab tape 1 is brought into contact with the power feeding pattern portion 6 independently at each power fed portion 5.

Therefore, when the plating solution 8 is jetted from the plating opening 7 of the receiving member 2 and is energized, the power feeding pattern portion 6 having a continuous thin wire is fed to each power feeding portion of each outer lead portion 4. 5 to receive the plating solution 8 from the plating opening 7 and receive the outer lead 4
The solder plating is electrodeposited on the plating required portion 11 (see FIG. 6).

In the above case, in the tab tape 1 used in the present invention, the rear end portion of each outer lead portion 4 is formed on the power-supplied portion 5 having a slightly larger lateral width.
Therefore, the contact between the power supply pattern portion 6 and the power supply pattern portion 6 is surely performed, the power supply is favorably performed, and the electrodeposition efficiency of the solder plating is improved.

Further, if the auxiliary power feeding pattern portion 13 is formed inside the power feeding pattern portion 6, the outer lead portion 4 is temporarily deformed partially, and the power-supplied portion 5 thereof is the power feeding pattern portion of the jig. Even when it does not contact with 6, the power is supplied from the adjacent outer lead portion 4 via the auxiliary power supply pattern portion 13, so that the power is reliably supplied.

Therefore, if the solder is partially electroplated according to the present invention, unlike the conventional one, it is possible to cope with the miniaturization and high accuracy of the circuit pattern of the tab tape 1, and the plating required portion 11 is not too thin and thick. Solder plating is formed with a necessary film thickness that is not too much, no touch or bridge of leads occurs, and the solder plating film thickness can be easily adjusted.

The formation of the power supply pattern portion 6 of the jig for partial plating used above is performed by applying a chemical resistant resist,
Since the etching process may be performed, the power feeding pattern portion 6
Are easily and accurately formed.

In each outer lead portion 4 of the tab tape 1 with which the power feeding pattern 6 is in contact, the fed portion 5 at the rear end portion is formed so as to be separated from and adjacent to the adjacent one and have a slightly larger lateral width. There is. Therefore, even in the inspection after plating or the inspection after mounting the IC or the like, by contacting the terminals of the electrical inspection device to the power-supplied portion 5 of each outer lead portion 4, it is possible to determine whether each circuit pattern is good or bad. Is determined,
At that time, the contact of the terminals can be surely made, so that the reliability of the inspection is improved.

[0037]

EXAMPLES FIGS. 2, 3 and 5 show a part of a tab tape 1 used for carrying out a partial plating method according to the present invention.

In the same manner as the conventional tape 1 for tabs, a circuit pattern composed of a large number of leads is formed of copper foil on a polyimide resin film substrate 15 having sprocket wheels 16 on both sides. The inner lead portion 19 is joined to an element such as an IC, and the outer lead portion 4 is joined to a circuit of a printed circuit board.

The tab tape 1 used in the present invention is different from the conventional one in that the rear end portions of the outer lead portions 4 thereof are separated from each other and have a disc shape so that the lateral width thereof is slightly larger than that of the lead portions. That is, the power-supplied portion 5 having the heads arranged in a staggered manner is formed (see FIGS. 2 and 3 and 5).

When the tab tape 1 is sandwiched by a jig for partial plating, which will be described later, the power-supplied portion 5 of the outer lead portion 4 has a power feeding pattern portion 6 formed on the jig for partial plating.
It is placed on the receiving member 2 so as to abut. In the illustrated example, since the power-supplied portion 5 is formed on the upper surface of the receiving member 2, the receiving surface of the receiving member 2 is set downward as shown in FIG.
It is clamped between the holding member 3 and.

1 and 4 show a receiving member 2 which is one of the jigs for partial plating according to the present invention. The receiving member 2
On the upper surface of the receiving member main body, a pattern mask portion 10 made of silicon rubber is attached, and the mask portion 20 has a plating opening 7 corresponding to a required plating portion 11 of the outer lead portion 4.
Has the same pattern hole as. And the pattern mask section 1
On the upper surface of 0, a feeding pattern portion 6 having a thin line and continuous shape is formed as a cathode so as to be capable of contacting the fed portion 5 of each outer lead portion 4 of the tab tape 1.

In particular, FIG. 4 shows a structure in which the auxiliary power feeding pattern portion 13 is additionally formed, and the auxiliary power feeding pattern portion 13 is formed by the same means inside the power feeding pattern portion 6 formed on the upper surface of the receiving member 2. It is a thing. The auxiliary power feeding pattern portion 13 may be connected to the power feeding pattern portion 6,
It may not be connected to the power feeding pattern portion 6 as in the illustrated example.

In the formation of the power feeding pattern portion 6, a conductive thin plate is attached over the entire surface of the pattern mask portion 10, and the rear end of each outer lead portion 4 corresponding to each circuit pattern of the tab tape 1. It may be formed by applying a chemically resistant resist in a continuous thin line shape having a shape capable of abutting to the power-supplied portion 5 in a portion thereof, and then performing etching treatment to dissolve and remove the portion other than the resist.

The width and thickness of the power feeding pattern portion 6 are set so that the current required for electroplating can be secured and the sealing of partial plating is not adversely affected. The material may be any metal that is chemically resistant to the plating liquid 8, such as stainless steel, Cu plated with Ni, or Cu plated with Au.
A plated product, a platinum foil or the like may be used. Although it is formed on the receiving member 2 side in the above embodiment, it may be formed on the pressing member 3 side. Also, a similar power supply pattern portion 6 can be formed by attaching a thin wire such as stainless steel to the upper surface of the receiving member 2 or the lower surface of the pressing member 3.

In the figure, 17 is a plating solution supply hole formed inside the receiving member 2, and 18 is a plating solution reflux hole.

[0046]

As described above, according to the present invention, solder plating for joining can be formed only at a necessary portion of the outer lead portion in response to miniaturization and high precision of the circuit pattern of the tab tape, and The thickness of the solder plating can be formed to a required and uniform thickness, and an electrical inspection can be performed for each lead in a subsequent inspection process.

That is, when the solder film is formed on the outer lead portion of the tab tape by the conventional means, it is not possible to cope with the miniaturization and high precision of the circuit pattern, and the solder film is attached even to unnecessary portions. When the film thickness could not be secured, and when the film thickness required for the outer lead part was reached, the touch of the lead occurred on the inner lead part. Further, since electroplating is performed in a state where the outer lead portions are continuous, the electrical inspection cannot be performed for each lead in the subsequent inspection process, and the optical inspection cannot but be performed.

On the other hand, in the method of partially plating the tab tape according to the present invention, as the tab tape, the rear end portions of the outer lead portions are separated from the adjacent ones and have a slightly larger width. Using what is formed in the power supply section,
Further, as the plating jig, there is used one in which a power feeding pattern portion which can be brought into contact with a power fed portion of each outer lead portion is formed on the upper surface of the receiving member or the lower surface of the pressing member in a continuous shape in a thin line shape.

Therefore, each outer lead portion of the tab tape can be partially solder-plated only at the plating-required portion while receiving power from each power-supplied portion independently of the power-supply pattern portion. . Further, since the portion to be fed at the rear end portion of the outer lead portion is formed to have a slightly larger width, the contact with the feeding pattern portion is ensured and the feeding is good, so that the electrodeposition of the solder plating can be efficiently performed. You can do it well. Furthermore, since it is electrical partial plating, the thickness of the solder plating can be easily adjusted, and the solder plating with a sufficient thickness can be formed on the outer lead portion, and the circuit pattern of the tab tape can be made fine and high. It is possible to correspond to the accuracy and it is possible to eliminate the touch of the lead and the occurrence of leakage.

Further, if the auxiliary power feeding pattern portion is formed inside the power feeding pattern portion with or without being connected to the power feeding pattern portion, it is assumed that a part of the outer lead portion is deformed and the portion to be fed with power. Even if the power feeding pattern does not contact with the power feeding pattern, the auxiliary power feeding pattern portion can feed power from the adjacent outer lead portion, so that power can be fed more reliably.

The method for manufacturing a jig for partial plating according to the present invention also includes forming a power supply pattern on the receiving member or the pressing member,
Can be done accurately, easily and quickly.

In the tab tape solder-plated according to the present invention, the power-supplied portion at the rear end portion of each outer lead portion has a slightly larger width and is independent of the adjacent one. Therefore, in the inspection after plating or the inspection after mounting elements such as IC, if the terminals of the inspection device are brought into contact with the power-supplied portion of each outer lead portion, the quality of each circuit pattern can be reliably determined. it can.

[Brief description of drawings]

FIG. 1 is a vertical cross-sectional perspective view of a part of a jig for partial plating used in a method for partially plating a tab tape according to the present invention.

FIG. 2 is an enlarged plan view of a part of the tab tape used in the method of partially plating the tab tape according to the present invention.

3 is a partially enlarged plan view of the tab tape shown in FIG. 2. FIG.

FIG. 4 is a vertical cross-sectional view of a part of another embodiment of the jig for partial plating used in the method for partially plating the tab tape according to the present invention.

FIG. 5 is a partially enlarged plan view of a tab tape used for partial plating with the partial plating jig shown in FIG.

FIG. 6 is a partially enlarged vertical side view showing a partial plating method for tab tape according to the present invention using the partial plating jig shown in FIG.

FIG. 7 is a partially enlarged plan view of a conventional tab tape.

[Explanation of symbols]

1-Tab Tape 2-Receiving Member 3-Holding Member 4-Outer Lead Part 5-Powered Part 6-Power Supply Pattern Part 7-Plating Opening 8-Plating Liquid 9-Seal Plate 10-Pattern Mask Part 11 -A required plating area 12-Anode 13-Auxiliary power supply pattern 14-External power supply section 15-Film base material 16-Sprocket hole 17-Plating solution supply hole 18-Plating solution circulation hole 19-Inner lead section

Claims (3)

[Claims] 1. A rear end portion of each outer lead portion 4 of a tab tape 1 is formed on a power-supplied portion 5 which is separated and independent from an adjacent one and has a slightly larger lateral width. , The outer lead portion 4 can be contacted with the power-supplied portion 5 and is sandwiched between the receiving member 2 or the pressing member 3 having the feeding pattern portion 6 having a continuous shape in a thin line shape. The plating solution 8 is jetted from the plating opening 7 corresponding to the required plating portion 11 of each outer lead portion 4 formed on the receiving member 2 to form each outer lead portion 4
Partial plating method for tab tape, characterized in that solder is partially plated on the required plating part 11. 2. A receiving member 2 on which a tab tape 1 can be placed and which has a plating opening 7 corresponding to a required plating portion 11 of each outer lead portion 4, and a presser for sealing the tab tape 1 from above. The member 3 and the contact surface of the receiving member 2 or the pressing member 3 to the tab tape 1 at the rear end portion of each outer lead portion 4 corresponding to each pattern of the tab tape 1. A jig for partial plating on a tape for tabs, characterized in that a feeding pattern portion 6 having a thin and continuous shape is formed so as to be capable of contacting a fed portion 5 which is separated and independent from an adjacent one. 3. A conductive thin plate is attached over the entire surface to either the upper surface of the receiving member 2 for sandwiching the tab tape 1 or the lower surface of the pressing member 3, and then each pattern of the tab tape 1 is applied. Then, a chemical resistant resist is applied in a continuous thin line in a pattern capable of contacting the power-supplied portion 5 at the rear end of each outer lead portion 4, and then the resist-applied portion is subjected to an etching treatment. A method for manufacturing a jig for partial plating on a tab tape, characterized in that the resist is peeled off to form the power supply pattern portion 6 after the other parts are dissolved and removed.